Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

2000 ◽  
Author(s):  
Nicoletta Sangalli ◽  
Donald B. Barker
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Metal Substrate ◽  
Design Guidelines ◽  
Element Analysis ◽  
Dielectric Thickness ◽  
Component Size ◽  
Board Material ◽  
Temperature Ranges

Abstract Aluminum insulated metal substrate (IMS) is often used as an alternative to FR-4 to enhance heat dissipation in high power applications. Although IMS offers better heat dissipation, the solder joint life of leadless chip resistors and chip capacitors under thermal cycling can decrease. This is due to the higher mismatch of the coefficient of thermal expansion between the ceramic based components and the aluminum board. This paper has two main objectives. One is to investigate the sensitivity of solder joint life of ceramic chip capacitor and chip resistor mounted on IMS to variations in dielectric thickness, board material, and solder thickness on. This sensitivity analysis is conducted with finite element analysis (FEA) simulation. The other objective is to determine the solder joint life for different resistor sizes at different temperature ranges with FEA modeling and experiment data. These results are presented in terms of design guidelines to be used in the selection of component size, board material, and temperature ranges, given an expected solder joint life.

scholarly journals Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

2019 ◽  
pp. 1-6
Author(s):  
Jefferson Talledo
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Mold Material ◽  
Element Analysis ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Thermomechanical Simulation ◽  
Board Level

Leadframe-based packages are commonly used for semiconductor power devices. With these packages, heat dissipation is much better compared with laminate substrated-based packages. However, the solder joint reliability requirement under thermal cycling condition is also higher and this is what makes the development of a power package challenging. One of the usual requirements from customers is that there should be no solder joint failure up to 2,000 thermal cycles. This paper presents the thermomechanical simulation of a power leadframe package that was conducted to improve its solder joint reliability. Board level solder joint cycle life was predicted using finite element analysis and the result was validated with actual solder life result from board level reliability evaluation. Since available solder prediction equation was for the characteristic life (63.2% accumulative failure), using the normalized characteristic life was implemented for predicting the number of cycles to first failure of the solder joint connection and the approach showed good agreement with the actual result. Results also indicated that the choice of epoxy mold material and the type of PCB (printed circuit board) have a significant contribution to the solder joint reliability performance.

Board Level Reliability Enhancement for A Double-bump Wafer Level Chip Scale Package

2004 ◽  
Vol 1 (2) ◽  
pp. 64-71 ◽  
Author(s):  
Xiaowu Zhang ◽  
E. H. Wong ◽  
Mahadevan K. Iyer
Keyword(s):  
Solder Joint ◽  
Design Guidelines ◽  
Wafer Level ◽  
Element Analysis ◽  
Chip Scale Package ◽  
Form Design ◽  
Parametric Studies ◽  
Reliability Enhancement ◽  
Board Level ◽  
Board Level Reliability

This paper presents a nonlinear finite element analysis on board level solder joint reliability enhancement of a double-bump wafer level chip scale package (CSP). A viscoplastic constitutive relation is adopted for the solders to account for its time and temperature dependence in thermal cycling. The fatigue life of solder joint is estimated by the modified Coffin-Manson equation, which has been verified by experimental results using one of the double-bump wafer level CSP packages as the test vehicle. A series of parametric studies were performed by changing the Sn/Ag inner bump size (UBM pad size and standoff height), the eutectic Sn/Pb external solder joint size (pad size and standoff height), pitch, die thickness, and the encapsulant thickness. The results obtained from the modeling are useful to form design guidelines for board level reliability enhancement of the wafer level CSP packages.

Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

2013 ◽  
Vol 135 (4) ◽  
Author(s):  
Yi Yan ◽  
Youliang Guan ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Heat Dissipation ◽  
Continuous Wave ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Layer ◽  
Element Analysis ◽  
Thermomechanical Stress ◽  
Fea Model ◽  
Sintered Silver

The thermal and the optoelectronic performance of high power gallium arsenide (GaAs) laser diode die-attached with sintered silver joint were investigated. The thermal and mechanical characteristics of the Laser bar packaging were simulated by finite element analysis (FEA). On the basis of prior experimental observations, voids in the bonding layer were intentionally introduced in the FEA model to examine their effect on the laser diode operating in the continuous-wave (CW) mode under different drive currents. The simulation results indicate that the quality of the bonding layer is very important to the heat dissipation capability of the packaging. Any void in the die-attach material would become a hotspot and thus deteriorate the optoelectronic performance of the laser diode. In addition, because of the coefficient of thermal expansion (CTE) mismatch between the laser bar and the copper heat sink, the interfacial thermomechanical stress will cause a noticeable curvature of the laser diode and a blueshift in the wavelength.

Heat Sink Induced Thermo-Mechanical Joint Strain in QFN Devices

2013 ◽  
Vol 2013 (1) ◽  
pp. 000467-000472
Author(s):  
Gerard McVicker ◽  
Vijay Khanna ◽  
Sri M. Sri-Jayantha
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Power Distribution ◽  
Strain Energy ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Inelastic Strain ◽  
Temperature Cycling ◽  
Image Correlation ◽  
Solder Joint Fatigue

A Blade Server System (BSS) utilizes Voltage Regulator Modules (VRM), in the form of Quad Flat No-Lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRM's can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, during field conditions (FC) the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 25°C and 80°C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled to the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (Finite Element Model) of four QFN's mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint, due to the cyclical straining, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. While the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (Digital Image Correlation) measurements of heat sink lateral slip, are presented.

Heat Sink Induced Thermomechanical Joint Strain in QFN Devices

2014 ◽  
Vol 11 (2) ◽  
pp. 80-86
Author(s):  
Gerard McVicker ◽  
Vijay Khanna ◽  
M. Sri-Jayantha
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Power Distribution ◽  
Strain Energy ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Inelastic Strain ◽  
Temperature Cycling ◽  
Image Correlation ◽  
Solder Joint Fatigue

A blade server system (BSS) utilizes voltage regulator modules (VRMs), in the form of quad flat no-lead (QFN) devices, to provide power distribution to various components on the system board. Depending on the power requirements of the circuit, these VRMs can be mounted as single devices or banked together. In addition, the power density of the VRM can be high enough to warrant heat dissipation through the use of a heat sink. Typically, at field conditions (FCs), the BSS are powered on and off up to four times per day, with their ambient temperature cycling between 25°C and 80°C. This cyclical temperature gradient drives inelastic strain in the solder joints due to the coefficient of thermal expansion (CTE) mismatch between the QFN and the circuit card. In addition, the heat sink, coupled with the QFN and the circuit card, can induce additional inelastic solder joint strain, resulting in early solder joint fatigue failure. To understand the effect of the heat sink mounting, a FEM (finite element model) of four QFNs mounted to a BSS circuit card was developed. The model was exercised to calculate the maximum strain energy in a critical joint due to cyclic strain, and the results were compared for a QFN with and without a heat sink. It was determined that the presence of the heat sink did contribute to higher strain energy and therefore could lead to earlier joint failure. Although the presence of the heat sink is required, careful design of the mounting should be employed to provide lateral slip, essentially decoupling the heat sink from the QFN joint strain. Details of the modeling and results, along with DIC (digital image correlation) measurements of heat sink lateral slip, are presented.

DESIGN AND THERMAL ANALYSIS OF BRAKE ROTOR WITH DIFFERENT MATERIALS

2020 ◽  
Vol 15 (2) ◽  
Author(s):  
Sugunarani S ◽  
Santhosh V
Keyword(s):  
Temperature Distribution ◽  
Heat Dissipation ◽  
Brake Disc ◽  
Element Analysis ◽  
Analysis Techniques ◽  
Engineering Software ◽  
The Finite Element Analysis ◽  
Brake Rotor ◽  
Grey Cast ◽  
Aluminium Metal

This work deals with the analysis of heat generation and dissipation in the disc brake of a car during braking and the following release period by using computer-aided engineering software for three different materials of the rotor disc and brake pad. The objective of this work is to analyze the temperature distribution of rotor disc during operation using COMSOL Multiphysics. The work uses the finite element analysis techniques to calculate and predict the temperature distribution on the brake disc and to identify the critical temperature of the brake rotor disc. Conduction, convection and radiation of heat transfer have been analyzed. The results obtained from the analysis indicates that different material on the same retardation of the car during braking shows different temperature distribution. A comparative study was made between grey cast iron (GCI), Aluminium Metal Matrix Composite (AMMC), Alloy steel materials are used for brake disc and the best material for making brake disc based on the rate of heat dissipation have been suggested.

scholarly journals Development of Simulation Based p-Multipliers for Laterally Loaded Pile Groups in Granular Soil Using 3D Nonlinear Finite Element Model

2020 ◽  
Vol 11 (1) ◽  
pp. 26
Author(s):  
Muhammad Bilal Adeel ◽  
Muhammad Asad Jan ◽  
Muhammad Aaqib ◽  
Duhee Park
Keyword(s):  
Finite Element ◽  
Element Model ◽  
Design Guidelines ◽  
American Petroleum Institute ◽  
Winkler Foundation ◽  
Group Effect ◽  
Pile Groups ◽  
Element Analysis ◽  
Laterally Loaded Pile ◽  
Laterally Loaded

The behavior of laterally loaded pile groups is usually accessed by beam-on-nonlinear-Winkler-foundation (BNWF) approach employing various forms of empirically derived p-y curves and p-multipliers. Averaged p-multiplier for a particular pile group is termed as the group effect parameter. In practice, the p-y curve presented by the American Petroleum Institute (API) is most often utilized for piles in granular soils, although its shortcomings are recognized. In this study, we performed 3D finite element analysis to develop p-multipliers and group effect parameters for 3 × 3 to 5 × 5 vertically squared pile groups. The effect of the ratio of spacing to pile diameter (S/D), number of group piles, varying friction angle (φ), and pile fixity conditions on p-multipliers and group effect parameters are evaluated and quantified. Based on the simulation outcomes, a new functional form to calculate p-multipliers is proposed for pile groups. Extensive comparisons with the experimental measurements reveal that the calculated p-multipliers and group effect parameters are within the recorded range. Comparisons with two design guidelines which do not account for the pile fixity condition demonstrate that they overestimate the p-multipliers for fixed-head condition.

Study on High Reliability of Lead-Free Solder Joint on Metal Substrate

2011 ◽  
Author(s):  
Kanji Takagi ◽  
Masaki Wakabayashi ◽  
Junichi Inoue ◽  
Qiang Yu ◽  
Takahiro Akutsu
Keyword(s):  
Thermal Conductivity ◽  
Solder Joint ◽  
Rupture Life ◽  
Metal Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Insulating Layer ◽  
Heating Device ◽  
Propagation Analysis ◽  
Free Solder

This paper proposes the high reliable design method for lead-free solder joint on metal substrate on chip component. First, the crack propagation analysis method for estimating rupture life of solder joint was constructed. And then, the effect of material properties of insulating layer on metal substrate and solder joint shape for rupture life of solder joint was evaluated using crack propagation analysis. As the result, the relation between young’s modulus of insulating layer and rupture life was indicated quantitatively. Also, the relation of filet length for rupture life of solder joint was evaluated. Secondary, evaluation method of heat dissipation for metal substrate was proposed. Because thermal conductivity of insulating layer affects temperature rise of heating device. And, the relation between thermal conductivity of insulating layer and temperature rise of heating device was indicated.

Role of Out-of-Plane Coefficient of Thermal Expansion in Electronic Packaging Modeling

1999 ◽  
Vol 122 (2) ◽  
pp. 121-127 ◽  
Author(s):  
Manjula N. Variyam ◽  
Weidong Xie ◽  
Suresh K. Sitaraman
Keyword(s):  
Thermal Expansion ◽  
Electronic Packaging ◽  
Thermal Loading ◽  
Coefficient Of Thermal Expansion ◽  
Plane Deformation ◽  
Three Dimensional ◽  
Dissimilar Materials ◽  
3D Models ◽  
Material Behavior ◽  
Element Analysis

Components in electronic packaging structures are of different dimensions and are made of dissimilar materials that typically have time, temperature, and direction-dependent thermo-mechanical properties. Due to the complexity in geometry, material behavior, and thermal loading patterns, finite-element analysis (FEA) is often used to study the thermo-mechanical behavior of electronic packaging structures. For computational reasons, researchers often use two-dimensional (2D) models instead of three-dimensional (3D) models. Although 2D models are computationally efficient, they could provide misleading results, particularly under thermal loading. The focus of this paper is to compare the results from various 2D, 3D, and generalized plane-deformation strip models and recommend a suitable modeling procedure. Particular emphasis is placed to understand how the third-direction coefficient of thermal expansion (CTE) influences the warpage and the stress results predicted by 2D models under thermal loading. It is seen that the generalized plane-deformation strip models are the best compromise between the 2D and 3D models. Suitable analytical formulations have also been developed to corroborate the findings from the study. [S1043-7398(00)01402-X]

Sign in / Sign up

Export Citation Format

Share Document