Effects of Voids in Sintered Silver Joint on Thermal and Optoelectronic Performances of High Power Laser Diode

2013 ◽  
Vol 135 (4) ◽  
Author(s):  
Yi Yan ◽  
Youliang Guan ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Heat Dissipation ◽  
Continuous Wave ◽  
Coefficient Of Thermal Expansion ◽  
Bonding Layer ◽  
Element Analysis ◽  
Thermomechanical Stress ◽  
Fea Model ◽  
Sintered Silver

The thermal and the optoelectronic performance of high power gallium arsenide (GaAs) laser diode die-attached with sintered silver joint were investigated. The thermal and mechanical characteristics of the Laser bar packaging were simulated by finite element analysis (FEA). On the basis of prior experimental observations, voids in the bonding layer were intentionally introduced in the FEA model to examine their effect on the laser diode operating in the continuous-wave (CW) mode under different drive currents. The simulation results indicate that the quality of the bonding layer is very important to the heat dissipation capability of the packaging. Any void in the die-attach material would become a hotspot and thus deteriorate the optoelectronic performance of the laser diode. In addition, because of the coefficient of thermal expansion (CTE) mismatch between the laser bar and the copper heat sink, the interfacial thermomechanical stress will cause a noticeable curvature of the laser diode and a blueshift in the wavelength.

High power continuous-wave operation of 630 nm-band laser diode arrays

1998 ◽  
Vol 34 (24) ◽  
pp. 2336 ◽  
Author(s):  
J.S. Osinski ◽  
Bo Lu ◽  
H. Zhao ◽  
B. Schmitt
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Continuous Wave ◽  
Continuous Wave Operation ◽  
Laser Diode Arrays

High power, high efficiency continuous-wave 808 nm laser diode arrays

2017 ◽  
Vol 97 ◽  
pp. 297-301 ◽  
Author(s):  
Zhenfu Wang ◽  
Te Li ◽  
Guowen Yang ◽  
Yunfei Song
Keyword(s):  
Laser Diode ◽  
High Power ◽  
High Efficiency ◽  
Continuous Wave ◽  
Laser Diode Arrays

The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

High‐power continuous wave 690 nm AlGaInP laser‐diode arrays

1995 ◽  
Vol 66 (10) ◽  
pp. 1163-1165 ◽  
Author(s):  
J. A. Skidmore ◽  
M. A. Emanuel ◽  
R. J. Beach ◽  
W. J. Benett ◽  
B. L. Freitas ◽  
...  
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Continuous Wave ◽  
Laser Diode Arrays

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

2000 ◽  
Author(s):  
Nicoletta Sangalli ◽  
Donald B. Barker
Keyword(s):  
Solder Joint ◽  
Heat Dissipation ◽  
Coefficient Of Thermal Expansion ◽  
Metal Substrate ◽  
Design Guidelines ◽  
Element Analysis ◽  
Dielectric Thickness ◽  
Component Size ◽  
Board Material ◽  
Temperature Ranges

Abstract Aluminum insulated metal substrate (IMS) is often used as an alternative to FR-4 to enhance heat dissipation in high power applications. Although IMS offers better heat dissipation, the solder joint life of leadless chip resistors and chip capacitors under thermal cycling can decrease. This is due to the higher mismatch of the coefficient of thermal expansion between the ceramic based components and the aluminum board. This paper has two main objectives. One is to investigate the sensitivity of solder joint life of ceramic chip capacitor and chip resistor mounted on IMS to variations in dielectric thickness, board material, and solder thickness on. This sensitivity analysis is conducted with finite element analysis (FEA) simulation. The other objective is to determine the solder joint life for different resistor sizes at different temperature ranges with FEA modeling and experiment data. These results are presented in terms of design guidelines to be used in the selection of component size, board material, and temperature ranges, given an expected solder joint life.

Continuous-wave high-power (75 mW) operation of a transverse-mode stabilised window-structure 680 nm AlGaInP visible laser diode

1990 ◽  
Vol 26 (20) ◽  
pp. 1726 ◽  
Author(s):  
Y. Ueno ◽  
K. Endo ◽  
H. Fujii ◽  
K. Kobayashi ◽  
K. Hara ◽  
...  
Keyword(s):  
Laser Diode ◽  
High Power ◽  
Continuous Wave ◽  
Transverse Mode ◽  
Visible Laser
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