Lifetime Model for the Fatigue Fracture in Cu/Al2O3/Cu Composites: Experimental Validation of a Substantial Lifetime Enhancement by Cu Step Etching

2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Patrick Gaiser ◽  
Markus Klingler ◽  
Jürgen Wilde
Keyword(s):  
Fatigue Fracture ◽  
Crack Detection ◽  
Experimental Validation ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Power Device ◽  
Power Electronic ◽  
Fem Simulations ◽  
Detection Techniques ◽  
Lifetime Model

Abstract Direct bonded copper (DBC) alumina (Al2O3) substrates are used in power electronic devices in order to transfer the heat from semiconductor devices to the heat sink and to carry high electric currents. Fatigue-induced cracks in the ceramic result in a diminished heat dissipation, leading to failure of a power device. Hence, a lifetime model concerning this failure mode is necessary. In this paper, a new lifetime model including crack initiation as well as crack propagation for the fatigue fracture of Al2O3-based DBC substrates is presented. It is based on experimental crack detection techniques and finite element method (FEM) simulations including fracture mechanics. For the validation of the lifetime model, experiments are presented which show that by appropriate design of the copper edge, the lifetime of the substrates is increased substantially.

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

Fast Transient and Intensified Heat Dissipation Applicable to High Heat Flux Density

2011 ◽  
Author(s):  
Jing Li ◽  
Shuanshi Fan ◽  
Zemin Yao ◽  
Jing Li ◽  
Xinli Wei
Keyword(s):  
Heat Flux ◽  
Flux Density ◽  
Heat Flux Density ◽  
Heat Dissipation ◽  
Electronic Devices ◽  
Spray Cooling ◽  
High Heat ◽  
High Heat Flux ◽  
Power Electronic ◽  
Fast Transient

In this paper, in order to solve the problem of intensified heat dissipation in high power electronic devices, a fast transient and intensified heat dissipation technology was put forward by comparing many heat transfer modes based on the analytical study on the existing technologies about heat dissipation at high heat flux density and about fast heat transport. This technology combined spray cooling technology with fast endothermic chemical reaction processes; we summarized the characteristics of media applicable to an environment with transient high heat flux density by comparing various parameters of many sprayed media in the spray cooling process. According to the energy balance of endothermic chemical reactions of relevant media, we determined the media (mainly carbon dioxide hydrate) applicable to the fast transient and intensified heat dissipation technology and presented the conditions for the chemical reactions. We analyzed the methods controlling the instantaneous chemical reaction rate and proposed the structural characteristics of the chemical reactor so as to ensure that the time for heat removal will be control to around 0.01 second. Thus, the problem of fast transient heat dissipation in high power electronic devices, etc. would be radically solved.

Mechanical Analysis of the Energy Cycling Control for Further Smart Grid

2013 ◽  
Vol 804 ◽  
pp. 378-382
Author(s):  
Bing Qi ◽  
Hong Wei Xie ◽  
Li Kun Zhang ◽  
Li Li Wang ◽  
Song Song Chen
Keyword(s):  
Power Distribution ◽  
Heat Dissipation ◽  
Cooling System ◽  
Electronic Devices ◽  
Mechanical Analysis ◽  
Device Performance ◽  
Distribution Analysis ◽  
Power Electronic ◽  
Energy Cycle ◽  
Full Utilization

Power electronic devices always consume a lot of energy, and this energy is then converted into heat, so that the device temperature rises. It will not only affect the device performance in full cycling, but also may result in damage, if the problem of heat dissipation can not be solved. In this paper, we propose an energy cycle approach that can provide a full utilization of the reused energy from the expansion tank to distributed pump. The Power distribution analysis of the controlling cabinet is presented together with the component in power cabinet. With the capacity of power electronic devices and power levels increasing rapidly, the thermal performance of the cooling system can be improved and higher requirements can be obtained.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals New Sensor for Medium- and High-Voltage Measurement

Energies ◽  
2021 ◽  
Vol 14 (15) ◽  
pp. 4654
Author(s):  
Andrzej Wetula ◽  
Andrzej Bień ◽  
Mrunal Parekh
Keyword(s):  
Finite Element Method ◽  
Electronic Devices ◽  
Finite Element Method Simulation ◽  
Laboratory Model ◽  
Power Electronic ◽  
Proof Of Concept ◽  
Voltage Measurement ◽  
Medium Voltage ◽  
Narrow Frequency Band ◽  
Further Development

Measurements of medium and high voltages in a power grid are normally performed with large and bulky voltage transformers or capacitive dividers. Besides installation problems, these devices operate in a relatively narrow frequency band, which limits their usability in modern systems that are saturated with power electronic devices. A sensor that can be installed directly on a wire and can operate without a galvanic connection to the ground may be used as an alternative voltage measurement device. This type of voltage sensor can complement current sensors installed on a wire, forming a complete power acquisition system. This paper presents such a sensor. Our sensor is built using two dielectric elements with different permeability coefficients. A finite element method simulation is used to estimate the parameters of a constructed sensor. Besides simulations, a laboratory model of a sensor was built and tested in a medium-voltage substation. Our results provide a proof of concept for the presented sensor. Some errors in voltage reconstruction have been traced to an oversimplified data acquisition and transmission system, which has to be improved during the further development of the sensor.

scholarly journals Series Compensation of Transmission Systems: A Literature Survey

Energies ◽  
2021 ◽  
Vol 14 (6) ◽  
pp. 1717
Author(s):  
Camilo Andrés Ordóñez ◽  
Antonio Gómez-Expósito ◽  
José María Maza-Ortega
Keyword(s):  
Steady State ◽  
Power Systems ◽  
Power System ◽  
Case Studies ◽  
Electronic Devices ◽  
Literature Survey ◽  
Power Electronic ◽  
Transmission Systems ◽  
Series Compensation ◽  
Near Future

This paper reviews the basics of series compensation in transmission systems through a literature survey. The benefits that this technology brings to enhance the steady state and dynamic operation of power systems are analyzed. The review outlines the evolution of the series compensation technologies, from mechanically operated switches to line- and self-commutated power electronic devices, covering control issues, different applications, practical realizations, and case studies. Finally, the paper closes with the major challenges that this technology will face in the near future to achieve a fully decarbonized power system.

scholarly journals An Automatic Concrete Crack-Detection Method Fusing Point Clouds and Images Based on Improved Otsu’s Algorithm

Sensors ◽  
2021 ◽  
Vol 21 (5) ◽  
pp. 1581
Author(s):  
Xiaolong Chen ◽  
Jian Li ◽  
Shuowen Huang ◽  
Hao Cui ◽  
Peirong Liu ◽  
...  
Keyword(s):  
Crack Detection ◽  
Detection Method ◽  
Multiple Scales ◽  
Point Clouds ◽  
Depth Image ◽  
Detection Accuracy ◽  
Detection Techniques ◽  
Concrete Crack ◽  
3D Point Clouds ◽  
2D Images

Cracks are one of the main distresses that occur on concrete surfaces. Traditional methods for detecting cracks based on two-dimensional (2D) images can be hampered by stains, shadows, and other artifacts, while various three-dimensional (3D) crack-detection techniques, using point clouds, are less affected in this regard but are limited by the measurement accuracy of the 3D laser scanner. In this study, we propose an automatic crack-detection method that fuses 3D point clouds and 2D images based on an improved Otsu algorithm, which consists of the following four major procedures. First, a high-precision registration of a depth image projected from 3D point clouds and 2D images is performed. Second, pixel-level image fusion is performed, which fuses the depth and gray information. Third, a rough crack image is obtained from the fusion image using the improved Otsu method. Finally, the connected domain labeling and morphological methods are used to finely extract the cracks. Experimentally, the proposed method was tested at multiple scales and with various types of concrete crack. The results demonstrate that the proposed method can achieve an average precision of 89.0%, recall of 84.8%, and F1 score of 86.7%, performing significantly better than the single image (average F1 score of 67.6%) and single point cloud (average F1 score of 76.0%) methods. Accordingly, the proposed method has high detection accuracy and universality, indicating its wide potential application as an automatic method for concrete-crack detection.

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