Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

2019 ◽  
Vol 142 (1) ◽  
Author(s):  
Pratik V. Bansode ◽  
Jimil M. Shah ◽  
Gautam Gupta ◽  
Dereje Agonafer ◽  
Harsh Patel ◽  
...  

Abstract The next radical change in the thermal management of data centers is to shift from conventional cooling methods like air-cooling to direct liquid cooling to enable high thermal mass and corresponding superior cooling. There has been in the past few years a limited adoption of direct liquid cooling in data centers because of its simplicity and high heat dissipation capacity. Single-phase engineered fluid immersion cooling has several other benefits like better server performance, even temperature profile, and higher rack densities and the ability to cool all components in a server without the need for electrical isolation. The reliability aspect of such cooling technology has not been well addressed in the open literature. This paper presents the performance of a fully single-phase dielectric fluid immersed server over wide temperature ranges in an environmental chamber. The server was placed in an environmental chamber and applied extreme temperatures ranging from −20 °C to 10 °C at 100% relative humidity and from 20 to 55 °C at constant 50% relative humidity for extended durations. This work is a first attempt of measuring the performance of a server and other components like pump including flow rate drop, starting trouble, and other potential issues under extreme climatic conditions for a completely liquid-submerged system. Pumping power consumption is directly proportional to the operating cost of a data center. The experiment was carried out until the core temperature reached the maximum junction temperature. This experiment helps to determine the threshold capacity and the robustness of the server for its applications in extreme climatic conditions.

Author(s):  
Pratik V. Bansode ◽  
Jimil M. Shah ◽  
Gautam Gupta ◽  
Dereje Agonafer ◽  
Harsh Patel ◽  
...  

Fully immersion of servers in electrically nonconductive (dielectric) fluid has recently become a promising technique for minimizing cooling energy consumption in data centers. The improved thermal properties of these dielectric fluids facilitate considerable savings in both upfront and operating cost over traditional air-cooling. This technology provides an opportunity for accommodating increased power densities. It also minimizes the common operational issues of air cooling technique like overheating and temperature swing in the system, fan failures, dust, air quality, and corrosion. This paper presents various data about the thermal performance of a fully single-phase dielectric fluid immersed server over wide temperature ranges (environment temperatures) from 25°C to 55°C for prolonged periods in an environmental chamber. This work explores the effects of high temperatures on the performance of a server and other components like pump, along with potential issues associated with extreme climatic conditions. The experimental data serves as a means to determine failure criteria for the server and pump by subjecting the system to accelerated thermal aging conditions i.e. around 55°C, consequently simulating the most extreme environmental condition that the server may encounter. Connector seals are inspected for expected degradation upon temperature cycling typically at such extreme conditions. Throttling limit for the server and pump power draw for different temperatures was determined to assess pump performance. Determining the relations between component behavior and operating temperature provides an accurate measure of lifetime of a server. The scope of this paper can be expanded by reviewing the effects of low temperatures on server and component performance. Changes to various performance parameters like power draw of pump and server at the higher and the lower operating temperatures and an understanding of issues like condensation can be used to quantify upper and lower limits for pump and server performance.


Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44–53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42–50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.


Author(s):  
Dhruvkumar Gandhi ◽  
Uschas Chowdhury ◽  
Tushar Chauhan ◽  
Pratik Bansode ◽  
Satyam Saini ◽  
...  

Abstract Complete immersion of servers in synthetic dielectric fluids is rapidly becoming a popular technique to minimize the energy consumed by data centers for cooling purposes. In general, immersion cooling offers noteworthy advantages over conventional air-cooling methods as synthetic dielectric fluids have high heat dissipation capacities which are roughly about 1200 times greater than air. Other advantages of dielectric fluid immersion cooling include even thermal profile on chips, reduction in noise and addressing reliability and operational enhancements like whisker formation and electrochemical migration. Nevertheless, lack of data published and availability of long-term reliability data on immersion cooling is insufficient which makes most of data centers operators reluctant to implement this technique. The first part of this paper will compare thermal performance of single-phase oil immersion cooled HP ProLiant DL160 G6 server against air cooled server using computational fluid dynamics on 6SigmaET®. Focus of the study are major components of the server like Central Processing Unit (CPU), Dual in Line Memory Module (DIMM), Input/output Hub (IOH) chip and Input/output controller Hub (ICH). The second part of this paper focuses on thermal performance optimization of oil immersion cooled servers by varying inlet oil temperature, flow rate and using different fluid.


2020 ◽  
Vol 142 (2) ◽  
Author(s):  
Oluwaseun Awe ◽  
Jimil M. Shah ◽  
Dereje Agonafer ◽  
Prabjit Singh ◽  
Naveen Kannan ◽  
...  

Abstract Airside economizers lower the operating cost of data centers by reducing or eliminating mechanical cooling. It, however, increases the risk of reliability degradation of information technology (IT) equipment due to contaminants. IT Equipment manufacturers have tested equipment performance and guarantee the reliability of their equipment in environments within ISA 71.04-2013 severity level G1 and the ASHRAE recommended temperature-relative humidity (RH) envelope. IT Equipment manufacturers require data center operators to meet all the specified conditions consistently before fulfilling warranty on equipment failure. To determine the reliability of electronic hardware in higher severity conditions, field data obtained from real data centers are required. In this study, a corrosion classification coupon experiment as per ISA 71.04-2013 was performed to determine the severity level of a research data center (RDC) located in an industrial area of hot and humid Dallas. The temperature-RH excursions were analyzed based on time series and weather data bin analysis using trend data for the duration of operation. After some period, a failure was recorded on two power distribution units (PDUs) located in the hot aisle. The damaged hardware and other hardware were evaluated, and cumulative corrosion damage study was carried out. The hypothetical estimation of the end of life of components is provided to determine free air-cooling hours for the site. There was no failure of even a single server operated with fresh air-cooling shows that using evaporative/free air cooling is not detrimental to IT equipment reliability. This study, however, must be repeated in other geographical locations to determine if the contamination effect is location dependent.


Author(s):  
Jimil M. Shah ◽  
Ravya Dandamudi ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Pratik Bansode ◽  
...  

Abstract In today’s networking world, utilization of servers and data centers has been increasing significantly. Increasing demand of processing and storage of data causes a corresponding increase in power density of servers. The data center energy efficiency largely depends on thermal management of servers. Currently, air cooling is the most widely used thermal management technology in data centers. However, air cooling has started to reach its limits due to high-powered processors. To overcome these limitations of air cooling in data centers, liquid immersion cooling methods using different dielectric fluids can be a viable option. Thermal shadowing is an effect in which temperature of a cooling medium increases by carrying heat from one source and results in decreasing its heat carrying capacity due to reduction in the temperature difference between the maximum junction temperature of successive heat sink and incoming fluid. Thermal Shadowing is a challenge for both air and low velocity oil flow cooling. In this study, the impact of thermal shadowing in a third-generation open compute server using different dielectric fluids is compared. The heat sink is a critical part for cooling effectiveness at server level. This work also provides an efficient range of heat sinks with computational modelling of third generation open compute server. Optimization of heat sink can allow to cool high-power density servers effectively for single-phase immersion cooling applications. A parametric study is conducted, and significant savings in the volume of a heat sink have been reported.


Author(s):  
Jimil M. Shah ◽  
Chinmay Bhatt ◽  
Pranavi Rachamreddy ◽  
Ravya Dandamudi ◽  
Satyam Saini ◽  
...  

Abstract Networking and computing dependency has been increasing in the modern world, thus, boosting the growth of data centers in leading business domains like banking, education, transportation, social media etc. Data center is a facility that incorporates an organization’s IT operations and equipment, as well as where it stores, processes and manages the data. To fulfill the increasing demands of data storage and data processing, a corresponding increase in server performance is needed. This causes a subsequent increment in power consumption and heat generation in the servers due to high performance processing units. Currently, air cooling is the most widely used thermal management technique in data centers, but it has started to reach its limitations in cooling high packaging densities. Therefore, industries are looking for single-phase immersion cooling using various dielectric fluids to reduce the operational and cooling costs by enhancing the thermal management of servers. This research work aims at increasing the rack density by reducing the form factor of a 3rd Generation Open Compute Server using single-phase immersion cooling. A computational study is conducted in the operational range of temperatures and the thermal efficiency is optimized. A parametric study is conducted by changing the inlet velocities and inlet temperatures of cooling liquid for different heights of the open compute 3rd generation server. A comparative study is then carried out for white mineral oil and synthetic fluid (EC100).


Author(s):  
Jimil M. Shah ◽  
Keerthivasan Padmanaban ◽  
Hrishabh Singh ◽  
Surya Duraisamy Asokan ◽  
Satyam Saini ◽  
...  

Abstract The adoption of Single-phase Liquid Immersion Cooling (Sp-LIC) for Information Technology equipment provides an excellent cooling platform coupled with significant energy savings. There are, however, very limited studies related to the reliability of such cooling technology. The Accelerated Thermal Cycling (ATC) test given ATC JEDEC is relevant just for air cooling but there is no such standard for immersion cooling. The ASTM benchmark D3455 with some appropriate adjustments was adopted to test the material compatibility because of the air and dielectric fluid differences in the heat capacitance property and corresponding ramp rate during thermal cycling. For this study, accelerated thermal degradation of the printed circuit board (PCB), passive components, and fiber optic cables submerged in air, white mineral oil, and synthetic fluid at a hoisted temperature of 45C and 35% humidity is undertaken. This paper serves multiple purposes including designing experiments, testing and evaluating material compatibility of PCB, passive components, and optical fibers in different hydrocarbon oils for single-phase immersion cooling. Samples of different materials were immersed in different hydrocarbon oils and air and kept in an environmental chamber at 45C for a total of 288 hours. Samples were then evaluated for their mechanical and electrical properties using Dynamic Mechanical Analyzer (DMA) and a multimeter, respectively. The cross-sections of some samples were also investigated for their structural integrity using SEM. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.


Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Haruhiko Ohta ◽  
Yasuhisa Shinmoto ◽  
...  

Energy consumption in data center has been drastically increasing in recent years. In data center, server racks are cooled down by air conditioning for the whole room in a roundabout way. This air cooling method is inefficient in cooling and it causes hotspot problem that IT equipments are not cooled down enough, but the room is overcooled. On the other hand, countermeasure against the heat of the IT equipments is also one of the big issues. We therefore proposed new liquid cooling systems which IT equipments themselves are cooled down and exhaust heat is not radiated into the server room. For our liquid cooling systems, three kinds of cooling methods have been developed simultaneously. Two of them are direct cooling methods that the cooling jacket is directly attached to heat source, or CPU in this case. Single-phase heat exchanger or two-phase heat exchanger is used as cooling jackets. The other is indirect cooling methods that the heat generated from CPU is transported to the outside of the chassis through flat heat pipes, and condensation sections of the heat pipes are cooled down by liquid. Verification tests have been conducted by use of real server racks equipped with these cooling techniques while pushing ahead with five R&D subjects which constitute our liquid cooling system, which single-phase heat exchanger, two-phase heat exchanger, high performance flat heat pipes, nanofluids technology, and plug-in connector. As a result, the energy saving effect of 50∼60% comparing with conventional air cooling system was provided in direct cooling technique with single-phase heat exchanger.


Author(s):  
Veerendra Mulay ◽  
Dereje Agonafer ◽  
Roger Schmidt

The power trend for Server systems continues to grow thereby making thermal management of Data centers a very challenging task. Although various configurations exist, the raised floor plenum with Computer Room Air Conditioners (CRACs) providing cold air is a popular operating strategy. The air cooling of data center however, may not address the situation where more energy is expended in cooling infrastructure than the thermal load of data center. Revised power trend projections by ASHRAE TC 9.9 predict heat load as high as 5000W per square feet of compute servers’ equipment footprint by year 2010. These trend charts also indicate that heat load per product footprint has doubled for storage servers during 2000–2004. For the same period, heat load per product footprint for compute servers has tripled. Amongst the systems that are currently available and being shipped, many racks exceed 20kW. Such high heat loads have raised concerns over limits of air cooling of data centers similar to air cooling of microprocessors. Thermal management of such dense data center clusters using liquid cooling is presented.


Author(s):  
Jimil M. Shah ◽  
Oluwaseun Awe ◽  
Pavan Agarwal ◽  
Iziren Akhigbe ◽  
Dereje Agonafer ◽  
...  

Deployment of air-side economizers in data centers is rapidly gaining acceptance to reduce the cost of energy by reducing the hours of operation of CRAC units. Use of air-side economizers has the associated risk of introducing gaseous and particulate contamination into data centers, thus, degrading the reliability of Information Technology (IT) equipment. Sulfur-bearing gaseous contamination is of concern because it attacks the copper and silver metallization of the electronic components causing electrical opens and/or shorts. Particulate contamination with low deliquescence relative humidity is of concern because it becomes wet and therefore electrically conductive under normal data center relative humidity conditions. IT equipment manufacturers guarantee the reliability of their equipment operating in environment within ISA 71.04-2013 severity level G1 and within the ASHRAE recommended temperature-relative humidity envelope. The challenge is to determine the reliability degrading effect of contamination severity levels higher than G1 and the temperature and humidity allowable ranges A1–A3 well outside the recommended range. This paper is a first attempt at addressing this challenge by studying the cumulative corrosion damage to IT equipment operated in an experimental data center located in Dallas, known to have contaminated air with ISA 71.04-2013 severity level G2. The data center is cooled using an air-side economizer. This study serves several purposes including: the correlation of equipment reliability to levels of airborne corrosive contaminants and the study of the degree of reliability degradation when the equipment is operated, outside the recommended envelope, in the allowable temperature-relative humidity range in geographies with high levels of gaseous and particulate contamination. The operating and external conditions of a modular data center, located in a Dallas industrial area, using air-side economizer is described. The reliability degradation of servers exposed to outside air via an airside economizer was determined qualitatively examining the corrosion of components in the servers and comparing the results to the corrosion of components in a non-operating server stored in a protective environment. The corrosion-related reliability of the servers over almost the life of the product was related to continuous temperature and relative humidity for the duration of the experiment. This work provides guidance for data center administration for similar environment. From an industry perspective, it should be noted that in the four years of operation in the hot and humid Dallas climate using only evaporative cooling or fresh air cooling, we have not seen a single server failure in our research pod. That performance should highlight an opportunity for significant energy savings for data center operators in a much broader geographic area than currently envisioned with evaporative cooling.


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