Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes

2018 ◽  
Vol 140 (4) ◽  
Author(s):  
Justin Broughton ◽  
Vanessa Smet ◽  
Rao R. Tummala ◽  
Yogendra K. Joshi
Keyword(s):  
Silicon Carbide ◽  
Hybrid Electric Vehicles ◽  
Thermal Characteristics ◽  
Thermal Interface Materials ◽  
Liquid Cooling ◽  
Area Of Interest ◽  
Die Attach ◽  
Power Modules ◽  
Silicon Device ◽  
Interface Materials

Due to its superior electrical and thermal characteristics, silicon carbide power modules will soon replace silicon modules to be mass-produced and implemented in all-electric and hybrid-electric vehicles (HEVs). Redesign of the power modules will be required to take full advantage of these newer devices. A particular area of interest is high-temperature power modules, as under-hood temperatures often exceed maximum silicon device temperatures. This review will examine thermal packaging options for standard Si power modules and various power modules in recent all-electric and HEVs. Then, thermal packaging options for die-attach, thermal interface materials (TIM), and liquid cooling are discussed for their feasibility in next-generation silicon carbide (SiC) power modules.

Parametric and Sensitivity Analysis of Power Module Design

2019 ◽  
Author(s):  
L. M. Boteler ◽  
M. C. Fish ◽  
M. S. Berman
Keyword(s):  
Sensitivity Analysis ◽  
Heat Sink ◽  
Thermal Interface Materials ◽  
Power Module ◽  
Thermal Interface ◽  
Module Design ◽  
Die Attach ◽  
Power Modules ◽  
The Impact ◽  
Interface Materials

Abstract As technology becomes more electrified, thermal and power engineers need to know how to improve power modules to realize their full potential. Current power module technology involves planar ceramic-based substrates with wirebond interconnects and a detached heat sink. There are a number of well-known challenges with the current configuration including heat removal, reliability due to coefficient of thermal expansion (CTE) mismatch, and parasitic inductance. Various solutions have been proposed in literature to help solve many of these issues: alternate substrates, advanced thermal interface materials, compliant die attach, thermal ground planes, high performing heat sinks, superconducting copper, wirebondless configurations, etc. While each of these technologies have their merits, this paper will perform a holistic analysis on a power module and identify the impact of improving various technologies on the device temperature. Parametric simulations were performed to assess the impact of many aspects of power module design including material selection, device layout, and heat sink choice. Materials that have been investigated include die attach, substrate, heat spreader, and thermal interface materials. In all cases, the industry standard was compared to the state of the art to quantify the advantages and/or disadvantages of adopting the new technologies. A sensitivity analysis is also performed which shows how and where the biggest benefits could be realized when redesigning power modules and determining whether to integrate novel technologies.

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Technology Implementation ◽  
Wide Bandgap ◽  
Void Coalescence ◽  
Thermal Interface Materials ◽  
Die Attach ◽  
And Performance ◽  
Interface Materials ◽  
Sintered Silver

Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a challenge. Among major options, sintered silver shows advantages in ease of applications. Cost, performance, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and performance improvement of sintered silver using enhancement structures at micro- and nano-scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be optimized in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated systems. Demands of developing new high-temperature packaging materials to enable optimized package designs are also highlighted.

scholarly journals Power Cycling and Reliability Testing of Epoxy-Based Graphene Thermal Interface Materials

2020 ◽  
Vol 6 (2) ◽  
pp. 26 ◽  
Author(s):  
Jacob S. Lewis ◽  
Timothy Perrier ◽  
Amirmahdi Mohammadzadeh ◽  
Fariborz Kargar ◽  
Alexander A. Balandin
Keyword(s):  
Thermal Conductivity ◽  
Thermal Diffusivity ◽  
Performance Enhancement ◽  
Thermal Characteristics ◽  
Single Layer Graphene ◽  
Flash Method ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Power Cycling ◽  
Interface Materials

We report on the lifespan evolution of thermal diffusivity and thermal conductivity in curing epoxy-based thermal interface materials with graphene fillers. The performance and reliability of graphene composites have been investigated in up to 500 power cycling measurements. The tested composites were prepared with an epoxy resin base and randomly oriented fillers consisting of a mixture of few-layer and single-layer graphene. The power cycling treatment procedure was conducted with a custom-built setup, while the thermal characteristics were determined using the “laser flash” method. The thermal conductivity and thermal diffusivity of these composites do not degrade but instead improve with power cycling. Among all tested filled samples with different graphene loading fractions, an enhancement in the thermal conductivity values of 15% to 25% has been observed. The obtained results suggest that epoxy-based thermal interface materials with graphene fillers undergo an interesting and little-studied intrinsic performance enhancement, which can have important implications for the development of next-generation thermal interface materials.

Predicting Thermal Characteristics of Particle Laden Thermal Interface Materials

2009 ◽  
Author(s):  
Reza H. Khiabani ◽  
Yogendra Joshi ◽  
Cyrus Aidun
Keyword(s):  
Thermal Conductivity ◽  
Thermal Performance ◽  
Volume Fraction ◽  
Particle Volume Fraction ◽  
Thermal Characteristics ◽  
Thermal Conductivity Ratio ◽  
Thermal Interface Materials ◽  
Particle Volume ◽  
Thermal Interface ◽  
Interface Materials

Particle laden Thermal Interface Materials (TIMs) are used extensively in thermal packaging of electronic components to enhance the heat transfer between heat dissipating components and the thermal management layers. In this paper, the thermal performance of particle laden TIMs is studied numerically, using the Lattice Boltzmann method. The effect of particle volume fraction, particle size and the thermal conductivity ratio on the thermal performance of particle laden TIMs are examined. The results for the effective thermal conductivity of particle laden greases are in agreement with the existing analytical and experimental results reported in the literature.

Achieving Significant Thermal Conductivity Improvement via Constructing Vertically Arranged and Covalently Bonded Silicon Carbide Nanowires/Natural Rubber Composites

2021 ◽  
Author(s):  
Shuaishuai Cheng ◽  
Xiaoyuan Duan ◽  
Liu Xiaoqing ◽  
Zhiyi Zhang ◽  
Dong An ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Natural Rubber ◽  
Electronic Devices ◽  
Thermal Interface Materials ◽  
Rubber Composites ◽  
Thermal Interface ◽  
Covalently Bonded ◽  
Natural Rubber Composites ◽  
Interface Materials

Abstract: With the development of electronic devices, it is becoming increasingly important for thermal interface materials (TIM) to efficiently and quickly remove the heat generated. However, due to the high...

Thermal Interface Materials Enhanced by Micro and Nanostructures

2018 ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
Power Electronics ◽  
Technology Implementation ◽  
Wide Bandgap ◽  
Void Coalescence ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Die Attach ◽  
Module Systems ◽  
Interface Materials ◽  
Sintered Silver

Thermal Interface materials are crucial elements for packaging of power electronics. In particular, development of high temperature lead free die-attach thermal interface materials for silicon carbide wide bandgap power electronics is a challenge. Failures of power electronics package modules often occur at die-attach areas. Among major options, sintered silver shows advantages in ease of applications. Cost, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and improvement of sintered silver using enhancement structures at micro and nano scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be discussed in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated module systems.

Advanced Thermal Interface Materials for Thermal Management

2018 ◽  
Author(s):  
Wei Yu ◽  
◽  
Changqing Liu ◽  
Lin Qiu ◽  
Ping Zhang ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

scholarly journals Carbon Nanotube Films for Energy Applications

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1890
Author(s):  
Monika Rdest ◽  
Dawid Janas
Keyword(s):  
Carbon Nanotube ◽  
Mechanical Energy ◽  
Research Community ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Conductive Coatings ◽  
Storage Devices ◽  
Energy Applications ◽  
Wide Range ◽  
Interface Materials

This perspective article describes the application opportunities of carbon nanotube (CNT) films for the energy sector. Up to date progress in this regard is illustrated with representative examples of a wide range of energy management and transformation studies employing CNT ensembles. Firstly, this paper features an overview of how such macroscopic networks from nanocarbon can be produced. Then, the capabilities for their application in specific energy-related scenarios are described. Among the highlighted cases are conductive coatings, charge storage devices, thermal interface materials, and actuators. The selected examples demonstrate how electrical, thermal, radiant, and mechanical energy can be converted from one form to another using such formulations based on CNTs. The article is concluded with a future outlook, which anticipates the next steps which the research community will take to bring these concepts closer to implementation.

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