Thermal Interface Materials Enhanced by Micro and Nanostructures

2018 ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
Power Electronics ◽  
Technology Implementation ◽  
Wide Bandgap ◽  
Void Coalescence ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Die Attach ◽  
Module Systems ◽  
Interface Materials ◽  
Sintered Silver

Thermal Interface materials are crucial elements for packaging of power electronics. In particular, development of high temperature lead free die-attach thermal interface materials for silicon carbide wide bandgap power electronics is a challenge. Failures of power electronics package modules often occur at die-attach areas. Among major options, sintered silver shows advantages in ease of applications. Cost, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and improvement of sintered silver using enhancement structures at micro and nano scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be discussed in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated module systems.

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Mei-Chien Lu
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Technology Implementation ◽  
Wide Bandgap ◽  
Void Coalescence ◽  
Thermal Interface Materials ◽  
Die Attach ◽  
And Performance ◽  
Interface Materials ◽  
Sintered Silver

Thermal interface materials (TIMs) are crucial elements for packaging of power electronics. In particular, development of high-temperature lead-free die-attach TIMs for silicon carbide wide bandgap power electronics is a challenge. Among major options, sintered silver shows advantages in ease of applications. Cost, performance, reliability, and integration are concerns for technology implementation. The current study first discusses issues and status reported in literatures. Then it focuses on cost reduction and performance improvement of sintered silver using enhancement structures at micro- and nano-scales. A few design architectures are analyzed by finite element methods. The feasibility of strengthening edges and corners is also assessed. The downside of potential increase of unfavorable stresses to accelerate void coalescence would be optimized in conjunction with design concept of power electronics package modules for paths of solutions in the form of integrated systems. Demands of developing new high-temperature packaging materials to enable optimized package designs are also highlighted.

scholarly journals Degradation of thermal interface materials for high-temperature power electronics applications

2013 ◽  
Vol 53 (12) ◽  
pp. 1933-1942 ◽  
Author(s):  
R. Skuriat ◽  
J.F. Li ◽  
P.A. Agyakwa ◽  
N. Mattey ◽  
P. Evans ◽  
...  
Keyword(s):  
High Temperature ◽  
Power Electronics ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Interface Materials

Parametric and Sensitivity Analysis of Power Module Design

2019 ◽  
Author(s):  
L. M. Boteler ◽  
M. C. Fish ◽  
M. S. Berman
Keyword(s):  
Sensitivity Analysis ◽  
Heat Sink ◽  
Thermal Interface Materials ◽  
Power Module ◽  
Thermal Interface ◽  
Module Design ◽  
Die Attach ◽  
Power Modules ◽  
The Impact ◽  
Interface Materials

Abstract As technology becomes more electrified, thermal and power engineers need to know how to improve power modules to realize their full potential. Current power module technology involves planar ceramic-based substrates with wirebond interconnects and a detached heat sink. There are a number of well-known challenges with the current configuration including heat removal, reliability due to coefficient of thermal expansion (CTE) mismatch, and parasitic inductance. Various solutions have been proposed in literature to help solve many of these issues: alternate substrates, advanced thermal interface materials, compliant die attach, thermal ground planes, high performing heat sinks, superconducting copper, wirebondless configurations, etc. While each of these technologies have their merits, this paper will perform a holistic analysis on a power module and identify the impact of improving various technologies on the device temperature. Parametric simulations were performed to assess the impact of many aspects of power module design including material selection, device layout, and heat sink choice. Materials that have been investigated include die attach, substrate, heat spreader, and thermal interface materials. In all cases, the industry standard was compared to the state of the art to quantify the advantages and/or disadvantages of adopting the new technologies. A sensitivity analysis is also performed which shows how and where the biggest benefits could be realized when redesigning power modules and determining whether to integrate novel technologies.

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