Thermal Management of Electronic Equipment: A Review of Technology and Research Topics

1986 ◽  
Vol 39 (12) ◽  
pp. 1847-1868 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Flip Chip ◽  
Nucleate Boiling ◽  
The Body ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Design Criteria ◽  
Research Topics ◽  
Small Component ◽  
Convection Cooling

Increasing miniaturization of microcircuits on chips of increasing size and new schemes of electrical connection, such as flip-chip bonding and surface mounting, are setting more demanding criteria regarding the thermal field within electronic equipment. While the search for a solution to meet a set of prescribed design criteria is becoming more complex, the body of available data needed to perform such a search is quite small. This article describes the two primary functions to be implemented by electronic heat transfer research: the definition of thermal design criteria and the establishment of a thermal packaging database. Examples of actual designs of packages are drawn from recent publications to illustrate the points of technical importance. The examples are packages of DRAM chips, flat-leaded packages of logic chips, and modules with dismountable heat sinks. These examples are used to address thermal stress problems, the problems of fin design, and thermal interface management, respectively. In the section on natural convection cooling, the effects of various factors on the uncertainties pertaining to heat transfer coefficient are assessed in light of the correlations proposed in the current literature. The section on forced convection cooling deals with the problem of heat transfer from an array of packages in a parallel-plate channel. The final section is devoted to the research topics of nucleate boiling heat transfer enhancement, from the surface of a small component, and microchannel cooling.

Flow and Thermal Resistance Network Modeling of Finned Heat Sinks With Bypass Mounted in Rectangular Enclosure

2021 ◽  
Author(s):  
Masaya Fukada ◽  
Takashi Fukue ◽  
Yasuhiro Sugimoto ◽  
Tomoyuki Hatakeyama ◽  
Masaru Ishizuka
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flow Rate ◽  
Heat Sink ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Heat Sinks ◽  
Rate Distribution ◽  
Resistance Network ◽  
Convection Cooling

Abstract This study describes a thermal design method of forced convection cooling in high-density packaging electronic equipment for upstream design processes by flow and thermal resistance network analysis. Forced convection cooling by combining fans and heat sinks is the most standard strategy for dissipating heat from electronic equipment. In recent years, the thermal design of electronic equipment becomes more critical, and fast thermal design is required due to the rapid development of final products. We have been developing the flow and thermal resistance network analysis as the quick thermal design method for electronic equipment. However, an accurate prediction of forced convection cooling performance by finned heat sinks mounted in high-density packaging electronic equipment is generally tricky. Some bypasses, which are clearances between the heat sinks and enclosure walls or other components, exist around the heat sinks. Therefore, a flow rate distribution between the heat sink fins and the bypasses should be predicted. Many researchers have investigated hydrodynamic characteristics and heat transfer characteristics of finned heat sinks. However, many previous studies have been conducted on the finned heat sink performance when there are no bypasses. In order to achieve an optimum design of the finned heat sinks in the upstream configuration regardless of the heat sink dimensions, a systematic database of hydrodynamic characteristics and heat transfer characteristics of the finned heat sinks with bypasses should be investigated. This paper discusses the development of function models of pressure drop, flow rate distribution, and heat transfer of the finned heat sinks with the bypasses for the resistance network analysis through experiments and CFD analysis. Several types of finned heat sinks with 40 mm in width and 80 mm in length were prepared, and these were mounted in a rectangular enclosure with 45 mm in width and height. First, the pressure drop characteristic around the heat sink was investigated. In addition, the flow rate distribution between the heat sink and the bypass was evaluated separately. A flow branching coefficient was developed to predict the flow rate distribution around the heat sink combined with the pressure drop coefficient. Using the developed flow branching coefficient, the flow and thermal resistance network model around the finned heat sink was developed. The results from the proposed resistance network model showed good agreement with those from the experiment.

scholarly journals Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

2021 ◽  
Vol 39 (2) ◽  
pp. 451-459
Author(s):  
Zhengde Wang
Keyword(s):  
Heat Transfer ◽  
Numerical Simulation ◽  
Heat Source ◽  
Electronic Devices ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Source Analysis ◽  
Power Electronic ◽  
Cooling Performance ◽  
Scheme Design

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

Thermal Management of Electronic Equipment: Research Needs in the Mid-1990s and Beyond

1996 ◽  
Vol 49 (10S) ◽  
pp. S167-S174 ◽  
Author(s):  
Wataru Nakayama
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Electronic Devices ◽  
Transport Processes ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Stress Fields ◽  
Hardware Development ◽  
3D Packaging ◽  
The Subject

As electronic devices and equipment are finding their ways into diverse applications, their physical integrity becomes a matter of utmost concern. The thermal design criteria customarily assumed in many of previous heat transfer research programs have to be replaced by those on the thermomechanical load in compact systems. Attempts to find thermal and stress fields in critical parts of components, however, are beset by geometrical complexities and multiple length and time scales involved in transport processes in electronic equipment. Modeling of complex systems is the subject left for further rationalization. Also needed is the foresight about possible hardware morphologies taken by electronic equipment in the future. In view of possible saturation of 2D packaging technology, heat transfer studies for 3D packaging are worth being undertaken. Common to different scenarios of hardware development is the need to critically review the methodology and focuses of fundamental heat transfer research.

Nucleate Pool Boiling From Coated and Spirally Wrapped Tubes in Saturated R-134a and R-600a at Low and Moderate Heat Flux

2000 ◽  
Vol 123 (2) ◽  
pp. 257-270 ◽  
Author(s):  
Shou-Shing Hsieh ◽  
Tsung-Ying Yang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Plasma Coating ◽  
Nucleate Boiling ◽  
Thermal Design ◽  
Transfer Coefficients ◽  
Porous Copper ◽  
Helical Angle ◽  
R 134A ◽  
Coated Surfaces

Pool nucleate boiling heat transfer experiments from coated surfaces with porous copper (Cu) and molybdenum (Mo) and spirally wrapped with helical wire on copper surfaces with micro-roughness immersed in saturated R-134a and R-600a were conducted. The influence of coating thickness, porosity, wrapped helical angle, and wire pitch on heat transfer and boiling characteristics including bubble parameters were studied. The enhanced surface heat transfer coefficients with R-600a as refrigerant found are 2.4 times higher than those of the smooth surfaces. Photographs indicate that the average number of bubbles and bubble departure diameters has been found to increase linearly with heat flux, while the bubble diameters exhibit opposite trend in both refrigerants. Furthermore, the heat transfer of the boiling process for the present enhanced geometry (coated and wrapped) was modeled and analyzed. The experimental data for plasma coating and spirally wrapped surfaces were correlated in terms of relevant parameters, respectively to provide a thermal design basis for engineering applications.

The effects of the outlet area and the location of the main power supply unit on the cooling capability through naturally air-cooled electronic equipment casings

1998 ◽  
Vol 212 (5) ◽  
pp. 381-383 ◽  
Author(s):  
M Ishizuka
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Power Supply ◽  
Flow Resistance ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Power Supply Unit ◽  
Air Cooling ◽  
Uniform Temperature ◽  
Cooling Systems

This paper describes a practical thermal design approach to natural air-cooled electronic equipment casings. A set of simplified equations for the thermal design of natural air-cooled electronic equipment casings has been proposed. The proposed set of equations satisfied the demand of practical air-cooling systems, since it takes account of factors such as the stack effect, the air flow resistance and the heat transfer due to natural convection. The effects of the outlet area and the location of the main power supply unit on the natural cooling capability of electronic equipment casings were studied using a set of equations. The results have shown that a uniform temperature distribution could be achieved when the main power supply unit was placed at the bottom of the casing. It has also been suggested that the value of the heat removed from the casing surface could be more significant than that from the outlet vent in the thermal design of natural air-cooled electronic equipment casings.

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