Reliability of Fine Pitch Plastic Quad Flat Pack Leads and Solder Joints Under Bending, Twisting, and Thermal Conditions

1993 ◽  
Vol 115 (3) ◽  
pp. 322-328 ◽  
Author(s):  
John Lau ◽  
Steve Erasmus
Keyword(s):  
Solder Joints ◽  
Thermal Conditions ◽  
Stress Factors ◽  
Stress And Strain ◽  
Nonlinear Finite Element Method ◽  
Mechanical Responses ◽  
Isothermal Fatigue ◽  
Thermal Fatigue Life ◽  
Fine Pitch ◽  
Fatigue Data

The thermal and mechanical responses of a 304-Pin, 0.5 mm pitch, 40 mm by 40 mm body size plastic quad flat pack (QFP) solder joints and leads have been determined in this study. The thermal stress and strain in the leads and solder joints have been obtained by a 3-D nonlinear finite element method and the thermal fatigue life of the QFP corner solder joint was then estimated based on the calculated plastic strains, Coffin-Manson law, and isothermal fatigue data of solders. The effects of overload environmental stress factors on the mechanical responses of the leads and solder joints have been determined by bending and twisting experiments.

Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability

1992 ◽  
Vol 114 (2) ◽  
pp. 169-176 ◽  
Author(s):  
J. Lau ◽  
S. Golwalkar ◽  
S. Erasmus ◽  
R. Surratt ◽  
P. Boysan
Keyword(s):  
Solder Joints ◽  
Cost Effective ◽  
Temperature Cycling ◽  
Operating Conditions ◽  
Nonlinear Finite Element ◽  
Element Analysis ◽  
Isothermal Fatigue ◽  
Joint Reliability ◽  
Thermal Fatigue Life ◽  
Fatigue Data

The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution, and an acceleration factor has been established for the failure rate at operating conditions. Thermal fatigue life of the corner solder joints has been estimated based on the calculated plastic strain, Coffin-Manson equation, and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made. Furthermore, failure analysis of the solder joints has been performed using Scanning Electron Microscopy (SEM) and an optical method.

scholarly journals Research on Thermal Fatigue Life Prediction Technology of PoP Laminated BGA Products

2021 ◽  
Vol 2065 (1) ◽  
pp. 012017
Author(s):  
Hong-lei Ran ◽  
Xiao-jie Sheng ◽  
Qiang Duan ◽  
Kui Zhang ◽  
Jie Huang
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Fatigue Test ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Dynamic Monitoring ◽  
Stress And Strain ◽  
Resistance Change ◽  
Thermal Fatigue Test ◽  
Thermal Fatigue Life

Abstract In this paper, a fast prediction method for thermal fatigue life of PoP laminated BGA Product was proposed. Firstly, the stress and strain of the solder joints of each layer of the laminated device in thermal fatigue test was determined by finite element simulation method. According to the research idea of relative stress and strain, the solder joints were divided into sensitive solder joints and reliable solder joints. Secondly, sensitive solder joint were connected with PCB traces through the internal pads, bonding wires, TSVs and reliable solder joints to form a daisy chain. Through real-time dynamic monitoring of the resistance change of the daisy chain in thermal fatigue test to judge whether the solder joints fail, and record the occurrence time of the first failure solder joint. Finally, the thermal fatigue life of the product was estimated by the Norris-Landzberg formula.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

scholarly journals Prediction of mechanical properties and fatigue life of nano silver paste in chip interconnection

2020 ◽  
Author(s):  
Hui YANG ◽  
Jihui Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Stress And Strain ◽  
Nano Silver ◽  
Finite Element Software ◽  
Flip Chips ◽  
Empirical Correction ◽  
Prediction Of Mechanical Properties

Abstract The simulation of nano-silver solder joints in flip-chips is performed by the finite element software ANSYS, and the stress-strain distribution results of the solder joints are displayed. In this simulation, the solder joints use Anand viscoplastic constitutive model, which can reasonably simulate the stress and strain of solder joints under thermal cycling load. At the same time this model has been embedded in ANSYS software, so it is more convenient to use. The final simulation results show that the areas where the maximum stresses and strains occur at the solder joints are mostly distributed in the contact areas between the solder joints and the copper pillars and at the solder joints. During the entire thermal cycling load process, the area where the maximum change in stress and strain occurs is always at the solder joint, and when the temperature changes, the temperature at the solder joint changes significantly. Based on comprehensive analysis, the relevant empirical correction calculation equation is used to calculate and predict the thermal fatigue life of nano-silver solder joints. The analysis results provide a reference for the application of nano-silver solder in the electronic packaging industry.

Effect of cooling rate on the isothermal fatigue behavior of CBGA solder joints in shear

2001 ◽  
Vol 24 (1) ◽  
pp. 10-16 ◽  
Author(s):  
S.H. Fan ◽  
Y.C. Chan ◽  
C.W. Tang ◽  
J.K.L. Lai
Keyword(s):  
Cooling Rate ◽  
Solder Joints ◽  
Fatigue Behavior ◽  
Isothermal Fatigue

scholarly journals Head-on-Pillow Defect Detection: X-Ray Inspection Limitations

2019 ◽  
Vol 16 (2) ◽  
pp. 91-102
Author(s):  
Lars Bruno ◽  
Benny Gustafson
Keyword(s):  
Solder Joints ◽  
Solder Paste ◽  
Wafer Level ◽  
Reflow Soldering ◽  
X Ray ◽  
Soldering Process ◽  
Irregular Shapes ◽  
Fine Pitch ◽  
Solder Balls ◽  
Ball Grid Array Packages

Abstract Both the number and the variants of ball grid array packages (BGAs) are tending to increase on network printed board assemblies with sizes ranging from a few millimeter die size wafer level packages with low ball count to large multidie system-in-package (SiP) BGAs with 60–70 mm side lengths and thousands of I/Os. One big challenge, especially for large BGAs, SiPs, and for thin fine-pitch BGA assemblies, is the dynamic warpage during the reflow soldering process. This warpage could lead to solder balls losing contact with the solder paste and its flux during parts of the soldering process, and this may result in solder joints with irregular shapes, indicating poor or no coalescence between the added solder and the BGA balls. This defect is called head-on-pillow (HoP) and is a failure type that is difficult to determine. In this study, x-ray inspection was used as a first step to find deliberately induced HoP defects, followed by prying off of the BGAs to verify real HoP defects and the fault detection correlation between the two methods. The result clearly shows that many of the solder joints classified as potential HoP defects in the x-ray analysis have no evidence at all of HoP after pry-off. This illustrates the difficulty of determining where to draw the line between pass and fail for HoP defects when using x-ray inspection.

Stress analysis and parameter optimization of Fine-Pitch BGA solder joints under cantilever plate torsion conditions

2021 ◽  
Author(s):  
Zhuo Wang ◽  
Chunyue ◽  
Jinfeng Gong ◽  
Huaiquan Zhang ◽  
Shuaidong Liao ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Parameter Optimization ◽  
Solder Joints ◽  
Cantilever Plate ◽  
Fine Pitch
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