Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

1993 ◽  
Vol 115 (1) ◽  
pp. 112-117 ◽  
Author(s):  
M. T. North ◽  
C. T. Avedisian

Results of an experimental study are reported which demonstrate the ability of heat pipes to simultaneously dissipate high heat fluxes and high total power at low surface temperatures. The application is to cooling high power density (and high total power) semiconductor chip modules. The two designs studied incorporate air or liquid cooling in the condenser sections. The air-cooled design consisted of a manifold base plate with a series of holes drilled in it each of which was lined with sintered copper powder which served as the wick. An array of wick lined tubes was attached normal to the plate and served as the condenser section. The other heat pipe was disk shaped and also had a sintered wick structure. Cooling water channels were placed over the entire periphery of the housing except in the region of heat input. Reported steady heat fluxes are up to 31 W/cm2 corresponding to total power dissipation of up to 1400 W for the water cooled heat pipe and up to 47 W/cm2 (900 W total power) for the air cooled heat pipe with surface temperatures under 100°C.

2016 ◽  
Vol 139 (1) ◽  
Author(s):  
Brian Reding ◽  
Yiding Cao

Heat pipe technology offers a possible cooling technique for structures exposed to high heat fluxes, as in turbomachinery such as compressors and turbines. However, in its current configuration as single heat pipes, implementation of the technology is limited due to the difficulties in manufacturability and costs. Hence, a study to develop a new radially rotating (RR) heat pipe system was undertaken, which integrates multiple RR heat pipes with a common reservoir and interconnected braches for a more effective and practical solution to turbomachinery cooling. Experimental study has shown that the integration of multiple heat pipe branches with a reservoir at the top is feasible.


Author(s):  
Tien-Chien Jen ◽  
Rajendra Jadhav

Thermal management using heat pipes is gaining significant attention in past decades. This is because of the fact that it can be used as an effective heat sink in very intricate and space constrained applications such as in electronics cooling or turbine blade cooling where high heat fluxes are involved. Extensive research has been done in exploring various possible applications for the use of heat pipes as well as understanding and modeling the behavior of heat pipe under those applications. One of the possible applications of heat pipe technology is in machining operations, which involves a very high heat flux being generated during the chip generation process. Present study focuses on the thermal management of using a heat pipe in a drill for a drilling process. To check the feasibility and effectiveness of the heat pipe drill, structural and thermal analyses are performed using Finite Element Analysis. Finite Element Software ANSYS was used for this purpose. It is important for any conceptual design to be made practical and hence a parametric study was carried out to determine the optimum geometry size for the heat pipe for a specific standard drill.


1990 ◽  
Vol 112 (3) ◽  
pp. 602-607 ◽  
Author(s):  
B. R. Babin ◽  
G. P. Peterson

A computer model was developed to aid in the design of a flexible bellows heat pipe for cooling small discrete heat sources or arrays of small heat sources. This model was used to evaluate the operational characteristics and performance limitations of these heat pipes and to formulate and optimize a series of conceptual designs. Three flexible bellows heat pipes approximately 40 mm in length and 6 mm in diameter were constructed and tested using three different wick configurations. The test pipes were found to be boiling limited over most of the operating temperature range tested. Heat fluxes in excess of 200 W/cm2 were obtained and thermal resistance values of less than 0.7 °C/W were measured. Although the computer model slightly underestimated the experimentally determined transport limit for one of the wicking configurations, the remaining transport predictions were consistently within 8 percent of the experimental values.


2011 ◽  
Vol 15 (3) ◽  
pp. 879-888 ◽  
Author(s):  
Rathinasamy Senthilkumar ◽  
Subaiah Vaidyanathan ◽  
Sivaramanb Balasubramanian

This paper discuses the use of self rewetting fluids in the heat pipe. In conventional heat pipes, the working fluid used has a negative surface-tension gradient with temperature. It is an unfavourable one and it decreases the heat transport between the evaporator section and the condenser section. Self rewetting fluids are dilute aqueous alcoholic solutions which have the number of carbon atoms more than four. Unlike other common liquids, self-rewetting fluids have the property that the surface tension increases with temperature up to a certain limit. The experiments are conducted to improve the heat-transport capability and thermal efficiency of capillary assisted heat pipes with the self rewetting fluids like aqueous solutions of n-Butanol and n-Pentanol and its performance is compared with that of pure water. The n-Butanol and n-Pentanol are added to the pure water at a concentration of 0.001moles/lit to prepare the self rewetting fluids. The heat pipes are made up of copper container with a two-layered stainless steel wick consisting of mesh wrapped screen. The experimental results show that the maximum heat transport of the heat pipe is enhanced and the thermal resistances are considerably decreased than the traditional heat pipes filled with water. The fluids used exhibit an anomalous increase in the surface tension with increasing temperature.


Heat pipes are deliberated to be effective heat dissipation devices compared to other types of heat sinks due to their high effective thermal conductivity. Because of the flexibility in the design and layout of heat pipe turns along the heat source, pulsating heat pipes have gained popularity. One of the parameters that have the mainimpact on the presentation of CLPHP is the thermo physical properties of the working fluid. The properties of the working fluid affect the temperature difference between the evaporator and the condenser which in turn affect the thermal resistance of the CLPHP. In this connection, the influence of different working fluids is experimentally investigated on a two loop CLPHP, varying the evaporator heat flux. Pure fluids, viz., water, acetone, benzene and binary mixture, viz., Acetone-water and Benzene-water are utilized on working fluids. The heat input considered at the evaporator is 32W, 48W and 60W. The filling ratio is kept as 50 %. The results show that among the working fluids considered for the study, acetone exhibits least thermal resistance among the pure fluids at all heat fluxes considered in the analysis, while Acetone-water mixture has exhibited least thermal resistance among the water based mixtures.


Author(s):  
Weilin Zhao ◽  
Jun Xu ◽  
Jinkai Li

Abstract The graphene oxide-deionized water (GO-DW) and graphene oxide-ethylence glycol (GO-EG) nanofluids were synthesized. The better suspension of nanofluids was achieved. The thermal conductivity of both nanofluids was analyzed. It indicates that GO nanoparticles can strengthen the thermal conductivity of DW base fluids by 22.6%–61.7% and EG base fluids by 15.3%–32.8%. Four copper heat pipes charged with GO-DW and GO-EG nanofluids as well as DW and EG base fluids were experimentally researched, it is discovered that the addition of GO nonoparticles in heat pipe can elevate the condenser wall temperature and reduce the temperature difference. Future analysis finds that, with respect to DW and EG fluids heat pipe, the thermal resistances of GO-DW and GO-EG nanofluids heat pipe are respectively decreased 42.6–52.4% and 31.9%–38.4% for air cooling, and 15.5–16.7% and 11.5%–18.9% for water cooling at condenser section. Besides, the wick structure of GO-DW nanofluids heat pipe was examined by Scanning Electron Microscope, and the effective thermal conductivity of fluid-wick combination was evaluated. The outcomes demonstrate that the evaporator wick surface contains about 0375–1.24μm coating film of GO nanoparticles. Assumed the coating film is 0.75μm, the effective thermal conductivity of fluid-wick combination is respectively enhanced by 66.92 % for GO-DW nonofluids heat pipe and 37.32% for GO-EG nonofluids heat pipe at 70 °C.


1991 ◽  
Vol 113 (4) ◽  
pp. 995-1002 ◽  
Author(s):  
Y. Cao ◽  
A. Faghri

A numerical analysis of transient heat pipe performance including nonconventional heat pipes with nonuniform heat distributions is presented. A body-fitted grid system was applied to a three-dimensional wall and wick model, which was coupled with a transient compressible quasi-one-dimensional vapor flow model. The numerical results were first compared with experimental data from cylindrical heat pipes with good agreement. Numerical calculations were then made for a leading edge heat pipe with localized high heat fluxes. Performance characteristics different from conventional heat pipes are illustrated and some operating limits concerning heat pipe design are discussed.


Author(s):  
Kathryn Nikkanen ◽  
Christian G. Lu ◽  
Masahiro Kawaji

Improved miniaturization and a trend towards increasingly dense and compact architectures have led to unmanageably high heat fluxes in electronic components. In order to keep temperatures at operational levels more advanced cooling solutions are being required that go beyond the solid heat sink and forced convection. Pulsating heat pipes made out of multi port extrusion tubing are a proposed solution. Typically, gas-liquid slug flow occurs in the serpentine channel imbedded in the pulsating heat pipe. Vapour is produced in the heated section and condensed in the cooled section located at opposite ends of the heat pipe. In this work, experiments were conducted on four Multi-Port Extruded (MPE) aluminum tubing heat pipes with different internal structures: rectangular channel looped, rectangular channel unlooped, triangular channel looped, and triangular channel unlooped. The effect of changing the working fluid (ethanol or de-ionized water), fill ratio, and orientation were measured and compared for the different heat pipes. It was found that most of the heat pipes performed better with ethanol than de-ionized water. Only the looped rectangular channel heat pipe performed satisfactorily with de-ionized water, which is attributed both to the larger channel size and the looped architecture. The unlooped heat pipes performed best at the lowest fill ratios (10%) while the looped heat pipes showed their best performances between 30 and 50% with marked decrease at the lower and higher fill ratios. Both looped heat pipes performed poorly in horizontal orientation as compared to vertical, however, the unlooped heat pipes performed quite well in both orientations. This may be more the effect of the fill ratio on horizontal performance as literature suggests that horizontal orientation requires a lower fill ratio to perform satisfactorily.


2014 ◽  
Vol 490-491 ◽  
pp. 251-255 ◽  
Author(s):  
Yu Ying Gong ◽  
Zong Ming Liu ◽  
Wei Lin Zhao

Three heat pipes with nanofluids of Al2O3-water, CuO-water and SiO2-water were tested experimentally. The temperature distribution of their start-up process was analysed, and compared the heat pipe with water. The results showed that the start-up way of heat pipe filled with nanofluids was coincident, the heat pipe filled with nanofluids showed a lower start-up temperature and a shorter start-up time in evaporator section compared with heat pipe filled with water, the temperature drop between evaporator section and condenser section for the heat pipe filled with nanofluids were reduced by 2-5°C than that of the heat pipe filled with water. The effect of the length of the heating section of heat pipe filled with nanofluids on the start-up process was little.


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