Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue

1990 ◽  
Vol 112 (2) ◽  
pp. 115-122 ◽  
Author(s):  
J. R. Wilcox ◽  
R. Subrahmanyan ◽  
Che-Yu Li
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Failure Criterion ◽  
Damage Accumulation ◽  
Damage Parameter ◽  
Time Profile ◽  
Joint Area ◽  
Fatigue Damage Accumulation ◽  
Deformation Properties ◽  
Solder Joint Fatigue

The ramifications of the definition of failure on solder joint fatigue life are discussed in terms of two considerations: (1) the dependence of the measured damage parameter (load drop or resistance increase) on the solder joint area and (2) the time profile of solder joint area. The latter is influenced by the applied displacement profile, the assembly stiffness, the deformation properties of the solder joint, and the dependence of rate of fatigue damage accumulation on its driving force. Experimental data are presented to illustrate the influence of these considerations on failure criterion. An integral methodology is used for the description of damage accumulation. Representative simulations are performed that demonstrate failure criterion effects on apparent fatigue life. Isothermal mechanical displacement controlled cyclic loading is emphasized. The principles presented may also be applied to thermal cycling of solder interconnects.

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

2016 ◽  
Vol 138 (2) ◽  
Author(s):  
Sa'd Hamasha ◽  
Peter Borgesen
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Strain Rate ◽  
Solder Joints ◽  
Constitutive Relations ◽  
Snagcu Solder ◽  
Shear Fatigue ◽  
Deformation Properties ◽  
Service Conditions ◽  
Solder Joint Fatigue

The behavior of lead-free solder alloys under realistic service conditions is still not well understood. Life prediction of solder joints relies on conducting accelerated tests and extrapolating results to service conditions. This can be very misleading without proper constitutive relations and without understanding the effects of cycling parameter variations common under realistic service conditions. It has been shown that the fatigue life depends on the inelastic work accumulation, independently of cycling-induced material property variations, which explains the breakdown of damage accumulation rules and allows the development of a modified Miner's rule. This paper discusses the interacting effects of strain rate and amplitude variations on solder joint fatigue life. Individual SnAgCu solder joints with two different Ag contents (SAC305 and SAC105) were tested in low cycling shear fatigue under single and varying amplitudes with different strain rates. Such a shear fatigue experiment allows the measurement of work accumulation and the evolution of solder deformation properties during cycling. The results showed that cycling with a lower strain rate at fixed amplitude causes more damage per cycle. Alternating between mild amplitude at a high strain rate and harsh amplitude at a low strain rate leads to ongoing increases in the rate of damage at the mild amplitude and thus relatively rapid failure. In comparing SAC305 with SAC105, the effect of strain rate on both alloys is almost the same, and SAC305 is still more fatigue resistant than SAC105 in varying amplitude cycling with any strain rate.

Reliability of SAC 105 and SAC1205N under Drop Tests

2016 ◽  
Vol 2016 (1) ◽  
pp. 000106-000110
Author(s):  
Jia-Shen Lan ◽  
Stuwart Fan ◽  
Louie Huang ◽  
Mei-Ling Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Simulation Model ◽  
Drop Test ◽  
Test Execution ◽  
Fine Pitch ◽  
Mechanical Shocks ◽  
Drop Tests ◽  
Solder Joint Fatigue ◽  
Package Reliability

Abstract In this paper, the solder joint failure and the solder joint fatigue life in the Thin-profile Fine-pitch Ball Grid Array (TFBGA) Package was investigated by performing the drop test, and implementing a simulation model. Owing to the need to meet the increasing demands for functionality, microelectronic package reliability can be compromised and has become the key issue when executing drop tests. During impact in drop test, the deformation of PCB due to bending and mechanical shocks can cause solder joint crack. While this is a well-known issue, observing the solder joint responses during the test execution can be a challenge. Therefore, in this work, a simulation model approach has been developed to investigate the stress and strain of the solder joint during the drop test. In this research, the JEDEC Condition B drop test was simulated, characterized by 1500G peak acceleration and 0.5 ms duration. The drop test simulation model was successful in predicting the solder joint fatigue life with different solder joint materials, such as SAC105 and SAC1205N, while also facilitating result comparison to identify the most optimal structure.

scholarly journals Fatigue Damage Accumulation Modeling of Metals Alloys under High Amplitude Loading at Elevated Temperatures

Metals ◽  
2018 ◽  
Vol 8 (12) ◽  
pp. 1030 ◽  
Author(s):  
Jarosław Szusta ◽  
Andrzej Seweryn
Keyword(s):  
Fatigue Life ◽  
Fatigue Damage ◽  
Damage Accumulation ◽  
Elevated Temperatures ◽  
Low Cycle Fatigue ◽  
High Amplitude ◽  
Metal Alloys ◽  
Damage State ◽  
State Variable ◽  
Fatigue Damage Accumulation

This article presents an approach related to the modeling of the fatigue life of constructional metal alloys working under elevated temperature conditions and in the high-amplitude load range. The article reviews the fatigue damage accumulation criteria that makes it possible to determine the number of loading cycles until damage occurs. Results of experimental tests conducted on various technical metal alloys made it possible to develop a fatigue damage accumulation model for the LCF (Low Cycle Fatigue) range. In modeling, the material’s damage state variable was defined, and the damage accumulation law was formulated incrementally so as to enable the analysis of the influence of loading history on the material’s fatigue life. In the proposed model, the increment of the damage state variable was made dependent on the increment of plastic strain, on the tensile stress value in the sample, and also on the actual value of the damage state variable. The model was verified on the basis of data obtained from experiments in the field of uniaxial and multiaxial loads. Samples made of EN AW 2024T3 aluminum alloy were used for this purpose.

Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation

1997 ◽  
Vol 119 (3) ◽  
pp. 171-176 ◽  
Author(s):  
T. E. Wong ◽  
L. A. Kachatorian ◽  
B. D. Tierney
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Sensitivity Evaluation ◽  
Minimum Number ◽  
Parametric Studies ◽  
Solder Joint Fatigue ◽  
The Impact ◽  
Joint Assembly

A Taguchi design of experiment approach was applied to thermostructural analyses of a gull-wing solder joint assembly. This approach uses a minimum number of finite element analyses to evaluate the impact of solder joint assembly parameters on fatigue life of the assembly. To avoid costly complex modeling efforts for each parametric case study, a commercially available program, MSC/PATRAN’s PATRAN Command Language, was used to automatically create finite element models of a two-dimensional gull-wing solder joint assembly based on nine parameters. Modeling time was dramatically reduced from days to a few minutes for each detailed lead/solder model. Two sets of parametric studies were conducted to evaluate the impact of variation of the six parameters. The analysis results indicate that lead ankle radius is the most critical parameter affecting solder joint total fatigue life, and lead and minimum solder thicknesses are the next most critical ones. Therefore, to effectively improve the solder joint fatigue life margin, it is recommended to: (1) increase the minimum solder thickness; (2) use thinner lead; and (3) use a larger lead ankle radius, even though this may require reducing lead shin length. By implementing only the last recommendation to modify the current solder joint assembly, the fatigue life margin in this design could, in general, be improved by 27 percent or more.

Creep Behavior of a Solder Paste With Bi Addition

2017 ◽  
Author(s):  
Pedro E. Ribeiro ◽  
Delfim F. Soares ◽  
Maria F. Cerqueira ◽  
Senhorinha F. Teixeira ◽  
Daniel A. Barros ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Mechanical Performance ◽  
Creep Behaviour ◽  
Real Life ◽  
Production Costs ◽  
Solder Paste ◽  
Creep Tests ◽  
Pcb Assembly ◽  
Solder Joint Fatigue

A common failure mode of electronic PCB’s is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. Although some experiments show that newer lead-free tin-silver-copper (Sn-Ag-Cu, or SAC) solders perform better than the older SnPb ones, with today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are growing, leading to limited fatigue life of the products. As fatigue life decreases with increasing plastic strain, creep occurrence should have significant impact, especially during thermal cycles. In order to improve mechanical properties, but also as an attempt to reduce maximum reflow cycle temperatures due to component damage and production costs, various SAC solder alloying additives are being considered to use in industrial production facilities. Solder paste producers are proposing new products based on new solder paste formulations, but the real life effects on thermo-mechanical performance aren’t well known at the moment. In this paper a dynamic mechanical analyser (DMA) is used to study the influence of Bismuth (Bi) addition, up to 5 wt %, on SAC405 solder paste, in terms of creep behaviour. Creep tests were made on three-point-bending configuration, isothermally at 30 °C, 50 °C and 75 °C, and three different stresses of 3, 5 and 9 MPa. The results shown not only a significant Bi concentration influence on creep behaviour but also a noticeable temperature dependence.

Influence of the Applied Load on the Creep Behaviour of Tin-Silver-Copper Solder

2019 ◽  
Author(s):  
Delfim F. Soares ◽  
Pedro E. Ribeiro ◽  
Pauline Capela ◽  
Daniel A. Barros ◽  
Maria F. Cerqueira ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Applied Load ◽  
Printed Circuit Boards ◽  
Creep Behaviour ◽  
Creep Tests ◽  
Dislocation Glide ◽  
Pcb Assembly ◽  
Creep Mechanisms ◽  
Solder Joint Fatigue

Abstract During the life cycle of an electronic printed circuit boards (PCBs), the cold solder joints formation between the component and PCB are a failure mode that happen commonly. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are growing, leading to limited fatigue life of the products. In this way, once as fatigue life decreases with increasing plastic strain, it is important to study creep occurrence, especially during thermal cycles. In this work, a dynamic mechanical analyser (DMA) was used to study the influence of different applied load and temperature on the creep behaviour of the solder during a sequence of cycles. For these tests, different SAC405 alloy samples were produced, all in the same processing conditions. Creep tests were made on three-point-bending clamp configuration, isothermally at 303, 323 and 348 K, under three separate applied load of 3, 5 and 9 MPa. The results show that creep rate has an important decrease from the 1st to the following applied creep cycles. This behaviour occurs for all the tested loads and temperatures. Results, also, show that the main creep mechanisms changes, from a diffusion base type, for low load and different temperatures, to a dislocation glide-climb type for an applied load of 9 MPa and temperatures from 303 to 348 K. Experimental determined n exponent for the tested conditions allows the correlation between creep mechanisms and experimental parameters (applied load and temperature).

scholarly journals Influence of the Microstructure on the Creep Behaviour of Tin-Silver-Copper Solder

2018 ◽  
Author(s):  
Pedro E. Ribeiro ◽  
Delfim F. Soares ◽  
Maria F. Cerqueira ◽  
Senhorinha F. Teixeira ◽  
Daniel A. Barros ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Cooling Rate ◽  
Printed Circuit Boards ◽  
Creep Behaviour ◽  
Creep Tests ◽  
Cooling Rates ◽  
Pcb Assembly ◽  
Solder Joint Fatigue ◽  
Tin Silver Copper

A common failure mode of electronic printed circuit boards (PCB’s) is the appearance of cold solder joints between the component and PCB, during product life. This phenomenon is related to solder joint fatigue and is attributed mainly to the mismatch of the coefficients of thermal expansion (CTE) of component-solder-PCB assembly. With today’s solder joint thickness decreasing and increasing working temperatures, among others, the stresses and strains due to temperature changes are growing, leading to limited fatigue life of the products. As fatigue life decreases with increasing plastic strain, creep occurrence should have significant impact, especially during thermal cycles and, thus, should be studied. Through the cooling phase, on the production of PCB assembly’s by the reflow technology, the hoven atmosphere temperature is adjusted in order to control the cooling rate. Narrow criteria is used so as to control the inter-metallic compounds (IMC) thickness, PCB assembly distortion and defects due to thermal shock. The cooling rate also affects solder microstructure, which has direct impact on creep behaviour and, thus, on the soldered joint reliability. In this paper, a dynamic mechanical analyser (DMA) is used to study the influence of the solder cooling rate on its creep behaviour. SAC405 samples with two distinct cooling rates were produced: inside a hoven cooling and by water quenching. Creep tests were made on three-point-bending clamp configuration, isothermally at 25 °C, 50 °C and 75 °C and under three separate levels of stress, 3, 5 and 9 MPa. The results show that creep behaviour has a noticeable cooling rate dependence. It was also noticed that creep propensity is exacerbated by the temperature at which stresses are applied, especially for the slower cooling rates. Creep mechanisms were related to the solder microstructural constituents, namely by the amount of phases ant their morphology.

Application of Artificial Neural Network for Fatigue Life Prediction

2005 ◽  
Vol 297-300 ◽  
pp. 96-101
Author(s):  
Ishak Abdul Azid ◽  
Lee Kor Oon ◽  
Ong Kang Eu ◽  
K.N. Seetharamu ◽  
Ghulam Abdul Quadir
Keyword(s):  
Neural Network ◽  
Finite Element ◽  
Fatigue Life ◽  
Solder Joint ◽  
Finite Element Simulation ◽  
Life Prediction ◽  
Fatigue Life Prediction ◽  
Element Simulation ◽  
Parametric Studies ◽  
Solder Joint Fatigue

An extensively published and correlated solder joint fatigue life prediction methodology is incorporated by which finite element simulation results are translated into estimated cycles to failure. This study discusses the analysis methodologies as implemented in the ANSYSTM finite element simulation software tool. Finite element models are used to study the effect of temperature cycles on the solder joints of a flip chip ball grid array package. Through finite element simulation, the plastic work or the strain-energy density of the solder joints are determined. Using an established methodology, the plastic work obtained through simulation is translated into solder joint fatigue life [1]. The corresponding results for the solder joint fatigue life are used for parametric studies. Artificial Neural Network (ANN) has been used to consolidate the parametric studies.

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