Multiscale Shock Heating Analysis of a Granular Explosive

2005 ◽  
Vol 72 (4) ◽  
pp. 538-552 ◽  
Author(s):  
Keith A. Gonthier ◽  
Venugopal Jogi
Keyword(s):  
Phase Change ◽  
Hot Spots ◽  
Thermal Conduction ◽  
Hot Spot ◽  
Energy Localization ◽  
Two Phase ◽  
Shock Compaction ◽  
Compaction Zone ◽  
Contact Surfaces ◽  
Compaction Waves

A multiscale model is formulated and used to characterize the duration and amplitude of temperature peaks (i.e., hot spots) at intergranular contact surfaces generated by shock compaction of the granular high explosive HMX (octahydro-1,3,5,7-tetranitro-1,3,5,7-tetrazocine). The model tracks the evolution of both bulk variables and localized temperature subject to a consistent thermal energy localization strategy that accounts for inelastic and compressive heating, phase change, and thermal conduction at the grain scale (grain size ∼50μm). Steady subsonic compaction waves having a dispersed two-wave structure are predicted for mild impact of dense HMX (porosity ∼19%), and steady supersonic compaction waves having a discontinuous solid shock followed by a thin compaction zone are predicted for stronger impact. Short duration hot spots having peak temperatures in excess of 900K are predicted near intergranular contact surfaces for impact speeds as low as 100m∕s; these hot spots are sufficient to induce sustained combustion as determined by a two-phase thermal explosion theory. Thermal conduction and phase change significantly affect hot-spot formation for low impact speeds (∼100m∕s), whereas bulk inelastic heating dominates the thermal response at higher speeds resulting in longer duration hot spots. Compressive grain heating is shown to be largely inconsequential for the range of impact speeds considered in this work (100⩽up⩽1000m∕s). Predictions for the variation in inelastic strain, pressure, and porosity through the compaction zone are also shown to qualitatively agree with the results of detailed mesoscale simulations.

Local Measurements of Flow Boiling Heat Transfer on Hot Spots in 3D Compatible Radial Microchannels

2015 ◽  
Author(s):  
Fanghao Yang ◽  
Mark Schultz ◽  
Pritish Parida ◽  
Evan Colgan ◽  
Robert Polastre ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Power Density ◽  
High Power ◽  
Hot Spots ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Hot Spot ◽  
Uniform Heat Flux ◽  
Two Phase ◽  
Flow Boiling Heat Transfer

Hot spots and temperature non-uniformities are critical thermal characteristics of current high power electronics and future three dimensional (3D) integrated circuits (ICs). Experimental investigation to understand flow boiling heat transfer on hot spots is required for any two-phase cooling configuration targeting these applications. This work investigates hot spot cooling utilizing novel radial microchannels with embedded pin arrays representing through-silicon-via (TSV) interconnects. Inlet orifices were designed to distribute flow in radial channels in a manner that supplies appropriate amounts of coolant to high-power-density cores. Specially designed test vehicles and systems were used to produce non-uniform heat flux profiles with nominally 20 W/cm2 background heating, 200 W/cm2 core heating and up to 21 W/mm2 hot spot (0.2 mm × 0.2 mm) heating to mimic a stackable eight core processor die (20 mm × 20 mm) with two hot spots on each core. The temperatures associated with flow boiling heat transfer at the hot spots were locally measured by resistance temperature detectors (RTDs) integrated between the heat source and sink. At nominal pressure and flow conditions, use of R1234ze in these devices resulted in a maximum hot spot temperature (Ths) of under 63 °C and average Ths of 57 °C at a hot spot power density of 21 W/mm2. A semi-empirical model was used to calculate the equivalent heat transfer rate around the hot spots which can provide a baseline for future studies on local thermal management of hot spots.

Thermal Management of Ultra Intense Hot Spots With Two-Phase Multi-Microchannels and Embedded Thermoelectric Cooling

2013 ◽  
Author(s):  
Jackson B. Marcinichen ◽  
Brian P. d’Entremont ◽  
John R. Thome ◽  
Gary Bulman ◽  
Jay Lewis ◽  
...  
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Electrical Current ◽  
Heat Fluxes ◽  
Junction Temperature ◽  
Two Phase ◽  
Flow Through ◽  
Microchannel Cooling ◽  
On Chip ◽  
A Current

This study concerns cooling of electronic components of intense background heat flux with one ultra intense hot spot (e.g. 1000 Wcm−2 on a footprint of 1 cm × 1 cm with 5000 Wcm−2 applied to a 0.02 cm × 0.02 cm region at the center). To manage these extreme heat fluxes and consequently surpass the thermal-hydrodynamic challenges and design paradigms, for example as specified in a recent DARPA request for proposals (Intrachip/Interchip Enhanced Cooling Fundamentals - ICECool Fundamentals [1]), on-chip two-phase multi-microchannel cooling integrated with a superlattice (SL) thin-film thermoeletric cooling (TEC) technology was investigated via computer simulations. The simulations showed that increasing TEC electrical current results in greater enhancement of heat flow through the TEC, but at high currents this benefit is offset by a net addition of heat to the system, which must also be evacuated by the microchannels. When optimized, a minimum peak junction temperature of about 86 °C for a current of about 8 A was found, which represented a reduction of about 4 °C from a maximum allowed 90 °C at the ultra-intense hot-spot, thus potentially significantly capable of exceeding the DARPA [1] requirement, due to the embedded SL TEC within the microevaporator (ME) structure.

Thermal Management of On-Chip Hot Spot

2012 ◽  
Vol 134 (5) ◽  
Author(s):  
Avram Bar-Cohen ◽  
Peng Wang
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Hot Spots ◽  
Hot Spot ◽  
High Heat ◽  
High Heat Flux ◽  
Switching Speed ◽  
Two Phase ◽  
Advantages And Disadvantages ◽  
On Chip

The rapid emergence of nanoelectronics, with the consequent rise in transistor density and switching speed, has led to a steep increase in microprocessor chip heat flux and growing concern over the emergence of on-chip hot spots. The application of on-chip high flux cooling techniques is today a primary driver for innovation in the electronics industry. In this paper, the physical phenomena underpinning the most promising on-chip thermal management approaches for hot spot remediation, along with basic modeling equations and typical results are described. Attention is devoted to thermoelectric micro-coolers and two-phase microgap coolers. The advantages and disadvantages of these on-chip cooling solutions for high heat flux hot spots are evaluated and compared.

Shock consolidation of Ni-Ti alloy powder

1986 ◽  
Vol 44 ◽  
pp. 430-431
Author(s):  
Naresh N. Thadhani ◽  
Thad Vreeland ◽  
Thomas J. Ahrens
Keyword(s):  
Alloy Powder ◽  
Amorphous Material ◽  
Ti Alloy ◽  
Two Phase ◽  
Near Surface ◽  
Optical Micrograph ◽  
Shock Compaction ◽  
Powder Particles ◽  
Ti Powder ◽  
Rapidly Solidified

A spherically-shaped, microcrystalline Ni-Ti alloy powder having fairly nonhomogeneous particle size distribution and chemical composition was consolidated with shock input energy of 316 kJ/kg. In the process of consolidation, shock energy is preferentially input at particle surfaces, resulting in melting of near-surface material and interparticle welding. The Ni-Ti powder particles were 2-60 μm in diameter (Fig. 1). About 30-40% of the powder particles were Ni-65wt% and balance were Ni-45wt%Ti (estimated by EMPA).Upon shock compaction, the two phase Ni-Ti powder particles were bonded together by the interparticle melt which rapidly solidified, usually to amorphous material. Fig. 2 is an optical micrograph (in plane of shock) of the consolidated Ni-Ti alloy powder, showing the particles with different etching contrast.

Spatial Hotspot Analysis of Bucharest’s Urban Heat Island (UHI) Using Modis Data

2018 ◽  
Vol 18 (1) ◽  
pp. 14-22 ◽  
Author(s):  
Georgiana Grigoraș ◽  
Bogdan Urițescu
Keyword(s):  
Surface Temperature ◽  
Air Temperature ◽  
Land Surface Temperature ◽  
Hot Spots ◽  
Land Surface ◽  
Hot Spot ◽  
Monitoring Network ◽  
Residential Areas ◽  
Hotspot Analysis ◽  
The City

Abstract The aim of the study is to find the relationship between the land surface temperature and air temperature and to determine the hot spots in the urban area of Bucharest, the capital of Romania. The analysis was based on images from both moderate-resolution imaging spectroradiometer (MODIS), located on both Terra and Aqua platforms, as well as on data recorded by the four automatic weather stations existing in the endowment of The National Air Quality Monitoring Network, from the summer of 2017. Correlation coefficients between land surface temperature and air temperature were higher at night (0.8-0.87) and slightly lower during the day (0.71-0.77). After the validation of satellite data with in-situ temperature measurements, the hot spots in the metropolitan area of Bucharest were identified using Getis-Ord spatial statistics analysis. It has been achieved that the “very hot” areas are grouped in the center of the city and along the main traffic streets and dense residential areas. During the day the "very hot spots” represent 33.2% of the city's surface, and during the night 31.6%. The area where the mentioned spots persist, falls into the "very hot spot" category both day and night, it represents 27.1% of the city’s surface and it is mainly represented by the city center.

The family Orthotrichaceae (Bryophyta) in flora of Russia: results of revision and biogeographical review

2018 ◽  
Vol 52 (2) ◽  
pp. 519-534 ◽  
Author(s):  
V. E. Fedosov
Keyword(s):  
Hot Spots ◽  
Latitudinal Gradient ◽  
Hot Spot ◽  
Spatial Differentiation ◽  
Taxonomic Composition ◽  
Undescribed Species ◽  
Longitudinal Gradient ◽  
Biogeographic Pattern ◽  
The Family ◽  
North Pacific Region

Recent studies on Orthotrichoid mosses in Russia are summarized genus by genus. Orthotrichum furcatum Otnyukova is synonymized with Nyholmiella obtusifolia. Orthotrichum vittii is excluded from the Russian moss flora. Description of O. dagestanicum is amended. Fifty four currently recognized species from 9 genera of the Orthotrichaceae are presently known to occur in Russia; list of species with common synonyms and brief review of distribution in Russia is presented. Numerous problematic specimens with unresolved taxonomy were omitted for future. Revealed taxonomical inconsistencies in the genera Zygodon, Ulota, Lewinskya, Nyholmiella, Orthotrichum are briefly discussed. Main regularities of spatial differentiation of the family Orthotrichaceae in Russia are considered. Recently presented novelties contribute to the certain biogeographic pattern, indicating three different centers of diversity of the family, changing along longitudinal gradient. Unlike European one, continental Asian diversity of Orthotrichaceae is still poorly known, the Siberian specimens which were previously referred to European species in most cases were found to represent other, poorly known or undescribed species. North Pacific Region houses peculiar and poorly understood hot spot of diversity of Orthotrichoid mosses. Thus, these hot spots are obligatory to be sampled in course of revisions of particular groups, since they likely comprise under-recorded cryptic- or semi-cryptic species. Latitudinal gradient also contributes to the spatial differentiation of the revealed taxonomic composition of Orthotrichaceae.

scholarly journals Numerical Study of a Cooling System Using Phase Change of a Refrigerant in a Thermosyphon

Energies ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3634
Author(s):  
Grzegorz Czerwiński ◽  
Jerzy Wołoszyn
Keyword(s):  
Mass Transfer ◽  
Phase Change ◽  
Heat Dissipation ◽  
Cooling System ◽  
Numerical Study ◽  
Relaxation Parameter ◽  
Phase Changes ◽  
Transfer Time ◽  
Two Phase ◽  
Time Relaxation

With the increasing trend toward the miniaturization of electronic devices, the issue of heat dissipation becomes essential. The use of phase changes in a two-phase closed thermosyphon (TPCT) enables a significant reduction in the heat generated even at high temperatures. In this paper, we propose a modification of the evaporation–condensation model implemented in ANSYS Fluent. The modification was to manipulate the value of the mass transfer time relaxation parameter for evaporation and condensation. The developed model in the form of a UDF script allowed the introduction of additional source equations, and the obtained solution is compared with the results available in the literature. The variable value of the mass transfer time relaxation parameter during condensation rc depending on the density of the liquid and vapour phase was taken into account in the calculations. However, compared to previous numerical studies, more accurate modelling of the phase change phenomenon of the medium in the thermosyphon was possible by adopting a mass transfer time relaxation parameter during evaporation re = 1. The assumption of ten-fold higher values resulted in overestimated temperature values in all sections of the thermosyphon. Hence, the coefficient re should be selected individually depending on the case under study. A too large value may cause difficulties in obtaining the convergence of solutions, which, in the case of numerical grids with many elements (especially three-dimensional), significantly increases the computation time.

scholarly journals Family Practices and Temporality at Breakfast: Hot Spots, Convenience and Care

Sociology ◽  
2021 ◽  
pp. 003803852110155
Author(s):  
Daniela Pirani ◽  
Vicki Harman ◽  
Benedetta Cappellini
Keyword(s):  
Hot Spots ◽  
Hot Spot ◽  
Family Meals ◽  
Personal Integrity ◽  
Structured Interviews ◽  
Time Saving ◽  
Family Time ◽  
Dominant Feature ◽  
Family Practices ◽  
Cold Spots

Drawing on 34 semi-structured interviews, this study investigates the temporality of family practices taking place in the hot spot. It does so by looking at how breakfast is inserted in the economy of family time in Italy. Our data show that breakfast, contrary to other meals, allows the adoption of more individualised and asynchronous practices, hinged on the consumption of convenience products. These time-saving strategies are normalised as part of doing family. Although the existing literature suggests that convenience and care are in opposition, and consumers of convenience products can experience anxiety and a lack of personal integrity, such features were not a dominant feature of our participants’ accounts. These findings suggest that the dichotomies of hot/cold spots and care/convenience are not always experienced in opposition when embedded within family practices. Hence, this study furthers understandings of family meals, temporality and the distinction between hot and cold spots.

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