Specimen Design for Mixed Mode Interfacial Fracture Properties Measurement in Electronic Packages

1999 ◽  
Vol 122 (1) ◽  
pp. 67-72 ◽  
Author(s):  
Dickson T. S. Yeung ◽  
David C. C. Lam ◽  
Matthew M. F. Yuen
Keyword(s):  
Mixed Mode ◽  
Interfacial Fracture ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Cracked Beam ◽  
Fracture Properties ◽  
Four Point Bending ◽  
Data Yield ◽  
Bending Loading

A four-layer center cracked beam (CCB) under four point bending loading is developed for the interfacial fracture properties measurement of electronics packaging materials. Determination of the mixed mode interfacial fracture properties along the second and third layers of the CCB specimen is carried out analytically. For a given test specimen, a stable test window (material combination and thickness ratio) has been identified using the analytical expression. Data yield from interfacial mixed mode fracture properties experimental measurement can be enhanced by testing within the testing window. [S1043-7398(00)00101-8]

Mixed-Mode Fracture of Hybrid Material Bonded Interfaces under Four-Point Bending

2011 ◽  
Vol 24 (2) ◽  
pp. 218-226 ◽  
Author(s):  
Pizhong Qiao ◽  
Fangliang Chen ◽  
Cole S. Hamey ◽  
Jialai Wang
Keyword(s):  
Hybrid Material ◽  
Mixed Mode ◽  
Mixed Mode Fracture ◽  
Mode Fracture ◽  
Four Point Bending

scholarly journals In-situ Mechanical Characterization of Mixed-Mode Fracture Strength of Cu/Si Interface for TSV Structures

2018 ◽  
Author(s):  
Chenglin Wu ◽  
Congjie Wei ◽  
Yanxiao Li
Keyword(s):  
Mixed Mode ◽  
Ion Beam ◽  
Interfacial Fracture ◽  
Nonlinear Material ◽  
Small Scale ◽  
Mixed Mode Fracture ◽  
Mode Fracture ◽  
Microelectronic Devices ◽  
Nanoindentation Experiment

In-situ nanoindentation experiment has been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiment in characterizing nonlinear material properties of 3D integrated microelectronic devices with through-silicon-vias (TSVs). The elastic, plastic, and interfacial fracture behavior of the copper via and matrix-via interface have been characterized using small scale specimens prepared with focused-ion-beam (FIB) and nanoindentation experiment. A brittle interfacial fracture was found at the Cu/Si interface under mixed-mode loading with a phase angle ranging from 16.7 to 83.7 degrees. The mixed-mode fracture strengths were extracted using the linear elastic fracture mechanics (LEFM) analysis and a fracture criterion was obtained by fitting the extracted data with the power-law function. The vectorial interfacial strength and toughness were found to be independent with mode-mix.

scholarly journals Design Equations for Mixed-Mode Fracture of Dental Ceramic-cement Interfaces Using the Brazil-nut-sandwich Test

2021 ◽  
pp. 1-33
Author(s):  
David Manan ◽  
Jeongho Kim ◽  
Renata Marques de Melo ◽  
Yu Zhang
Keyword(s):  
Fracture Toughness ◽  
Mixed Mode ◽  
Interfacial Fracture ◽  
Mixed Mode Fracture ◽  
Interfacial Fracture Toughness ◽  
Brazil Nut ◽  
Modulus Ratio ◽  
Dental Ceramic ◽  
Interfacial Cracks ◽  
Practical Guidance

Abstract Dental interfaces are subject to mixed-mode loading. This study provides a practical guidance for determining interfacial fracture toughness of dental ceramic systems. We address interfacial fracture of a composite resin cement sandwiched between two dental ceramic materials. Emphasis is placed on sandwich disc specimens with cracks originating from elliptical-shaped flaws near the center, for which analytical fracture mechanics methods fail to predict. The interaction integral method is used to provide accurate finite element solutions for cracks with elliptical-shaped flaws in a Brazil-nut-sandwich specimen. The developed model was first validated with existing experimental data, and then used to evaluate three most widely used dental ceramic systems: polycrystalline ceramics (zirconia), glass-ceramics (lithium disilicate), and feldspathic ceramics (porcelain). Contrary to disc specimens with ideal cracks, those with cracks emanating from elliptical-shaped flaws do not exhibit a monotonic increase in interfacial toughness. Also, interfacial fracture toughness is seen to have a direct relationship with the aspect ratio of elliptical-shaped flaws and an inverse relationship with the modulus ratio of the constituents. The presence of an elliptical-shaped flaw significantly changes the interfacial fracture behavior of sandwich structures. Semi-empirical design equations are provided for fracture toughness and stress intensity factors for interfacial cracks. The developed design equations provide a practical guidance for determining interfacial fracture toughness of selected dental ceramic material systems. Those equations take into account four critical factors: size of the elliptical flaw, modulus ratio of constituent materials, loading angle and applied load.

Delamination Risk Evaluation for Plastic Packages Based on Mixed Mode Fracture Mechanics Approaches

2002 ◽  
Vol 124 (4) ◽  
pp. 318-322 ◽  
Author(s):  
J. Auersperg ◽  
E. Kieselstein ◽  
A. Schubert ◽  
B. Michel
Keyword(s):  
Integrated Circuits ◽  
Mixed Mode ◽  
Industrial Applications ◽  
Experimental Investigations ◽  
Mixed Mode Fracture ◽  
Electronic Packages ◽  
Mechanical Reliability ◽  
Material Interfaces ◽  
Young’S Moduli ◽  
Thermal Expansion Coefficients

The growing application of advanced electronic packages under harsh environmental conditions, extreme temperatures especially in automotive applications is often a reason for damage, fatigue, and failure of entire components and systems. Consequently, their thermo-mechanical reliability is one of the most important preconditions for adopting these technologies in industrial applications. To prevent chips from being exposed to the external environment integrated circuits are usually encapsulated into packages. As a result, a microelectronic package is basically a compound of several materials with quite different Young’s moduli and thermal expansion coefficients. Additionally, various kinds of inhomogeneity, residual stresses from several steps of the manufacturing process contribute to interface delaminations, chip cracking, and fatigue of solder interconnects. This paper intends to investigate mixed mode interface delamination phenomena in micro components by using combined numerical investigations by means of nonlinear FEA and experimental investigations. It explains how experimental data were used as input for the quantitative evaluation of fatigue and fracture of microcomponents. Both numerical and experimental investigations provide the basis for understanding and evaluating failure mechanisms especially in solder joints, as well as several polymer material interfaces, and should support further applications for raising the thermo-mechanical reliability of advanced electronic packages.

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