A Scalable Multi-Functional Thermal Test Chip Family: Design and Evaluation

2001 ◽  
Vol 123 (4) ◽  
pp. 323-330 ◽  
Author(s):  
Zs. Benedek ◽  
B. Courtois ◽  
G. Farkas ◽  
E. Kolla´r ◽  
S. Mir ◽  
...  
Keyword(s):  
Temperature Sensor ◽  
Thermal Characterization ◽  
Thermal Engineering ◽  
Test Chip ◽  
Basic Cell ◽  
Thermal Test ◽  
Wide Range ◽  
The Family ◽  
Test Chips

Nowadays, thermal characterization of IC packages and packaging technologies is becoming a key task in thermal engineering. To support this by measurements, we developed a family of thermal test chips that allow a wide range of possible applications. Our chips are based on the same basic cell that is mainly covered by dissipating resistors and also contains a temperature sensor. These basic cells are organized into arrays of different size. The arrays are designed such that further “super arrays” can also be built for tiling up larger package cavities. The first members of the family, TMC9 and TMC81, have been manufactured. Our measurements show that the goals aimed at the design have been achieved.

Characterization and Benchmarking of the Low Intertier Thermal Resistance of Three-Dimensional Hybrid Cu/Dielectric Wafer-to-Wafer Bonding

2017 ◽  
Vol 139 (1) ◽  
Author(s):  
Herman Oprins ◽  
Vladimir Cherman ◽  
Tomas Webers ◽  
Abdellah Salahouelhadj ◽  
Soon-Wook Kim ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
Wafer Bonding ◽  
Three Dimensional ◽  
Measurement Data ◽  
Thermal Characterization ◽  
Test Chip ◽  
Thermal Test ◽  
Wafer Pair ◽  
Transient Measurement

In this paper, we present the design of a passive test chip with thermal test structures in the Metal 1 layer of the back-end of line (BEOL) for the experimental thermal characterization of the intertier thermal resistance of wafer-pairs fabricated by three-dimensional (3D) hybrid Cu/dielectric wafer-to-wafer (W2W) bonding. The thermal test structures include heater elements and temperature sensors. The steady-state or transient measurement data are combined with a modeling study to extract the thermal resistance of the bonded interface for the fabricated bonded wafer pair. The extracted thermal resistance of the die–die interface created by hybrid wafer-to-wafer bonding is compared to literature data for die-to-die (D2D) or die-to-wafer (D2W) stacking with microbumps. The low thermal resistance of the thin bonded dielectric interface indicates that hybrid Cu/dielectric bonding is a promising technology to create 3D chip stacks with a low thermal die-to-die resistance.

Flip Chip Thermal Test Vehicle Design: Requirements, Evaluations, and Validations

2003 ◽  
Author(s):  
Teck Joo Goh ◽  
Chia-Pin Chiu ◽  
K. N. Seetharamu ◽  
G. A. Quadir ◽  
Z. A. Zainal
Keyword(s):  
Flip Chip ◽  
Printed Circuit Board ◽  
Thermal Characterization ◽  
Circuit Board ◽  
Vehicle Design ◽  
Test Chip ◽  
Test Vehicle ◽  
Design Processes ◽  
Thermal Test ◽  
Design Requirements

This paper reviews the design of a flip chip thermal test vehicle. Design requirements for different applications such as thermal characterization, assembly process optimization, and product burn-in simulation are outlined. The design processes of different thermal test chip structures including the temperature sensor and passive heaters are described in detail. In addition, the design of fireball heater, a novel test chip structure used for evaluating the effectiveness of heat spreading of advanced thermal solutions, is also illustrated. The design considerations and processes of the package substrate and printed circuit board with special emphasis on the physical routing of the thermal test chip structures are described. These design processes are supported with thermal data from various finite-element analyses (FEA) carried out to evaluate the capability and limitations of thermal test vehicle design. Design optimization as the outcome of these analyses is also elaborated. Lastly, the validation and calibration procedures of the thermal test vehicle are presented in this paper.

Transient Thermal Characterization of a Stacked Multichip Package

2007 ◽  
Vol 4 (1) ◽  
pp. 23-30 ◽  
Author(s):  
Kimmo Kaija ◽  
Pekka Heino
Keyword(s):  
Steady State ◽  
Flip Chip ◽  
Thermal Characterization ◽  
Transient Behavior ◽  
Fe Model ◽  
Thermal Test ◽  
Transient Thermal ◽  
Temperature Responses

This paper is a case study of the thermal behavior of a stacked multichip package (SMCP). The aim is to measure temperature responses when heat is dissipated on different dice and to characterize the behavior with a compact thermal model (CTM) that accurately models steady-state and transient responses with a simple thermal RC -network. The measured package consists of three stacked layers, where each layer has one thinned flip chip attached die on an aramid interposer. The package's thermal responses were measured with thermal test dice that contain heaters and temperature sensors. The package was modeled with a finite element method (FEM) and the simulated temperature responses showed reasonable agreement with measured data. The FE model was further used to provide reference thermal data under different boundary conditions for CTM synthesis. The obtained CTM models accurately the steady-state and transient behavior and can be used as simplified model of the measured SMCP for further thermal analysis.

Anisotropic Thermal Diffusivity Measurements in Nanostructured Samples Using a Photothermoelectric Technique

2006 ◽  
Author(s):  
Youngsuk Son ◽  
Monalisa Mazumder ◽  
Theodorian Borca-Tasciuc
Keyword(s):  
Thermal Properties ◽  
Transport Properties ◽  
Thermal Transport ◽  
High Efficiency ◽  
Thermal Characterization ◽  
Thermal Anisotropy ◽  
Thermal Transport Properties ◽  
Wide Range ◽  
Photothermoelectric Technique

Knowledge of the thermal transport properties in thin films and nanostructures is critical for a wide range of applications in microelectronics, photonics, micro-electro-mechanical-systems, and thermoelectrics. The last twenty years have seen significant developments in thin-film thermal characterization techniques. Despite these advances, the characterization of the thermal transport properties in low-dimensional systems remains a challenging task. Recently, thermal properties of nanowire/nanotube nanocomposites such as thermoelectric nanowires and aligned carbon nanotubes (CNT) deposited on silicon substrates or in alumina or polymer matrix have attracted a great interest due to their possible applications in high efficiency thermoelectric energy conversion and thermal management applications. However, a major challenge for thermal characterization of nanowire/nanotube composites is their thermal anisotropy. This work presents measurements of anisotropic thermal properties using a photothermoelectric technique.

scholarly journals A New Thermophilic Ene-Reductase from the Filamentous Anoxygenic Phototrophic Bacterium Chloroflexus aggregans

2021 ◽  
Vol 9 (5) ◽  
pp. 953
Author(s):  
Marina Simona Robescu ◽  
Mattia Niero ◽  
Giovanni Loprete ◽  
Laura Cendron ◽  
Elisabetta Bergantino
Keyword(s):  
Crystal Structure ◽  
Crystal Packing ◽  
Solvent Tolerance ◽  
Class Iii ◽  
Ph Optimum ◽  
Anoxygenic Phototrophic Bacterium ◽  
Wide Range ◽  
The Family ◽  
High Yields

Aiming at expanding the biocatalytic toolbox of ene-reductase enzymes, we decided to explore photosynthetic extremophile microorganisms as unique reservoir of (new) biocatalytic activities. We selected a new thermophilic ene-reductase homologue in Chloroflexus aggregans, a peculiar filamentous bacterium. We report here on the functional and structural characterization of this new enzyme, which we called CaOYE. Produced in high yields in recombinant form, it proved to be a robust biocatalyst showing high thermostability, good solvent tolerance and a wide range of pH optimum. In a preliminary screening, CaOYE displayed a restricted substrate spectrum (with generally lower activities compared to other ene-reductases); however, given the amazing metabolic ductility and versatility of Chloroflexus aggregans, further investigations could pinpoint peculiar chemical activities. X-ray crystal structure has been determined, revealing conserved features of Class III (or thermophilic-like group) of the family of Old Yellow Enzymes: in the crystal packing, the enzyme was found to assemble as dimer even if it behaves as a monomer in solution. The description of CaOYE catalytic properties and crystal structure provides new details useful for enlarging knowledge, development and application of this class of enzymes.

scholarly journals Electro-thermal characterization of a differential temperature sensor in a 65nm CMOS IC: Applications to gain monitoring in RF amplifiers

2014 ◽  
Vol 45 (5) ◽  
pp. 484-490 ◽  
Author(s):  
Josep Altet ◽  
José Luis González ◽  
Dídac Gomez ◽  
Xavier Perpiñà ◽  
Wilfrid Claeys ◽  
...  
Keyword(s):  
Temperature Sensor ◽  
Thermal Characterization ◽  
Rf Amplifiers ◽  
Cmos Ic
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