CONSIDERATION OF CARBON NANOTUBE-BASED NANOFLUID IN THERMAL TRANSFER.

2016 ◽  
Vol 78 (8-4) ◽  
Author(s):  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl ◽  
Normah Mohd Ghazali
Keyword(s):  
Thermal Conductivity ◽  
Heat Flux ◽  
Carbon Nanotube ◽  
Aspect Ratio ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Current Trend ◽  
Heat Removal ◽  
Thermal Transfer ◽  
Low Viscosity

In the current trend towards demand for effective heat removal of high density heat flux, research into nanofluids have escalated due to the rise in thermal conductivity associated with the coolants. Are nanofluids a solution for a better thermal management? Does the application of nanofluids as coolants have limitations? This article presents a review of the thermophysical properties of carbon nanotube-water nanofluids, in particular the desired properties of low viscosity and high thermal conductivity. The effects of the concentration, temperature, aspect ratio, and surfactant on the thermal conductivity and viscosity of carbon nanotube nanofluid have been studied experimentally. These effects are thendiscussed for evaluation of the applicability of carbon nanotube-based nanofluidas a coolant for heat removal purposes.

Nanofluid in Thermal Transfer - Is it a Solution for the Future?

2016 ◽  
Vol 819 ◽  
pp. 11-15
Author(s):  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl ◽  
Normah Mohd-Ghazali
Keyword(s):  
Thermal Conductivity ◽  
Experimental Study ◽  
Carbon Nanotube ◽  
Aspect Ratio ◽  
Heat Exchangers ◽  
Saving Energy ◽  
Global Context ◽  
Thermal Transfer ◽  
The Future

In a global context of saving energy and the desire to improve heat exchangers, the use of nanofluids today seems like a craze growing. Are nanofluids a solution? What are the limitations of the use of such fluids? This article proposes a review of thermo physicals coefficients of carbon nanotube-water nanofluids. This article reports on an experimental study completed to observe the impacts of the concentration, temperature, aspect ratio, and surfactant on the thermal conductivity and viscosity. Finally this article advocates a field for using nanofluid in heat exchangers.

scholarly journals High-Performance Thermal Management Nanocomposites: Silver Functionalized Graphene Nanosheets and Multiwalled Carbon Nanotube

Crystals ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 398 ◽  
Author(s):  
Yongcun Zhou ◽  
Xiao Zhuang ◽  
Feixiang Wu ◽  
Feng Liu
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Polymer Composites ◽  
Thermal Management ◽  
High Performance ◽  
Graphene Nanosheets ◽  
Multiwalled Carbon Nanotube ◽  
Processing Unit ◽  
Functionalized Graphene ◽  
Multiwalled Carbon

Polymer composites with high thermal conductivity have a great potential for applications in modern electronics due to their low cost, easy process, and stable physical and chemical properties. Nevertheless, most polymer composites commonly possess unsatisfactory thermal conductivity, primarily because of the high interfacial thermal resistance between inorganic fillers. Herein, we developed a novel method through silver functionalized graphene nanosheets (GNS) and multiwalled carbon nanotube (MWCNT) composites with excellent thermal properties to meet the requirements of thermal management. The effects of composites on interfacial structure and properties of the composites were identified, and the microstructures and properties of the composites were studied as a function of the volume fraction of fillers. An ultrahigh thermal conductivity of 12.3 W/mK for polymer matrix composites was obtained, which is an approximate enhancement of 69.1 times compared to the polyvinyl alcohol (PVA) matrix. Moreover, these composites showed more competitive thermal conductivities compared to untreated fillers/PVA composites applied to the desktop central processing unit, making these composites a high-performance alternative to be used for thermal management.

Fabrication of thermally conductive and electrically insulating polymer composites with isotropic thermal conductivity by constructing a three-dimensional interconnected network

Nanoscale ◽  
2019 ◽  
Vol 11 (23) ◽  
pp. 11360-11368 ◽  
Author(s):  
Hao Yuan ◽  
Yang Wang ◽  
Ting Li ◽  
Yijie Wang ◽  
Piming Ma ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Thermal Management ◽  
Three Dimensional ◽  
Heat Removal ◽  
Interconnected Network ◽  
Microelectronic Devices ◽  
Thermally Conductive

Efficient heat removal via thermal management materials has become one of the most critical challenges in the development of modern microelectronic devices.

The Thermal Expansion Behaviors of Cu-SiCp Composites

2013 ◽  
Vol 795 ◽  
pp. 237-240
Author(s):  
K. Azmi ◽  
M.N. Derman ◽  
Mohd Mustafa Al Bakri Abdullah
Keyword(s):  
Thermal Conductivity ◽  
Silicon Carbide ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Matrix ◽  
Experimental Results ◽  
High Thermal Conductivity ◽  
Coating Process ◽  
Electroless Coating

The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak bonding between the copper matrix and the SiCp reinforcement degrades the thermophysical properties of the composites. In order to improve the bonding between the two constituents, the SiCp were copper coated (Cu-Coated) via electroless coating process. Based on the experimental results, the CTE values of the Cu-Coated Cu-SiCp composites were found significantly lower than those of the non-Coated Cu-SiCp composites. The CTEs of the Cu-Coated Cu-SiCp composites were in agreement with Kernels model which accounts for both the shear and isostatic stresses developed in the component phases.

Thermophysical Properties of Molybdenum Copper Multilayer Composites for Thermal Management Applications

2015 ◽  
Vol 825-826 ◽  
pp. 297-304 ◽  
Author(s):  
Martin Seiss ◽  
Tobias Mrotzek ◽  
Norbert Dreer ◽  
Wolfram Knabl
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Thermal Management ◽  
Thermophysical Properties ◽  
Copper Content ◽  
Coefficient Of Thermal Expansion ◽  
Strong Anisotropy ◽  
Multilayer Composites ◽  
Properties Of Materials ◽  
Materials Used

The key properties of materials used for thermal management in electronics are thermal conductivity and the coefficient of thermal expansion. These properties can be tailored by stacking molybdenum and copper layers. Here, molybdenum copper multilayer composites with varying copper content, from 63 to 88 wt%, have been investigated. It is demonstrated, that thermal conductivity and coefficient of thermal expansion, can be adjusted by the copper content. Two flash methods for measuring the thermal conductivity are compared and the validity of the results is discussed since measurements on thin materials with strong anisotropy require a certain setup of the measurement device. For the studied compositions the thermal conductivity was determined to be between 220 to 270 W/m/K and the coefficient of thermal expansion between 6.1 to 11.5 ppm/K.

scholarly journals Two-Dimensional Layered MSi2N4(M= Mo, W) as Promising Thermal Management Materials

2021 ◽  
Author(s):  
Chen Shen ◽  
Lei Wang ◽  
Donghai Wei ◽  
Yixuan Zhang ◽  
Qin Guangzhao ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Heat Removal ◽  
Two Dimensional ◽  
Reliable Operation ◽  
Nanoelectronic Devices ◽  
Key Factor ◽  
Intrinsic Thermal Conductivity

With the miniaturization and integration of nanoelectronic devices, efficient heat removal becomes a key factor affecting the reliable operation of such devices. With the high intrinsic thermal conductivity, good mechanical...

scholarly journals Thermal Performance Investigation of Slotted Fin Minichannel Heat Sink for Microprocessor Cooling

Energies ◽  
2021 ◽  
Vol 14 (19) ◽  
pp. 6347
Author(s):  
Taha Baig ◽  
Zabdur Rehman ◽  
Hussain Ahmed Tariq ◽  
Shehryar Manzoor ◽  
Majid Ali ◽  
...  
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Heat Removal ◽  
High Heat ◽  
Heat Sinks ◽  
High Heat Flux ◽  
Base Temperature ◽  
High Processing

Due to high heat flux generation inside microprocessors, water-cooled heat sinks have gained special attention. For the durability of the microprocessor, this generated flux should be effectively removed. The effective thermal management of high-processing devices is now becoming popular due to high heat flux generation. Heat removal plays a significant role in the longer operation and better performance of heat sinks. In this work, to tackle the heat generation issues, a slotted fin minichannel heat sink (SFMCHS) was investigated by modifying a conventional straight integral fin minichannel heat sink (SIFMCHS). SFMCHSs with fin spacings of 0.5 mm, 1 mm, and 1.5 mm were numerically studied. The numerical results were then compared with SIFMCHSs present in the literature. The base temperatures recorded for two slots per fin minichannel heat sink (SPFMCHS), with 0.5 mm, 1 mm, and 1.5 mm fin spacings, were 42.81 °C, 46.36 °C, and 48.86 °C, respectively, at 1 LPM. The reductions in base temperature achieved with two SPFMCHSs were 9.20 %, 8.74 %, and 7.39% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, as compared to SIFMCHSs reported in the literature. The reductions in base temperature noted for three SPFMCHSs were 8.53%, 9.05%, and 5.95% for 0.5 mm, 1 mm, and 1.5 mm fin spacings, respectively, at 1 LPM, as compared to SIFMCHSs reported in the literature. In terms of heat transfer performance, the base temperature and thermal resistance of the 0.5 mm-spaced SPFMCHS is better compared to 1 mm and 1.5 mm fin spacings. The uniform temperature distribution at the base of the heat sink was observed in all cases solved in current work.

The Influence of Carbon Nanotube Aspect Ratio on Thermal Conductivity Enhancement in Nanotube–Polymer Composites

2013 ◽  
Vol 136 (1) ◽  
Author(s):  
Rahul S. Kapadia ◽  
Brian M. Louie ◽  
Prabhakar R. Bandaru
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
Carbon Nanotube ◽  
Aspect Ratio ◽  
Polymer Composites ◽  
Polymer Matrix ◽  
Linear Increase ◽  
Interfacial Resistance ◽  
Multiwalled Carbon ◽  
Conductivity Enhancement

We report and model a linear increase in the thermal conductivity (κ) of polymer composites incorporated with relatively low length/diameter aspect ratio multiwalled carbon nanotubes (CNTs). There was no evidence of percolation-like behavior in the κ, at/close to the theoretically predicted threshold, which was attributed due to the interfacial resistance between the CNT and the polymer matrix. Concomitantly, the widely postulated high thermal conductivity of CNTs does not contribute to the net thermal conductivity of the composites. Through estimating the interfacial resistance and the thermal conductivity of the constituent CNTs, we conclude that our experimental and modeling approaches can be used to study thermal transport behavior in nanotube–polymer composites.

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