Copper-Carbon Nanotube Micropillars for Passive Thermal Management of High Heat Flux Electronic Devices

2021 ◽  
Author(s):  
Gerardo Rojo ◽  
Jeff Darabi
Keyword(s):  
Heat Flux ◽  
Carbon Nanotube ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux

scholarly journals Droplet-Based Microfluidic Thermal Management Methods for High Performance Electronic Devices

Micromachines ◽  
2019 ◽  
Vol 10 (2) ◽  
pp. 89 ◽  
Author(s):  
Zhibin Yan ◽  
Mingliang Jin ◽  
Zhengguang Li ◽  
Guofu Zhou ◽  
Lingling Shui
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
High Performance ◽  
Rapid Development ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux ◽  
Electrowetting On Dielectric ◽  
Handling Methods ◽  
Cooling Methods

Advanced thermal management methods have been the key issues for the rapid development of the electronic industry following Moore’s law. Droplet-based microfluidic cooling technologies are considered as promising solutions to conquer the major challenges of high heat flux removal and nonuniform temperature distribution in confined spaces for high performance electronic devices. In this paper, we review the state-of-the-art droplet-based microfluidic cooling methods in the literature, including the basic theory of electrocapillarity, cooling applications of continuous electrowetting (CEW), electrowetting (EW) and electrowetting-on-dielectric (EWOD), and jumping droplet microfluidic liquid handling methods. The droplet-based microfluidic cooling methods have shown an attractive capability of microscale liquid manipulation and a relatively high heat flux removal for hot spots. Recommendations are made for further research to develop advanced liquid coolant materials and the optimization of system operation parameters.

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

2021 ◽  
Author(s):  
Noriyuki Unno ◽  
Kazuhisa Yuki ◽  
Risako Kibushi ◽  
Rika Nogita ◽  
Atsuyuki Mitani
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Boiling Heat Transfer ◽  
Electronic Devices ◽  
High Heat ◽  
Experimental Result ◽  
High Heat Flux ◽  
Promising Technique ◽  
Cooling Device ◽  
Cooling Devices

Abstract Boiling heat transfer (BHT) is a promising technique to remove a high heat flux emitted from next-generation electronic devices. However, critical heat flux (CHF) is a big problem in BHT because it restricts the maximum performance of the cooling devices using BHT. Nanofluid has been widely used to improve the CHF. In this study, the authors investigated the BHT of a compact cooling device at low pressure using a special nanofluid: that is made with partially soluble particles in water. The experimental result found that the CHF with the special nanofluid is 170 W/cm2 and is higher than that with nanofluid made with an insoluble nanoparticle.

scholarly journals Microstructured Ceramic-Coated Carbon Nanotube Surfaces for High Heat Flux Pool Boiling

2019 ◽  
Vol 2 (9) ◽  
pp. 5538-5545 ◽  
Author(s):  
Hangbo Zhao ◽  
Susmita Dash ◽  
Navdeep Singh Dhillon ◽  
Sanha Kim ◽  
Bethany Lettiere ◽  
...  
Keyword(s):  
Heat Flux ◽  
Carbon Nanotube ◽  
Pool Boiling ◽  
High Heat ◽  
High Heat Flux ◽  
Coated Carbon

Cooling of high heat flux electronic devices using ultra-thin multiport minichannel thermosyphon

2020 ◽  
Vol 169 ◽  
pp. 114669 ◽  
Author(s):  
Stephen Manova ◽  
Lazarus Godson Asirvatham ◽  
Rajesh Nimmagadda ◽  
Jefferson Raja Bose ◽  
Somchai Wongwises
Keyword(s):  
Heat Flux ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux

E219 High Heat Flux Cooling for Electronic Devices by Subcooled Flow Boiling : Cooing performance of small channel

2001 ◽  
Vol 2001 (0) ◽  
pp. 553-554
Author(s):  
Koichi SUZUKI ◽  
Hiroki SAITO ◽  
Hiroshi KAWAMURA ◽  
Hideo IWASAKI ◽  
Koichiro KAWANO ◽  
...  
Keyword(s):  
Heat Flux ◽  
Flow Boiling ◽  
Electronic Devices ◽  
High Heat ◽  
High Heat Flux ◽  
Subcooled Flow Boiling ◽  
Small Channel ◽  
Subcooled Flow
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