The effects of film thickness variations on the residual stress distributions in coated Cr thin films

Strain ◽  
2017 ◽  
Vol 53 (2) ◽  
pp. e12222 ◽  
Author(s):  
Chi-Hui Chien ◽  
Ting-Hsuan Su ◽  
Chung-Ting Wang ◽  
Jia-Lun Gan ◽  
Jhao-Shun Wang
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Film Thickness ◽  
Stress Distributions ◽  
Thickness Variations

Film thickness effect on texture and residual stress sign transition in sputtered TiN thin films

2017 ◽  
Vol 43 (15) ◽  
pp. 11992-11997 ◽  
Author(s):  
Yeting Xi ◽  
Kewei Gao ◽  
Xiaolu Pang ◽  
Huisheng Yang ◽  
Xiaotao Xiong ◽  
...  
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Film Thickness ◽  
Thickness Effect ◽  
Tin Thin Films

Measurements of Residual Stresses in Low-Stress Silicon Nitride Thin Films Using Micro-Rotating Structures

1996 ◽  
Vol 444 ◽  
Author(s):  
Xin Zhang ◽  
Yitshak Zohar ◽  
Tong-Yi Zhang
Keyword(s):  
Thin Films ◽  
Finite Element Method ◽  
Residual Stress ◽  
Finite Element ◽  
Silicon Nitride ◽  
Film Thickness ◽  
Strain Measurement ◽  
Strain Measurements ◽  
Micro Structures ◽  
Gas Ratio

AbstractA variety of rotating micro structures were designed, fabricated and characterized for residual-stress (or strain) measurements in low-stress silicon nitride thin films, deposited by LPCVD on silicon wafers. The sensitivities of the micro structures were calculated by finite element method (FEM) and verified experimentally. The results were further confirmed by utilizing the wafer-curvature method for stress measurements. The size of the structures enables local residual-stress (or strain) measurement. The stress level depends on both the film thickness and the gas ratio and also varies with the location on the wafer.

The cracking and decohesion of thin films

1988 ◽  
Vol 3 (5) ◽  
pp. 1043-1049 ◽  
Author(s):  
A. G. Evans ◽  
M. D. Drory ◽  
M. S. Hu
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Yield Strength ◽  
Film Thickness ◽  
Elastic Properties ◽  
Fracture Resistance ◽  
Critical Values ◽  
Substrate Thickness ◽  
The Status ◽  
Ductile Substrates

The cracking and decohesion of thin films can be characterized by critical values of a nondimensional parameter governed by the residual stress, the film thickness, and a fracture resistance. This article reviews the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness, and yield strength are described.

Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

2011 ◽  
Vol 681 ◽  
pp. 139-144 ◽  
Author(s):  
Renaud Vayrette ◽  
Christian Rivero ◽  
Sylvain Blayac ◽  
Karim Inal
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Film Thickness ◽  
Crystallite Size ◽  
Annealing Temperature ◽  
Stress Generation ◽  
Thickness Effect ◽  
Electron Backscattered Diffraction ◽  
Electroplated Copper ◽  
Stress Models

In this work, coupled effects of thickness and annealing temperature on both microstructure and residual stress of electroplated copper thin films are studied. Microstructure is investigated by Electron Backscattered Diffraction (EBSD) and residual stress is estimated from samples curvature. All films exhibit highly twinned grains. Except for several microns films, median crystallite size grows with both film thickness and annealing temperature. Concerning residual stress, it decreases, first as the increase of film thickness, and secondly as the decrease of annealing temperature. The comparison between experiments and stress models demonstrates that the root mechanisms of residual stress generation change with annealing temperature. As well as annealing temperature, film thickness determines the level of residual stress through control of microstructure. Furthermore, EBSD investigations confirmed that the relevant microstructural length to define mechanical properties of thin copper films is the median crystallite size.

Residual Stress Analysis of Al Alloy Thin Films by X-Ray Diffraction as a Function of Film Thickness

1988 ◽  
Vol 130 ◽  
Author(s):  
Carla J. Shute ◽  
J. B. Cohen ◽  
D. A. Jeannottea
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Film Thickness ◽  
Stress Analysis ◽  
Metal Film ◽  
High Stress ◽  
Al Alloy ◽  
X Ray Diffraction ◽  
X Ray ◽  
Residual Stress Analysis

AbstractResidual stress has been measured as a function of layer thickness in thin films of an Al alloy on oxidized Si by the x-ray “d” versus sin2ψ technique. Samples with and without a passivation layer were examined. The results show an increase in residual stress with decreasing film thickness for the passivated samples and indicates that the interface between the metal film and SiO2 may be a region of high stress.

Predictions of Residual Stresses and Deformations in Pipe Bends Produced Using Cold, Warm and Induction Bending Processes

2014 ◽  
Author(s):  
Y. Ding ◽  
M. Yetisir ◽  
S. Khajehpour
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Numerical Models ◽  
Local Heating ◽  
Safety Evaluation ◽  
Stress Distributions ◽  
Advantages And Disadvantages ◽  
Cold Bending ◽  
Bending Process ◽  
Thickness Variations

Cold bending, warm bending (bending with local heating) and induction bending are three manufacturing processes widely used to produce pipe bends. The cold and warm bending processes have been used for the fabrication of carbon steel feeder bends for CANDU® reactors, and the induction bending process was considered for the fabrication of stainless steel feeder pipes for an advanced CANDU reactor. Bending processes result in plastic deformation, and inevitably, introduce residual stresses in the deformed pipes. Residual stresses in feeder bends are believed to be a very important contributing factor in feeder cracking. Different bending processes result in widely different residual stress patterns and magnitudes in pipe bends. Hence, it is important to understand the effect of bending processes and the process parameters used on the residual stress distribution in the bent pipes. Numerical models have been successfully developed to predict the residual stresses and the deformed shapes induced by cold, warm and induction bending processes. This paper provides a comprehensive review of the predicted residual stress distributions, ovality and wall-thickness variations of the cold, warm and induction bends. The predicted results were compared to earlier measurements of spare CANDU feeder bends and test bends. Advantages and disadvantages of the three bending processes are summarized. Numerical approaches for the modeling of residual stresses could be of benefit to engineering estimates of residual stresses in feeder pipes for safety evaluation of nuclear reactors.

The Cracking and Decohesion of Thin Films

1987 ◽  
Vol 108 ◽  
Author(s):  
A. G. Evans ◽  
M. D. Drory ◽  
M. S. Hu
Keyword(s):  
Thin Films ◽  
Residual Stress ◽  
Yield Strength ◽  
Film Thickness ◽  
Elastic Properties ◽  
Fracture Resistance ◽  
Substrate Thickness ◽  
Dimensional Parameter ◽  
The Status ◽  
Ductile Substrates

ABSTRACTThe cracking and decohesion of thin films can be characterized by critical values of a non-dimensional parameter governed by the residual stress, the film thickness and a fracture resistance. This article describes the status of understanding concerning the magnitude of this number for various types of adherent film on either brittle or ductile substrates. Important effects of elastic properties, substrate thickness and yield strength are described.

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