2017 IEEE International Interconnect Technology Conference (IITC)
Latest Publications

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Published By IEEE

9781509064748

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Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968936 ◽

2017 ◽

Cited By ~ 2

Author(s):

Hisashi Kino ◽

Masataka Tashiro ◽

Yohei Sugawara ◽

Seiya Tanikawa ◽

Takafumi Fukushima ◽

...

Keyword(s):

Data Transmission ◽

High Speed ◽

Parasitic Capacitance ◽

Ultra High Speed ◽

High Speed Data ◽

Speed Data Transmission

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Spin waves for interconnect applications

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968984 ◽

2017 ◽

Cited By ~ 2

Author(s):

F. Ciubotaru ◽

O. Zografos ◽

G. Talmelli ◽

C. Adelmann ◽

I. P. Radu ◽

...

Keyword(s):

Spin Waves

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A novel role for SiCN to suppress H2O outgas from TEOS oxide films in hybrid bonding

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968945 ◽

2017 ◽

Author(s):

T. Ueda ◽

M. Tetani ◽

Y. Morinaga ◽

M. Hamada ◽

M. Takeuchi ◽

...

Keyword(s):

Oxide Films

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Tungsten corrosion and recess improvement by feasible slurry and clean chemical in WCMP process

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968980 ◽

2017 ◽

Cited By ~ 2

Author(s):

Kuang-Wei Chen ◽

Chun-Fu Chen ◽

Yung-Tai Hung ◽

Tuung Luoh ◽

Ling-Wuu Yang ◽

...

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N5 technology node dual-damascene interconnects enabled using multi patterning

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968983 ◽

2017 ◽

Cited By ~ 5

Author(s):

B. Briggs ◽

C. J. Wilson ◽

K. Devriendt ◽

M. H. van der Veen ◽

S. Decoster ◽

...

Keyword(s):

Technology Node ◽

Dual Damascene ◽

Damascene Interconnects

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Considering percolation path growth in low-k dielectric TDDB measurements

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968974 ◽

2017 ◽

Author(s):

C. Wu ◽

Y. Li ◽

Zs. Tokei ◽

K. Croes

Keyword(s):

Percolation Path ◽

Low K

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Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968969 ◽

2017 ◽

Cited By ~ 9

Author(s):

S-A. Chew ◽

H. Yu ◽

M. Schaekers ◽

S. Demuynck ◽

G. Mannaert ◽

...

Keyword(s):

Contact Metal

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Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968937 ◽

2017 ◽

Cited By ~ 7

Author(s):

Shibesh Dutta ◽

Shreya Kundu ◽

Lianggong Wen ◽

Geraldine Jamieson ◽

Kristof Croes ◽

...

Keyword(s):

Cross Section ◽

Cross Section Area ◽

Section Area

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Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968961 ◽

2017 ◽

Cited By ~ 7

Author(s):

T. Nogami ◽

R. Patlolla ◽

J. Kelly ◽

B. Briggs ◽

H. Huang ◽

...

Keyword(s):

Resistance Reduction ◽

Copper Composite ◽

Line Resistance ◽

Cobalt Copper

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Transistors on two-dimensional semiconductors: contact resistance limited by the contact edges

2017 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc-amc.2017.7968951 ◽

2017 ◽

Cited By ~ 2

Author(s):

G. Arutchelvan ◽

P. Matagne ◽

C. Lockhart de la Rosa ◽

S. Sutar ◽

S. De Gendt ◽

...

Keyword(s):

Contact Resistance ◽

Two Dimensional

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2017 IEEE International Interconnect Technology Conference (IITC)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Minimized hysteresis and low parasitic capacitance TSV with PBO (polybenzoxazole) liner to achieve ultra-high-speed data transmission

Spin waves for interconnect applications

A novel role for SiCN to suppress H2O outgas from TEOS oxide films in hybrid bonding

Tungsten corrosion and recess improvement by feasible slurry and clean chemical in WCMP process

N5 technology node dual-damascene interconnects enabled using multi patterning

Considering percolation path growth in low-k dielectric TDDB measurements

Ultralow resistive wrap around contact to scaled FinFET devices by using ALD-Ti contact metal

Ruthenium interconnects with 58 nm2 cross-section area using a metal-spacer process

Cobalt/copper composite interconnects for line resistance reduction in both fine and wide lines

Transistors on two-dimensional semiconductors: contact resistance limited by the contact edges

2017 IEEE International Interconnect Technology Conference (IITC)
Latest Publications