A structured design for test methodology

2002 ◽  
Author(s):  
K. Venkat
Keyword(s):  
Design For Test ◽  
Structured Design ◽  
Test Methodology

PENGEMBANGAN MODUL PEMBELAJARAN PERANCANGAN SISTEM INFORMASI PADA MATERI PERANCANGAN TERSTRUKTUR BERBASIS TEKNOLOGI KOMPUTER

2019 ◽  
Vol 2 ◽  
Author(s):  
Marlina Marlina
Keyword(s):  
College Students ◽  
Computer Technology ◽  
Learning Method ◽  
Design Development ◽  
Structured Design ◽  
Learning Module ◽  
The People ◽  
Post Test ◽  
Analysis Design ◽  
The University

This research discussed the issue of the development of learning module based computer technology especially a powerpoint. This module is intended to help students receive the material that was delivered by lecturer especially design structured matter which currently learning module media shaped print and the contents of the text are form module so the university students ca not see the material . Based on these problems was built a module learning computer technology with a powerpoint . The reason the manufacture of the module was structured design material with a picture and a symbol of in designing a system so it needs to ease student visualiasi received mater learning. Method of development this module use the model ADDIE (analysis, design, development, implementation and evaluation). Results in this research validated by 2 ( two ) experts namely the people of material said 80% module very reasonable used without revision and media experts said 84% module very reasonable used without revision while results trial by college students by means of pre-test and post-test. The results obtained module very well be used.

Defect Snap Shot: Quick Isolation and Mapping of Interconnect Defects for Backend Yield Improvement

2004 ◽  
Author(s):  
Jenny Fan ◽  
Dave Mark
Keyword(s):  
Metal Layer ◽  
Single Layer ◽  
Yield Improvement ◽  
Test Methodology ◽  
Process Complexity

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

Evaluation of the Resistance of Individual Si Die to Cracking

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield
Keyword(s):  
Thermal Cycling ◽  
Hardness Test ◽  
Mechanical Stresses ◽  
Test Method ◽  
Processing Conditions ◽  
Micro Hardness ◽  
Test Methodology ◽  
Vickers Micro Hardness

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.

Improving Yield Using Scan and DFT Based Analysis for High Performance PowerPC© Microprocessor

2006 ◽  
Author(s):  
Ray Talacka ◽  
Nandu Tendolkar ◽  
Cynthia Paquette
Keyword(s):  
High Performance ◽  
Yield Enhancement ◽  
Test Time ◽  
Balance Test ◽  
Specific Test ◽  
Defect Location ◽  
Test Methodology ◽  
Memory Arrays ◽  
Scan Chain ◽  
Scan Pattern

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.

Sign in / Sign up

Export Citation Format

Share Document