VFB Roll-off in HfO2 Gate Stack after High Temperature Annealing Process - A Crucial Role of Out-diffused Oxygen from HfO2 to Si

Author(s):  
K. Akiyama ◽  
W. Wang ◽  
W. Mizubayashi ◽  
M. Ikeda ◽  
H. Ota ◽  
...  
2016 ◽  
Vol 94 (20) ◽  
Author(s):  
A. Khademi ◽  
E. Sajadi ◽  
P. Dosanjh ◽  
D. A. Bonn ◽  
J. A. Folk ◽  
...  

RSC Advances ◽  
2014 ◽  
Vol 4 (66) ◽  
pp. 35106-35111 ◽  
Author(s):  
Yuanbin Dai ◽  
Yongzhong Wu ◽  
Lei Zhang ◽  
Yongliang Shao ◽  
Yuan Tian ◽  
...  

This manuscript describes a high temperature annealing process to prepare a porous substrate. The substrate was used for the growth of GaN by using HVPE method to provide reduced residual stress and low defect density.


2020 ◽  
Vol 1014 ◽  
pp. 14-21
Author(s):  
Wen Kai Yue ◽  
Zhi Min Li ◽  
Xiao Wei Zhou ◽  
Jin Xing Wu ◽  
Pei Xian Li

In this study, the effect of a high-temperature annealing process on AlN is investigated. The high-temperature annealing process reduces the screw dislocation density of the AlN film to 2.1x107 cm-2. The AlN surface is highly flat. Through HRXRD and Raman spectroscopy, the stress mode changes in the sputtered AlN film before and after high-temperature annealing were studied in depth. Based on the HTA-AlN template, a high-quality, high-Al composition AlGaN epitaxial wafer, with a (0002) plane rocking curve FWHM of 246 arcsec , was prepared at 1080°C The growth mode of AlGaN grown directly on the AlN template at low temperature is summarized.


2021 ◽  
Vol 130 (20) ◽  
pp. 203101
Author(s):  
Leonardo Cancellara ◽  
Toni Markurt ◽  
Tobias Schulz ◽  
Martin Albrecht ◽  
Sylvia Hagedorn ◽  
...  

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