Role of oxygen migration in the kinetics of the phase separation of nonstoichiometric silicon oxide films during high-temperature annealing

2007 ◽  
Vol 91 (13) ◽  
pp. 133109 ◽  
Author(s):  
A. Sarikov ◽  
V. Litovchenko ◽  
I. Lisovskyy ◽  
I. Maidanchuk ◽  
S. Zlobin
2007 ◽  
Vol 90 (18) ◽  
pp. 183101 ◽  
Author(s):  
A. La Magna ◽  
G. Nicotra ◽  
C. Bongiorno ◽  
C. Spinella ◽  
M. G. Grimaldi ◽  
...  

2019 ◽  
Vol 25 (3) ◽  
pp. 379-384
Author(s):  
Anna Szekeres ◽  
Emilia Vlaikova ◽  
Tivadar Lohner ◽  
Peter Petrik ◽  
Agnes Cziraki ◽  
...  

2005 ◽  
Vol 138 (3-4) ◽  
pp. 823-828
Author(s):  
N. Mikhin ◽  
V. Grigor’ev ◽  
V. Maidanov ◽  
A. Penzev ◽  
S. Rubets ◽  
...  

1993 ◽  
Vol 69 (1-4) ◽  
pp. 281-284
Author(s):  
D. Fernández ◽  
P. González ◽  
J. Pou ◽  
E. García ◽  
J. Serra ◽  
...  

1988 ◽  
Vol 100 ◽  
Author(s):  
C. Jaussaud ◽  
J. Margail ◽  
J. Stoemenos ◽  
M. Bruel

ABSTRACTHigh temperature annealing of Simox wafers (T > 1300°C), has been proved to dramaticaly increase the quality of the SOI structure.The heat treatment leads to a redistribution of the implanted oxygen, opposite to its concentration profile, towards the buried layer.This paper describes from a thermodynamical point of view the SiO2 precipitates dissolution. The physical mechanisms of the oxygen migration are also discussed.


2007 ◽  
Vol 550 ◽  
pp. 381-386 ◽  
Author(s):  
B. Decreus ◽  
Hatem S. Zurob ◽  
John Dunlop ◽  
Yves Bréchet

The effect of low temperature recovery treatments on the recrystallization kinetics during subsequent high temperature annealing was investigated in three Al-2.5%Mg alloys with various Fe additions. Recovery treatments were carried out at 190oC for times ranging from 0.25 to 65 hrs. Recrystallization treatments were carried out at 280oC. The kinetics of recrystallization was followed using the techniques of hardness measurement, optical metallography and calorimetry.


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