P3H-6 An Integrated Circuit with Transmit Beamforming and Parallel Receive Channels for Real-Time Three-Dimensional Ultrasound Imaging

2006 ◽  
Author(s):  
B. T. Khuri-Yakub ◽  
M. Karaman ◽  
O. Oralkan ◽  
A. Nikoozadeh ◽  
I. Wygant ◽  
...  
Keyword(s):  
Real Time ◽  
Ultrasound Imaging ◽  
Integrated Circuit ◽  
Three Dimensional ◽  
Transmit Beamforming

Three-dimensional (3D) ultrasound imaging of the gallbladder and dilated biliary tree: reconstruction from real-time B-scans

1991 ◽  
Vol 64 (767) ◽  
pp. 1056-1057 ◽  
Author(s):  
D. Fine ◽  
S. Perring ◽  
J. Herbetko ◽  
C. N. Hacking ◽  
J. S. Fleming ◽  
...  
Keyword(s):  
Real Time ◽  
Ultrasound Imaging ◽  
Three Dimensional ◽  
Biliary Tree ◽  
3D Ultrasound ◽  
Tree Reconstruction

Three-dimensional ultrasound imaging of breast cancer by a real-time intraoperative navigation system

Breast Cancer ◽  
2005 ◽  
Vol 12 (2) ◽  
pp. 122-129 ◽  
Author(s):  
Tomoo Inoue ◽  
Yasuhiro Tamaki ◽  
Yoshinobu Sato ◽  
Masahiko Nakamoto ◽  
Shinichi Tamura ◽  
...  
Keyword(s):  
Breast Cancer ◽  
Real Time ◽  
Ultrasound Imaging ◽  
Navigation System ◽  
Three Dimensional ◽  
Intraoperative Navigation

An integrated circuit with transmit beamforming flip-chip bonded to a 2-D CMUT array for 3-D ultrasound imaging

2009 ◽  
Vol 56 (10) ◽  
pp. 2145-2156 ◽  
Author(s):  
I. O. Wygant ◽  
N. S. Jamal ◽  
H. J. Lee ◽  
A. Nikoozadeh ◽  
O. Oralkan ◽  
...  
Keyword(s):  
Ultrasound Imaging ◽  
Integrated Circuit ◽  
Flip Chip ◽  
Transmit Beamforming

Real-time three-dimensional ultrasound imaging of pre- and post-vocalic liquid consonants in American English

2015 ◽  
Vol 137 (4) ◽  
pp. 2268-2269 ◽  
Author(s):  
Brandon Rhodes ◽  
Kelly Berkson ◽  
Kenneth de Jong ◽  
Steven Lulich
Keyword(s):  
Real Time ◽  
Ultrasound Imaging ◽  
American English ◽  
Three Dimensional

scholarly journals A Review on Real-Time 3D Ultrasound Imaging Technology

2017 ◽  
Vol 2017 ◽  
pp. 1-20 ◽  
Author(s):  
Qinghua Huang ◽  
Zhaozheng Zeng
Keyword(s):  
Real Time ◽  
Ultrasound Imaging ◽  
Spatial Information ◽  
Imaging System ◽  
Three Dimensional ◽  
Intraoperative Ultrasound ◽  
3D Ultrasound ◽  
Interactive System ◽  
Reconstruction Algorithms ◽  
Advantages And Disadvantages

Real-time three-dimensional (3D) ultrasound (US) has attracted much more attention in medical researches because it provides interactive feedback to help clinicians acquire high-quality images as well as timely spatial information of the scanned area and hence is necessary in intraoperative ultrasound examinations. Plenty of publications have been declared to complete the real-time or near real-time visualization of 3D ultrasound using volumetric probes or the routinely used two-dimensional (2D) probes. So far, a review on how to design an interactive system with appropriate processing algorithms remains missing, resulting in the lack of systematic understanding of the relevant technology. In this article, previous and the latest work on designing a real-time or near real-time 3D ultrasound imaging system are reviewed. Specifically, the data acquisition techniques, reconstruction algorithms, volume rendering methods, and clinical applications are presented. Moreover, the advantages and disadvantages of state-of-the-art approaches are discussed in detail.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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