Power-Aware At-Speed Scan Test Methodology for Circuits with Synchronous Clocks

2008 ◽  
Author(s):  
Benoit Nadeau-Dostie ◽  
Kiyoshi Takeshita ◽  
Jean-Francois Cote
Keyword(s):  
Test Methodology ◽  
Scan Test

scholarly journals Boundary scan test, test methodology, and fault modeling

1991 ◽  
Vol 2 (1) ◽  
pp. 77-88 ◽  
Author(s):  
Frans De Jong ◽  
José S. Matos ◽  
José M. Ferreira
Keyword(s):  
Fault Modeling ◽  
Boundary Scan ◽  
Test Methodology ◽  
Scan Test ◽  
Boundary Scan Test

UMC-Scan Test Methodology: Exploiting the Maximum Freedom of Multicasting

2008 ◽  
Vol 25 (2) ◽  
pp. 132-140 ◽  
Author(s):  
Chao-Wen Tzeng ◽  
Shi-Yu Huang
Keyword(s):  
Test Methodology ◽  
Scan Test

Defect Snap Shot: Quick Isolation and Mapping of Interconnect Defects for Backend Yield Improvement

2004 ◽  
Author(s):  
Jenny Fan ◽  
Dave Mark
Keyword(s):  
Metal Layer ◽  
Single Layer ◽  
Yield Improvement ◽  
Test Methodology ◽  
Process Complexity

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

Evaluation of the Resistance of Individual Si Die to Cracking

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield
Keyword(s):  
Thermal Cycling ◽  
Hardness Test ◽  
Mechanical Stresses ◽  
Test Method ◽  
Processing Conditions ◽  
Micro Hardness ◽  
Test Methodology ◽  
Vickers Micro Hardness

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.

Case Study: Combined Dynamic Laser Stimulation and Static Emission Microscopy Techniques Applied to Scan Test Failure on Mixed Mode Device

2012 ◽  
Author(s):  
Magdalena Sienkiewicz ◽  
Philippe Rousseille
Keyword(s):  
Mixed Mode ◽  
Laser Stimulation ◽  
Scan Test ◽  
Silicon Bulk ◽  
Defect Localization ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Test Failure

Abstract This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level.

Improving Yield Using Scan and DFT Based Analysis for High Performance PowerPC© Microprocessor

2006 ◽  
Author(s):  
Ray Talacka ◽  
Nandu Tendolkar ◽  
Cynthia Paquette
Keyword(s):  
High Performance ◽  
Yield Enhancement ◽  
Test Time ◽  
Balance Test ◽  
Specific Test ◽  
Defect Location ◽  
Test Methodology ◽  
Memory Arrays ◽  
Scan Chain ◽  
Scan Pattern

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.

scholarly journals A proposal to determine the distribution of lateral forces from loaded recycled plastic drainage kerbs

2021 ◽  
Vol 3 (2) ◽  
Author(s):  
Fin O’Flaherty ◽  
Fathi Al-Shawi
Keyword(s):  
Laboratory Test ◽  
Detailed Analysis ◽  
Test Data ◽  
Lateral Force ◽  
Measuring Device ◽  
Test Methodology ◽  
Lateral Forces ◽  
Test Conditions ◽  
Fit For Purpose ◽  
Construction Product

AbstractThis study presents a detailed analysis of the lateral forces generated as a result of vertically applied loads to recycled plastic drainage kerbs. These kerbs are a relatively new addition to road infrastructure projects. When concrete is used to form road drainage kerbs, its deformation is minimum when stressed under heavy axle loads. Although recycled plastic kerbs are more environmentally friendly as a construction product, they are less stiff than concrete and tend to deform more under loading leading to a bursting type, lateral force being applied to the haunch materials, the magnitude of which is unknown. A method is proposed for establishing the distribution of these lateral forces resulting from deformation under laboratory test conditions. A load of 400 kN is applied onto a total of six typical kerbs in the laboratory in accordance with the test standard. The drainage kerbs are surrounded with 150 mm of concrete to the front and rear haunch and underneath as is normal during installation. The lateral forces exerted on the concrete surround as a result of deformation of the plastic kerbs are determined via a strain measuring device. Analysis of the test data allows the magnitude of the lateral forces to the surrounding media to be determined and, thereby, ensuring the haunch materials are not over-stressed as a result. The proposed test methodology and subsequent analysis allows for an important laboratory-based assessment of any typical recycled plastic drainage kerbs to be conducted to ensure they are fit-for-purpose in the field.

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