Application of the Depth-of-Penetration Test Methodology to Characterize Ceramics for Personnel Protection

2000 ◽  
Author(s):  
Thomas J. Moynihan ◽  
Shun-Chin Chou ◽  
Audreyk L. Mihalcin
Keyword(s):  
Penetration Test ◽  
Depth Of Penetration ◽  
Test Methodology

scholarly journals Considerations on Dop (Depth Of Penetration) Test for Evaluation of Ceramics Materials Used in Ballistic Protection

2017 ◽  
Vol 69 (1) ◽  
pp. 162-166 ◽  
Author(s):  
Ioan-Dan Popa ◽  
Florin Dobriţa
Keyword(s):  
Ceramic Materials ◽  
Special Focus ◽  
Penetration Test ◽  
Depth Of Penetration ◽  
Protection Level ◽  
Ballistic Protection ◽  
Tremendous Amount ◽  
Materials Used ◽  
Penetration Tests

Abstract Tremendous amount of funds and other resorces were invested in studying the response of ceramic materials under ballistic impact, the main goal being to find a way to increase the protection of soldiers and the vehicles used in the modern battlespace. Using of ceramic materials especially carbon based (carbides), nitrogen based (nitrides) and oxygen based (oxides) ceramics in order to increase the protection level of ballistic equipment could be, sometimes, a big challenge when trying to use the proper test in order to evaluate and compare their performances. The role of the tests is to provide a better understanding of their response in different situations and, as a consequence, to make them more efficient as armour components through future improvements. The paper presents shortly the main tests which are used and eventually standardised for evaluating the ballistic behaviour of the ceramics and other armour components, with a special focus to DOP (Depth of Penetration) Tests.

scholarly journals Determination of ballistic resistance of cementitious composites

2021 ◽  
Vol 1205 (1) ◽  
pp. 012013
Author(s):  
J Vojtisek ◽  
E Bystrianska ◽  
O Koutny ◽  
J Kratochvil ◽  
M Drdlova
Keyword(s):  
High Performance ◽  
Ceramic Materials ◽  
Cementitious Composites ◽  
Cement Composites ◽  
Penetration Test ◽  
Depth Of Penetration ◽  
Ballistic Resistance ◽  
Differential Efficiency ◽  
The Relationship

Abstract The paper describes the possibility of using the DOP test, standardly used to evaluate the ballistic resistance of ceramics, to determine the ballistic resistance of cement composites. DOP - Depth of penetration test - is based on measurement of residual penetration of projectile in witness system after the sample perforation; this parameter is used to determine differential efficiency factor (DEF), characterizing the ballistic resistance of the particular material. To verify the method for non-ceramic materials, four variants of cementitious composites with compressive strengths in the range of 30–150 MPa have been tested. The obtained results confirm the method’s suitability for determining the ballistic resistance of cement composites in terms of ease of implementation, sensitivity, and accuracy of the obtained results for both composites of common strengths and high-performance variants. The paper also discusses some aspects of the relationship between the mechanical parameters of cement composites under static loading and their ballistic resistance.

scholarly journals Round robin using the depth of penetration test method on an armour grade alumina

2019 ◽  
Vol 15 (6) ◽  
pp. 829-836
Author(s):  
Erik P. Carton ◽  
Bernt B. Johnsen ◽  
Dennis-Bo Rahbek ◽  
Hans Broos ◽  
Almar Snippe
Keyword(s):  
Round Robin ◽  
Test Method ◽  
Penetration Test ◽  
Depth Of Penetration

The Use of Advanced Analytical Techniques for Characterization of the Chemical, Physical, and Crystallographic Nature of a Surface

1973 ◽  
Vol 31 ◽  
pp. 132-133 ◽  
Author(s):  
R. E. Herfert
Keyword(s):  
Surface Characterization ◽  
Analytical Techniques ◽  
X Ray Diffraction ◽  
Depth Of Penetration ◽  
X Ray ◽  
The Past ◽  
Transmission Electron ◽  
Scanning Electron

Studies of the nature of a surface, either metallic or nonmetallic, in the past, have been limited to the instrumentation available for these measurements. In the past, optical microscopy, replica transmission electron microscopy, electron or X-ray diffraction and optical or X-ray spectroscopy have provided the means of surface characterization. Actually, some of these techniques are not purely surface; the depth of penetration may be a few thousands of an inch. Within the last five years, instrumentation has been made available which now makes it practical for use to study the outer few 100A of layers and characterize it completely from a chemical, physical, and crystallographic standpoint. The scanning electron microscope (SEM) provides a means of viewing the surface of a material in situ to magnifications as high as 250,000X.

Defect Snap Shot: Quick Isolation and Mapping of Interconnect Defects for Backend Yield Improvement

2004 ◽  
Author(s):  
Jenny Fan ◽  
Dave Mark
Keyword(s):  
Metal Layer ◽  
Single Layer ◽  
Yield Improvement ◽  
Test Methodology ◽  
Process Complexity

Abstract Metal interconnect defects have become a more serious yield detractor as backend process complexity has increased from a single layer to about 10 layers. This paper introduces a test methodology to monitor and localize the metal defects based on FPGA products. The test patterns are generated for each metal layer. The results not only indicate the severity of defects for each metal layer, but also accurately isolate open/short defects.

Evaluation of the Resistance of Individual Si Die to Cracking

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield
Keyword(s):  
Thermal Cycling ◽  
Hardness Test ◽  
Mechanical Stresses ◽  
Test Method ◽  
Processing Conditions ◽  
Micro Hardness ◽  
Test Methodology ◽  
Vickers Micro Hardness

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.

Sign in / Sign up

Export Citation Format

Share Document