Ultra-Wideband Microwave Generation Using a Low-Energy-Triggered Bulk Gallium Arsenide Avalanche Semiconductor Switch With Ultrafast Switching

2018 ◽  
Vol 65 (4) ◽  
pp. 1308-1313 ◽  
Author(s):  
Long Hu ◽  
Jiancang Su ◽  
Ruicheng Qiu ◽  
Xu Fang
2014 ◽  
Vol 115 (9) ◽  
pp. 094503 ◽  
Author(s):  
Long Hu ◽  
Jiancang Su ◽  
Zhenjie Ding ◽  
Qingsong Hao ◽  
Xuelin Yuan

2015 ◽  
Vol 36 (11) ◽  
pp. 1176-1179 ◽  
Author(s):  
Long Hu ◽  
Jiancang Su ◽  
Zhenjie Ding ◽  
Qingsong Hao

2017 ◽  
Vol 6 (1) ◽  
pp. 20
Author(s):  
V. Goyal ◽  
B. S. Dhaliwal

Ultra-wideband (UWB) uses very low energy levels to transfer data at very high data rate and bandwidth. An optimal and correct choice of transmission pulse shape is an important criterion in this technology. In this paper, we will present an approach for the generation of an optimal pulse shape with the optimal generation of pulse shape values that can provide effective results when transmitted using multiple access modulation technique over a multipath channel and received by a RAKE type receiver. The bit error analysis of constructed model is also given using Ideal Rake, selective RAKE, and partial RAKE receiver configurations.


2018 ◽  
Vol 284 ◽  
pp. 198-203
Author(s):  
S.N. Chebotarev ◽  
V.A. Irkha ◽  
Adnan A.A. Mohamed

We proposed an experimental technique for determining the sputtering yields of two-component semiconductors – gallium arsenide and indium arsenide by low-energy argon ions. It was suggested to measure the volume of a crater formed by inert ions bombarding on the target surface using the method of scanning laser confocal microscopy. It was demonstrated that in the energy range from 100 to 300 eV, the energy dependence of sputtering yields for these materials is practically linear. It is established that the sputtering yields for normal bombardment by argon ions at optimum energy of 150 eV are equal to Y(GaAs) = 0.41 and Y(InAs) = 0.73. It is found that an increase in the etching time of the surface of gallium arsenide and indium arsenide leads to a characteristic transformation of the surface relief. The studies of the sputtering of two-component targets indicate the initial strong non-stechiometry. Etching for a certain period of time leads to an equalization of the concentrations of the sputtered components. It was found that to obtain a uniform composition of the mass flow it is necessary to pre-sputter the targets with shielded substrates.


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