Proper-Orthogonal-Decomposition Based Thermal Modeling of Semiconductor Structures

2012 ◽  
Vol 59 (11) ◽  
pp. 2924-2931 ◽  
Author(s):  
R. Venters ◽  
B. T. Helenbrook ◽  
Kun Zhang ◽  
M.-C Cheng
Keyword(s):  
Proper Orthogonal Decomposition ◽  
Thermal Modeling ◽  
Orthogonal Decomposition ◽  
Semiconductor Structures ◽  
Proper Orthogonal

Proper Orthogonal Decomposition for Reduced Order Thermal Modeling of Air Cooled Data Centers

2010 ◽  
Vol 132 (7) ◽  
Author(s):  
Emad Samadiani ◽  
Yogendra Joshi
Keyword(s):  
Proper Orthogonal Decomposition ◽  
Thermal Modeling ◽  
Orthogonal Decomposition ◽  
Total Power ◽  
Algebraic Equations ◽  
Computationally Efficient ◽  
Reduced Order ◽  
Convective Systems ◽  
Design Variables ◽  
Proper Orthogonal

Computational fluid dynamics/heat transfer (CFD/HT) methods are too time consuming and costly to examine the effect of multiple design variables on the system thermal performance, especially for systems with multiple components and interacting physical phenomena. In this paper, a proper orthogonal decomposition (POD) based reduced order thermal modeling approach is presented for complex convective systems. The basic POD technique is used with energy balance equations, and heat flux and/or surface temperature matching to generate a computationally efficient thermal model in terms of the system design variables. The effectiveness of the presented approach is studied through application to an air-cooled data center cell with a floor area of 23.2 m2 and a total power dissipation of 240 kW, with multiple turbulent convective components and five design variables. The method results in average temperature rise prediction error of 1.24°C (4.9%) for different sets of design variables, while it is ∼150 times faster than CFD/HT simulation. Also, the effects of the number of available algebraic equations and retained POD modes on the accuracy of the obtained thermal field are studied.

Sign in / Sign up

Export Citation Format

Share Document