Nickel-Tin Transient Liquid Phase (TLP) Wafer Bonding for MEMS Vacuum Packaging

2007 ◽  
Author(s):  
W.C. Welch ◽  
K. Najafi
Keyword(s):  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Vacuum Packaging

Cu-Sn transient liquid phase wafer bonding for MEMS applications

2013 ◽  
Author(s):  
C. Flötgen ◽  
M. Pawlak ◽  
E. Pabo ◽  
H. J. van de Wiel ◽  
G. R. Hayes ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase

Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding

2001 ◽  
Vol 30 (11) ◽  
pp. 1471-1475 ◽  
Author(s):  
N. Quitoriano ◽  
W. S. Wong ◽  
L. Tsakalakos ◽  
Y. Cho ◽  
T. Sands
Keyword(s):  
Thin Film ◽  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Kinetics Of

Cu-Sn Transient Liquid Phase Wafer Bonding: Process Parameters Influence on Bonded Interface Quality

2013 ◽  
Vol 50 (7) ◽  
pp. 177-188 ◽  
Author(s):  
C. Floetgen ◽  
K. Corn ◽  
M. Pawlak ◽  
B. van de Wiel ◽  
G. Hayes ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Process Parameters ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Interface Quality ◽  
Bonded Interface

High temperature investigation on a nickel–tin transient liquid-phase wafer bonding up to 600  $$^{\circ }$$ ∘ C

2015 ◽  
Vol 23 (3) ◽  
pp. 745-754 ◽  
Author(s):  
Nando Budhiman ◽  
Björn Jensen ◽  
Steffen Chemnitz ◽  
Bernhard Wagner
Keyword(s):  
High Temperature ◽  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase
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