Cu-Sn Transient Liquid Phase Wafer Bonding: Process Parameters Influence on Bonded Interface Quality

2013 ◽  
Vol 50 (7) ◽  
pp. 177-188 ◽  
Author(s):  
C. Floetgen ◽  
K. Corn ◽  
M. Pawlak ◽  
B. van de Wiel ◽  
G. Hayes ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Process Parameters ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Interface Quality ◽  
Bonded Interface

scholarly journals Simulation of Transient Liquid Phase Bonding Process and the Influence of Interlayer Thickness

2020 ◽  
Vol 923 ◽  
pp. 012006
Author(s):  
B. Benita ◽  
D.S. Samuvel Prem Kumar ◽  
R. Pravin ◽  
N.Samuel Dinesh Hynes ◽  
J.Angela Jennifa Sujana
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Interlayer Thickness

The transient liquid phase bonding process of a γ-TiAl alloy with brazing solders containing Fe or Ni

2019 ◽  
Vol 106 ◽  
pp. 48-58 ◽  
Author(s):  
Katja Hauschildt ◽  
Andreas Stark ◽  
Norbert Schell ◽  
Martin Müller ◽  
Florian Pyczak
Keyword(s):  
Liquid Phase ◽  
Tial Alloy ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding

scholarly journals Transient Liquid Phase Bonding Process in SiC Fiber Reinforced Ti-6Al-4V Composites.

1995 ◽  
Vol 35 (10) ◽  
pp. 1307-1314 ◽  
Author(s):  
Shinji Fukumoto ◽  
Kenichi Imamura ◽  
Akio Hirose ◽  
Kojiro F. Kobayashi
Keyword(s):  
Liquid Phase ◽  
Transient Liquid Phase ◽  
Bonding Process ◽  
Transient Liquid Phase Bonding ◽  
Fiber Reinforced ◽  
Sic Fiber

Cu-Sn transient liquid phase wafer bonding for MEMS applications

2013 ◽  
Author(s):  
C. Flötgen ◽  
M. Pawlak ◽  
E. Pabo ◽  
H. J. van de Wiel ◽  
G. R. Hayes ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase

Glass Frit Wafer Bonding - Sealed Cavity Pressure in Relation to Bonding Process Parameters

2016 ◽  
Vol 75 (9) ◽  
pp. 255-264 ◽  
Author(s):  
R. Knechtel ◽  
S. Dempwolf ◽  
H. Klingner
Keyword(s):  
Process Parameters ◽  
Wafer Bonding ◽  
Glass Frit ◽  
Bonding Process ◽  
Cavity Pressure

Kinetics of the Pd/In thin-film bilayer reaction: Implications for transient-liquid-phase wafer bonding

2001 ◽  
Vol 30 (11) ◽  
pp. 1471-1475 ◽  
Author(s):  
N. Quitoriano ◽  
W. S. Wong ◽  
L. Tsakalakos ◽  
Y. Cho ◽  
T. Sands
Keyword(s):  
Thin Film ◽  
Liquid Phase ◽  
Wafer Bonding ◽  
Transient Liquid Phase ◽  
Kinetics Of
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