Integrating world-class radiance RTP technology onto a low cost of ownership production-worthy platform

2003 ◽  
Author(s):  
R. Boas ◽  
N. Tam ◽  
Wen Chang ◽  
T. Leong ◽  
T. Green
Keyword(s):  
Low Cost ◽  
Cost Of Ownership ◽  
World Class

scholarly journals Co-Design of CVT-Based Electric Vehicles

Energies ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1825
Author(s):  
Caiyang Wei ◽  
Theo Hofman ◽  
Esin Ilhan Caarls
Keyword(s):  
Cooling System ◽  
Design Method ◽  
Low Cost ◽  
Cost Effective ◽  
Speed Ratio ◽  
Air Flow Rate ◽  
Cost Of Ownership ◽  
Variable Transmission ◽  
Primary Focus ◽  
Design Freedom

For an electric vehicle (EV) with a continuously variable transmission (CVT), a novel convex programming (CP)-based co-design method is proposed to minimize the total-cost-of-ownership (TCO). The integration of the electric machine (EM) and the CVT is the primary focus. The optimized system with co-design reduces the TCO by around 5.9% compared to a non-optimized CVT-based EV (based on off-the-shelf components) and by around 2% compared to the EV equipped with a single-speed transmission (SST). By taking advantage of the control and design freedom provided by the CVT, the optimal CVT, EM and battery sizes are found to reduce the system cost. It simultaneously finds the optimal CVT speed ratio and air-flow rate of the cooling system reducing the energy consumption. The strength of co-design is highlighted by comparing to a sequential design, and insights into the design of a low-power EV that is energy-efficient and cost-effective for urban driving are provided. A highly integrated EM-CVT system, which is efficient, low-cost and lightweight, can be expected for future EV applications.

scholarly journals Commercial Surrogacy in India: An Overview

2019 ◽  
Vol 8 (2) ◽  
pp. 35-41
Author(s):  
Neha Tiwari
Keyword(s):  
Low Cost ◽  
Medical Expenses ◽  
Commercial Surrogacy ◽  
Medical Facilities ◽  
Indian State ◽  
World Class

Commercial surrogacy is an arrangement in which a woman agrees to carry a person (s) child and is paid for her services which is beyond medical expenses associated with the pregnancy. It can be gestational as well as genetic. Though it has been supported on the grounds that it helps both the childless couple and the surrogate, it has also been criticized on the grounds that it exploits the surrogates. In the year 2002 commercial surrogacy was legalized in India. With time India emerged as the hub of commercial surrogacy for primarily four reasons. Firstly, low cost. Secondly, world class medical facilities. Thirdly, easily available surrogates and lastly, lenient rules and regulations. With time many cases begun to emerge in which different stakeholders were harassed due to the lack of codified laws. On 19th December 2018, the Indian state passed a bill banning commercial surrogacy. The paper attempts to trace the journey of commercial surrogacy in India.

Production Worthy ALD in Batch Reactors

2008 ◽  
Vol 573-574 ◽  
pp. 181-194 ◽  
Author(s):  
Alexander Gschwandtner
Keyword(s):  
Low Cost ◽  
Semiconductor Industry ◽  
Atomic Layer ◽  
Film Deposition ◽  
Batch Reactors ◽  
The Past ◽  
Cost Of Ownership ◽  
Layer Deposition ◽  
Scale Range ◽  
Deposition Techniques

Scaling of CMOS structures through the deep sub-micron range and into the nano-scale range (< 100 nm) has posed a number of difficult problems for processing technology. One main technological approach has been to improve the uniformity and conformality of deposited layers. As the Atomic Layer Deposition (ALD) has already demonstrated that it can overcome many of the limitations of current film deposition techniques, it seems to be the solution for very conformal layers of high quality on severe topography. The ALD method has been developed already in the 1970’s by Tumo Suntola and co-workers [1-4]. However, it has been in the past a rather unused method in the semiconductor industry. This has recently changed. During the last couple of years, the large semiconductor companies have spent a lot of effort in the utilization of ALD, but until now a production worthy ALD tool with low ‘Cost-of-Ownership’ (CoO) numbers was not available. One reason for the late introduction of ALD is that the method is rather slow compared with the state of art methods like CVD, PECVD and PVD. Nevertheless, due to the outstanding properties of the ALD technique, the drawback of slow deposition rate may be balanced by the parallel processing of many wafers in semiconductor furnaces, as described here.

Achieving Competitive Edge

1996 ◽  
Vol 210 (2) ◽  
pp. 183-189
Author(s):  
A L Graham-Bryce
Keyword(s):  
Low Cost ◽  
Global Markets ◽  
Manufacturing Companies ◽  
Competitive Edge ◽  
Team Working ◽  
World Class ◽  
Defence Sector ◽  
Working World ◽  
Viable Business

The need for manufacturing companies, particularly those in the defence sector, to become more competitive in global markets is well known. As a case study of what can be achieved, this paper describes a programme in which new approaches—including team working, world class manufacturing, production cells and JIT—were used to transform a traditional, protected manufacturing supply organization into a viable business to meet the challenge of low-cost international competition. The programme was called the ACE project.

Low cost of ownership KrF excimer laser using a novel pulse power and chamber configuration

1995 ◽  
Author(s):  
William N. Partlo ◽  
Richard L. Sandstrom ◽  
Igor V. Fomenkov ◽  
Palash P. Das
Keyword(s):  
Excimer Laser ◽  
Low Cost ◽  
Pulse Power ◽  
Cost Of Ownership ◽  
Krf Excimer Laser

Multiwafer Movpe of III-Nitride Films for Led and Laser Applications

1997 ◽  
Vol 482 ◽  
Author(s):  
R. Beccard ◽  
O. Schoen ◽  
B. Schineller ◽  
D. Schmitz ◽  
M. Heuken ◽  
...  
Keyword(s):  
Room Temperature ◽  
State Of The Art ◽  
Low Cost ◽  
Free Exciton ◽  
Single Layer ◽  
Laser Applications ◽  
Room Temperature Photoluminescence ◽  
Cost Of Ownership ◽  
P Type ◽  
Better Than

AbstractProcess for mass production of GaN and its related alloys, InGaN and AlGaN, have been optimized to achieve high device yield and low cost of ownership. Here we present some of the latest results obtained from AIX 2000 HT Planetary Reactor® in a configuration of 7×2” which provides unique uniformity capabilities due to the two fold rotation of the substrates. GaiN single layers with background electron concentrations below 5·1016 cm-3 and intended doping levels up to 1018 cm-3 p-type and 1020 cm-3 n-type with state of the art homogeneities have been achieved. Thickness homogeneities have been shown to be better than 1% standard deviation on full 2” wafers, while composition uniformity of ternary material is determined by room temperature photoluminescence mappings. Low temperature photoluminescence and reflectance spectra of single layer GaN revealed free exciton transitions.

Performance Comparisons of Abrasive Containing and Abrasive Free Slurries for Copper Low-k CMP

2002 ◽  
Vol 732 ◽  
Author(s):  
John Nguyen ◽  
Gerald Martin ◽  
Ron Carpio ◽  
Malcolm Grief ◽  
Somit Joshi
Keyword(s):  
Removal Rate ◽  
Low Cost ◽  
Copper Removal ◽  
Process Window ◽  
Low Friction ◽  
Cost Of Ownership ◽  
Percent Solid ◽  
Copper Cmp ◽  
Robust Process ◽  
Low K

AbstractThe commercially available abrasive containing slurries for copper CMP have shown some advantages in high removal rates, low friction at low down force, and minimal to no copper residues, regardless of the polisher architecture, either rotary, orbital, or linear polishing. However, the abrasive containing slurries have some disadvantages such as high dishing and erosion with more micro-scratches due to the presence of abrasives. In contrast, the abrasive free polishing slurry has lower removal rate, and seems to be sensitive to polishing architecture, but it has good planarization, low topography, less micro-scratches, and most importantly is insensitive to over-polish.At this stage, the best results for copper CMP are being achieved by the use of the multi-step and multi-slurry process in which copper is polished first, and barrier layers are polished with a different set of consumables. The intent of this paper is to focus on the first step, the copper removal step, and to compare different approaches for this first step; namely, the use of slurries containing abrasives with slurries that are free of abrasives on the orbital polisher. The combined process with low percent solid and small-sized abrasives for the bulk copper removal step and abrasive free polishing (AFP) slurry for the residual copper removal step on an orbital polisher has produced a very robust process window with excellent results including low topography, low erosion, insensitivity to over-polish and low cost of ownership.

Unlocking the full Potential of Lithography for Advanced Packaging

2018 ◽  
Vol 2018 (1) ◽  
pp. 000043-000050
Author(s):  
Jelle van der Voort ◽  
Michiel van der Stam
Keyword(s):  
High Throughput ◽  
High Speed ◽  
Low Cost ◽  
Full Potential ◽  
Cost Of Ownership ◽  
Imaging Results ◽  
The Future ◽  
Advanced Packaging ◽  
High Flexibility ◽  
Control Wafer

Abstract Advanced Packaging technologies and applications are developing rapidly in order to support the ever increasing demand for integrating functionality in small and thin devices with low power consumption, high bandwidth, low latency- all at low cost of ownership. Lithography is the key enabling technology for developing and manufacturing such devices. Advanced Packaging processes, in particular Fan-Out, drive towards redistribution patterns with smallest feature sizes of a few micron today and towards 1 micron in the future. These feature sizes must be realized in production processes with multiple layers stacked on top of each other which need to be accurately aligned. In order to meet economic boundary conditions, routine operation on 300 mm wafers (possibly strongly warped) is required with high throughput. Kulicke & Soffa Liteq B.V. developed together with key partners, a novel Lithography system which is focused specifically to meet the challenging requirements of Advanced Packaging, both for current and future applications. The high quality optics used is capable to project the optimally sized reticle field with lowest possible aberrations on the wafer. The system includes Reticle Masking blades (REMA), which delivers high flexibility and high speed for multi-pattern jobs. The magnification of the optics is adjustable for optimal intra-field overlay performance. The reticle is illuminated by a high power UV laser. This novel setup creates many advantages for imaging, Cost of Ownership and throughput. The illumination and projection optics is combined with modern mechatronics to handle warped wafers with minimal overhead times. The design has a strong focus on contamination control. Wafer Edge Processing functions are integrated in the system to support the use of state-of-the-art plating processes. The modularity of the system architecture makes it possible to extend functionality and performance into the future. In this paper we will introduce the novel LITEQ 500 projection stepper, present imaging results and demonstrate the flexibility and high throughput potential of reticle masking for complex multi-pattern jobs.

Qualification Testing the WR21 Intercooled and Recuperated Gas Turbine

2001 ◽  
Author(s):  
C. R. English ◽  
S. J. McCarthy
Keyword(s):  
Gas Turbine ◽  
United States Navy ◽  
Low Cost ◽  
Royal Navy ◽  
Considerable Time ◽  
Endurance Test ◽  
Shock Test ◽  
Shock Testing ◽  
Cost Of Ownership ◽  
Qualification Testing

The WR21 Intercooled and Recuperated (ICR) gas turbine has been developed to meet the future military needs for a fuel efficient, low cost of ownership, high power marine gas turbine. The engine is rated at 25.6MW (ISO) and has an outstanding pedigree derived from its two parent engines, the Rolls-Royce aero RB211 and Trent. Having completed development in February 2000, a 3000 hour endurance test is now underway and a shock test is planned to qualify the engine for entry into service in the Royal Navy, United States Navy and French Navy. The 3000 hour endurance test commenced at DCN Indret, France in January 2001 and is planned to complete April 2002. Shock testing, conducted on the unrefurbished endurance engine, will complete in late 2002. The three Navies have invested considerable time and effort in developing comprehensive running profiles that will thoroughly test the engine to the satisfaction of all parties. The first 1500 - 2000 hours will be conducted with the engine operating in the mechanical drive configuration, with the remaining running simulating the engine driving a conventional constant speed alternator.

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