Effects of HDI material for laser via hole forming

First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592) ◽

10.1109/polytr.2001.973283 ◽

2002 ◽

Author(s):

Y. Mikado

Keyword(s):

Via Hole

Download Full-text

Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board

IEICE Transactions on Electronics ◽

10.1587/transele.e92.c.239 ◽

2009 ◽

Vol E92-C (2) ◽

pp. 239-246 ◽

Cited By ~ 9

Author(s):

Keiko ODA ◽

Takahiro MATSUBARA ◽

Kei-ichiro WATANABE ◽

Kaori TANAKA ◽

Maraki MAETANI

Keyword(s):

Optical Waveguide ◽

Bga Package ◽

Via Hole ◽

Optical Connection

Download Full-text

In-process monitoring technique during CO2 laser via-hole drilling of printed wiring boards

10.2351/1.5059295 ◽

1999 ◽

Author(s):

Isamu Miyamoto ◽

Takayuki Nakayama

Keyword(s):

Process Monitoring ◽

Co2 Laser ◽

Hole Drilling ◽

Printed Wiring Boards ◽

Monitoring Technique ◽

Via Hole

Download Full-text

Dual Wideband Microstrip Patch Antenna by Using U shape and Rectangular slot through via hole technique for Pervasive Communication

2020 IEEE 5th International Conference on Computing Communication and Automation (ICCCA) ◽

10.1109/iccca49541.2020.9250723 ◽

2020 ◽

Author(s):

Rajeev Thakur ◽

Astha Dubey ◽

Rajneesh Karn

Keyword(s):

Patch Antenna ◽

Microstrip Patch Antenna ◽

Rectangular Slot ◽

Microstrip Patch ◽

Via Hole ◽

Pervasive Communication

Download Full-text

UV excimer laser drilled high aspect ratio submicron via hole

Applied Surface Science ◽

10.1016/j.apsusc.2009.07.105 ◽

2009 ◽

Vol 256 (1) ◽

pp. 183-186 ◽

Cited By ~ 3

Author(s):

K.H. Chen ◽

Wenhsing Wu ◽

Byung Hwan Chu ◽

C.Y. Chang ◽

Jenshan Lin ◽

...

Keyword(s):

Aspect Ratio ◽

Excimer Laser ◽

High Aspect Ratio ◽

Via Hole

Download Full-text

Bandwidth Enhancement of Cavity-Backed Slot Antenna Using a Via-Hole Above the Slot

IEEE Antennas and Wireless Propagation Letters ◽

10.1109/lawp.2012.2215911 ◽

2012 ◽

Vol 11 ◽

pp. 1092-1095 ◽

Cited By ~ 58

Author(s):

Sumin Yun ◽

Dong-Yeon Kim ◽

Sangwook Nam

Keyword(s):

Slot Antenna ◽

Bandwidth Enhancement ◽

Via Hole

Download Full-text

Prediction of the excess capacitance of a via-hole through a multilayered board including the effect of connecting microstrips or striplines

IEEE Transactions on Microwave Theory and Techniques ◽

10.1109/22.339752 ◽

1994 ◽

Vol 42 (12) ◽

pp. 2270-2276 ◽

Cited By ~ 39

Author(s):

P.A. Kok ◽

D. de Zutter

Keyword(s):

Via Hole

Download Full-text

Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling

Electrochemical and Solid-State Letters ◽

10.1149/1.1595311 ◽

2003 ◽

Vol 6 (9) ◽

pp. C134 ◽

Cited By ~ 74

Author(s):

Wei-Ping Dow ◽

Her-Shu Huang ◽

Zack Lin

Keyword(s):

Chloride Ions ◽

Hole Filling ◽

Copper Electroplating ◽

Via Hole

Download Full-text

Miniaturized dual‐mode sector patch bandpass filter using a single via‐hole

Microwave and Optical Technology Letters ◽

10.1002/mop.32764 ◽

2020 ◽

Author(s):

Jiawei Liu ◽

Yonghong Zhang ◽

Lili Qu ◽

Huaishu Jing

Keyword(s):

Bandpass Filter ◽

Dual Mode ◽

Via Hole

Download Full-text

Via hole-related simultaneous stress-induced extrusion and void formation in Al interconnects

31st Annual Proceedings Reliability Physics 1993 ◽

10.1109/relphy.1993.283278 ◽

1993 ◽

Cited By ~ 8

Author(s):

H. Shibata ◽

T. Matsuno ◽

K. Hashimoto

Keyword(s):

Void Formation ◽

Via Hole

Download Full-text

A band-pass filter using via-hole-wall cavity

Microwave and Optical Technology Letters ◽

10.1002/mop.22438 ◽

2007 ◽

Vol 49 (6) ◽

pp. 1456-1459 ◽

Cited By ~ 3

Author(s):

Ruey Bing Hwang ◽

Jun Liang Pan

Keyword(s):

Band Pass Filter ◽

Pass Filter ◽

Hole Wall ◽

Band Pass ◽

Via Hole

Download Full-text