Fundamental studies of isotropic conductive adhesives focused on the current loadability of ICA for flip chip applications

2002 ◽  
Author(s):  
J. Haberland ◽  
C. Kallmayer ◽  
R. Aschenbrenner ◽  
H. Reichl
Keyword(s):  
Flip Chip ◽  
Conductive Adhesives ◽  
Isotropic Conductive Adhesives

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

2005 ◽  
Vol 128 (3) ◽  
pp. 177-183 ◽  
Author(s):  
Liu Caroline Chen ◽  
Zonghe Lai ◽  
Zhaonian Cheng ◽  
Johan Liu
Keyword(s):  
Flip Chip ◽  
Fem Simulation ◽  
Lifetime Measurement ◽  
Elastic Model ◽  
Conductive Adhesives ◽  
Electronic Manufacturing ◽  
Thermal Fatigue Life ◽  
Isotropic Conductive Adhesives ◽  
Product Lifetime ◽  
Chip Size

Isotropic conductive adhesives (ICA) are gaining more and more application interests in electronic manufacturing, however, their failure mechanism is not been fully understood. In this paper we present reliability investigations on an encapsulated ICA flip chip interconnection. Experimental work included product lifetime measurement, cross section observation, and whole module warpage scanning. Results revealed that the chip-size effect on the ICA lifetime was obvious. A theoretical analysis was conducted with Finite Element Method (FEM) simulation. Viscoelastic models for adhesives and underfill materials were employed, and the comparison with an elastic model was made. Calculated equivalent stresses Seqv and shear stress σxy fitted well with the experimental lifetime measurement, thus a lifetime relationship similar to the Coffin-Manson formula was established to predict the thermal fatigue life of an encapsulated ICA flip chip. Furthermore, the influences of underfill properties on the ICA reliability were discussed.

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