Tapered silicon waveguides for low insertion loss highly-efficient high-speed electronic variable optical attenuators

Author(s):  
I. Day ◽  
I. Evans ◽  
A. Knights ◽  
F. Hopper ◽  
S. Roberts ◽  
...  
1984 ◽  
Vol 5 (1) ◽  
Author(s):  
F. Auracher ◽  
D. Schicketanz ◽  
K.-H. Zeitler

SummaryWe report on a very fast (≥ 6 Gbit/s) Δβ-reversal directional-coupler modulator with low insertion loss (2 dB) for 1.3 μm wavelength operation. The design of the modulator permits easy and reproducible fabrication.


Author(s):  
Sami D. Alaruri

Insertion loss is an important parameter used to characterize passive fiber-optic components, such as WDM couplers and variable optical attenuators. This article describes an automated insertion loss measurement system which incorporates 980 nm, 1310 nm, 1529 nm and 1561 nm DFB lasers and two internal fiber optic standards. Insertion loss measurements collected with the system for WDM couplers and internal standards are presented. The system repeatability was validated by measuring the insertion loss for a WDM coupler six times at 980 nm, 1310 nm, 1529 nm and 1561 nm over 3 days period. The standard deviation calculated for the insertion loss measurements is less than 0.11 dB and the %CV is less than 1%.


RSC Advances ◽  
2016 ◽  
Vol 6 (55) ◽  
pp. 50166-50172 ◽  
Author(s):  
Xi-Bin Wang ◽  
Ming-Hui Jiang ◽  
Shi-Qi Sun ◽  
Jing-Wen Sun ◽  
Yun-Ji Yi ◽  
...  

A Mach–Zehnder interferometer type of electro-optic switch with passive-to-active integrated waveguides was fabricated based on SU-8 material, which exhibited low insertion loss and high-speed switching response.


2020 ◽  
Vol 2020 (1) ◽  
pp. 000211-000216
Author(s):  
Tatsushi Hayashi ◽  
Po Yu Lin ◽  
Ryoichi Watanabe ◽  
Seiko Ichikawa

Abstract With IP traffic increasing by 10-fold over the last decade, together with limitation and cost increase due to shrinking semiconductor nodes have led to requiring technological breakthrough in the packaging of semiconductor devices especially those used in high performance computing (HPC).This increase in IP traffic has led to requirement for higher data speed transmission in these devices, and consequently packaging technologies that enable those solutions such as 2.5D packaging utilizing silicon interposers. Furthermore, in recent years, increasing number of dies are placed in a single package for these devices thereby making the size of silicon interposers larger. Thus, the design of organic substrates used in these devices, are also becoming ever complex often with multiple layers with long trace lengths for routing increased number of IOs and allowing for power and signal control management. In order to facilitate the high speed data transmission requirement with longer trace lengths, stable low insertion loss design of organic substrates are becoming significantly important even when devices are exposed at elevated humidity or higher temperatures due to surrounding environment or from dies heating. Additionally, as silicon interposers are increasing in size, preventing stress build-up, which can cause cracking between the interposer and the organic substrate, is also becoming paramount. These requirements have led to innovative materials to be developed to enable organic substrates to have these properties. In this paper, we present a new dielectric build-up material for use in advanced organic substrates, by combining newly developed original resin with existing formulation technology that meet these criteria of enabling lower insertion loss with design that reduces deterioration even at elevated humidity and temperature, and furthermore having high crack resistance during temperature cycle testing.


2019 ◽  
Vol 56 (15) ◽  
pp. 152302
Author(s):  
聂立霞 Lixia Nie ◽  
张燕 Yan Zhang ◽  
鲜仕林 Shilin Xian ◽  
秦俊 Jun Qin ◽  
王会丽 Huili Wang ◽  
...  

RSC Advances ◽  
2015 ◽  
Vol 5 (83) ◽  
pp. 67646-67651 ◽  
Author(s):  
Xi-Bin Wang ◽  
Jing-Wen Sun ◽  
Jian Sun ◽  
Zuo-Sen Shi ◽  
Fei Wang ◽  
...  

A Mach–Zehnder interferometer type of optic switch with electro-optic polymer-clad waveguides was fabricated with the simple wet-etching procedure, which exhibited low insertion loss and high-speed switching response.


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