Structural analysis of Arc-PVD multilayer metal nitride coatings CrN/MoN using electron backscatter diffraction (EBSD)

2016 ◽  
Author(s):  
B. O. Postolnyi ◽  
J. P. Araujo
Keyword(s):  
Structural Analysis ◽  
Electron Backscatter Diffraction ◽  
Metal Nitride ◽  
Nitride Coatings ◽  
Electron Backscatter ◽  
Backscatter Diffraction ◽  
Multilayer Metal

Cross Section Analysis of Cu Filled TSVs Based on High Throughput Plasma-FIB Milling

2012 ◽  
Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  
Keyword(s):  
High Resolution ◽  
Cross Section ◽  
High Throughput ◽  
Cross Sections ◽  
Electron Backscatter Diffraction ◽  
Grain Structure ◽  
Electron Backscatter ◽  
Section Surface ◽  
Backscatter Diffraction ◽  
Section Analysis

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.

Sign in / Sign up

Export Citation Format

Share Document