Fast voltage regulator for multilevel flash memories

Author(s):  
O. Khouri ◽  
R. Micheloni ◽  
S. Gregori ◽  
G. Torelli
2014 ◽  
Vol 986-987 ◽  
pp. 1742-1745
Author(s):  
Hua Zhang

A voltage regulator circuit for low power flash memories is presented. The voltage regulator circuit was implemented in a flash chip realized with a 0.18 um flash technology. Experimental results show that standby current is less than 0.3 μA at 1.8 V and 25 °C.


2012 ◽  
Vol 132 (5) ◽  
pp. 436-444 ◽  
Author(s):  
Katsuhiro Matsuda ◽  
Kazuhiro Horikoshi ◽  
Toshiyuki Seto ◽  
Osamu Iyama ◽  
Hiromu Kobayashi

Author(s):  
M. Farsi ◽  
K.J. Zachariah ◽  
J.W. Finch ◽  
P.A.L. Ham

Author(s):  
Varun Kumar ◽  
Lakshya Gaur ◽  
Arvind Rehalia

In this paper the authors have explained the development of robotic vehicle prepared by them, which operates autonomously and is not controlled by the users, except for selection of modes. The different modes of the automated vehicle are line following, object following and object avoidance with alternate trajectory determination. The complete robotic assembly is mounted on a chassis comprising of Arduino Uno, Servo motors, HC-SRO4 (Ultrasonic sensor), DC motors (Geared), L293D Motor Driver, IR proximity sensors, Voltage Regulator along with castor wheel and two normal wheels.


Alloy Digest ◽  
1981 ◽  
Vol 30 (9) ◽  

Abstract KANTHAL 70 alloy was designed to provide a high positive temperature coefficient to electrical resistance comparable with that of pure nickel; however, it has much higher electrical resistivity than pure nickel. This makes it useful as a voltage regulator when placed in series with another electrical device across a fluctuating voltage source. Kanthal 70 has a maximum recommended operating temperature of 600 C and is used widely in resistance thermometers and in various appliance and automotive applications. This datasheet provides information on composition, physical properties, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, and joining. Filing Code: Ni-270. Producer or source: The Kanthal Corporation.


Author(s):  
Halit Dogan ◽  
Md Mahbub Alam ◽  
Navid Asadizanjani ◽  
Sina Shahbazmohamadi ◽  
Domenic Forte ◽  
...  

Abstract X-ray tomography is a promising technique that can provide micron level, internal structure, and three dimensional (3D) information of an integrated circuit (IC) component without the need for serial sectioning or decapsulation. This is especially useful for counterfeit IC detection as demonstrated by recent work. Although the components remain physically intact during tomography, the effect of radiation on the electrical functionality is not yet fully investigated. In this paper we analyze the impact of X-ray tomography on the reliability of ICs with different fabrication technologies. We perform a 3D imaging using an advanced X-ray machine on Intel flash memories, Macronix flash memories, Xilinx Spartan 3 and Spartan 6 FPGAs. Electrical functionalities are then tested in a systematic procedure after each round of tomography to estimate the impact of X-ray on Flash erase time, read margin, and program operation, and the frequencies of ring oscillators in the FPGAs. A major finding is that erase times for flash memories of older technology are significantly degraded when exposed to tomography, eventually resulting in failure. However, the flash and Xilinx FPGAs of newer technologies seem less sensitive to tomography, as only minor degradations are observed. Further, we did not identify permanent failures for any chips in the time needed to perform tomography for counterfeit detection (approximately 2 hours).


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