Quiescent-Signal Analysis: A Multiple Supply Pad IDDQ Method

2006 ◽  
Vol 23 (4) ◽  
pp. 278-293 ◽  
Author(s):  
J. Plusquellic ◽  
D. Acharyya ◽  
A. Singh ◽  
M. Tehranipoor ◽  
C. Patel
Keyword(s):  
Signal Analysis ◽  
Quiescent Signal Analysis

Defect Detection Using Quiescent Signal Analysis

2005 ◽  
Vol 21 (5) ◽  
pp. 463-483
Author(s):  
Chintan Patel ◽  
Abhishek Singh ◽  
Jim Plusquellic
Keyword(s):  
Defect Detection ◽  
Signal Analysis ◽  
Quiescent Signal Analysis

Triangulating to a Defect’s Physical Coordinates Using Multiple Supply Pad IDDQs—Test Chip Results

2006 ◽  
Author(s):  
Jim Plusquellic ◽  
Dhruva Acharyya ◽  
Mohammad Tehranipoor ◽  
Chintan Patel
Keyword(s):  
Signal Analysis ◽  
Simulation Experiments ◽  
Test Chip ◽  
Simultaneous Measurements ◽  
Using Data ◽  
Quiescent Signal Analysis

Abstract Quiescent Signal Analysis (QSA) is an IDDQ method for detecting defects that is based on the analysis of multiple simultaneous measurements of supply port IDDQs. The nature of the information in the multiple IDDQs measurements also allows for the localization of the defect to physical coordinates in the chip. In previous work, we derived a hyperbola-based method from simulation experiments that is able to "triangulate" the position of the defect in the layout. In this paper, we evaluate the accuracy of this method using data collected from 12 chips fabricated in a 65 nm process.

Diagnosis Using Quiescent Signal Analysis on a Commercial Power Grid

2002 ◽  
Author(s):  
Chintan Patel ◽  
Ernesto Staroswiecki ◽  
Smita Pawar ◽  
Dhruva Acharyya ◽  
Jim Plusquellic
Keyword(s):  
Leakage Current ◽  
Signal Analysis ◽  
Power Grid ◽  
Diagnostic Technique ◽  
Simulation Experiments ◽  
Contour Plots ◽  
Total Leakage ◽  
Multiple Measurements ◽  
Card Model ◽  
Quiescent Signal Analysis

Abstract Quiescent Signal Analysis (QSA) is a novel electrical-test-based diagnostic technique that uses IDDQ measurements made at multiple chip supply pads as a means of locating shorting defects in the layout. The use of multiple supply pads reduces the adverse effects of leakage current by scaling the total leakage current over multiple measurements. In previous work, a resistance model for QSA was developed and demonstrated on a small circuit. In this paper, the weaknesses of the original QSA model are identified, in the context of a production power grid (PPG) and probe card model, and a new model is described. The new QSA algorithm is developed from the analysis of IDDQ contour plots. A “family” of hyperbola curves is shown to be a good fit to the contour curves. The parameters to the hyperbola equations are derived with the help of inserted calibration transistors. Simulation experiments are used to demonstrate the prediction accuracy of the method on a PPG.

A Fault Detection Approach Based on Sound Signal Analysis for Equipment Monitoring

2020 ◽  
pp. 129-139
Author(s):  
Weihai Sun ◽  
Lemei Han
Keyword(s):  
Fault Detection ◽  
Signal Analysis ◽  
Energy Analysis ◽  
Detection Method ◽  
Sound Signal ◽  
Practical Significance ◽  
Time Frequency ◽  
Detection Approach ◽  
Machine Fault ◽  
Learning Data

Machine fault detection has great practical significance. Compared with the detection method that requires external sensors, the detection of machine fault by sound signal does not need to destroy its structure. The current popular audio-based fault detection often needs a lot of learning data and complex learning process, and needs the support of known fault database. The fault detection method based on audio proposed in this paper only needs to ensure that the machine works normally in the first second. Through the correlation coefficient calculation, energy analysis, EMD and other methods to carry out time-frequency analysis of the subsequent collected sound signals, we can detect whether the machine has fault.

Diagnostic System of Gravitational Solid Flow Based on Weight and Accelerometer Signal Analysis Using Wireless Data Transmission Technology

2012 ◽  
Vol 17 (4) ◽  
pp. 319-326 ◽  
Author(s):  
Zbigniew Chaniecki ◽  
Krzysztof Grudzień ◽  
Tomasz Jaworski ◽  
Grzegorz Rybak ◽  
Andrzej Romanowski ◽  
...  
Keyword(s):  
Signal Analysis ◽  
Scale Up ◽  
Three Dimensional ◽  
Diagnostic System ◽  
Wireless Data ◽  
Stick Slip ◽  
Wireless Data Transmission ◽  
Accelerometer Signal ◽  
Flow Investigation ◽  
Material Information

Abstract The paper presents results of the scale-up silo flow investigation in based on accelerometer signal analysis and Wi-Fi transmission, performed in distributed laboratory environment. Prepared, by the authors, a set of 8 accelerometers allows to measure a three-dimensional acceleration vector. The accelerometers were located outside silo, on its perimeter. The accelerometers signal changes allowed to analyze dynamic behavior of solid (vibrations/pulsations) at silo wall during discharging process. These dynamic effects are caused by stick-slip friction between the wall and the granular material. Information about the material pulsations and vibrations is crucial for monitoring the interaction between silo construction and particle during flow. Additionally such spatial position of accelerometers sensor allowed to collect information about nonsymmetrical flow inside silo.

Extending Acoustic Microscopy for Comprehensive Failure Analysis Applications

2010 ◽  
Author(s):  
Sebastian Brand ◽  
Matthias Petzold ◽  
Peter Czurratis ◽  
Peter Hoffrogge
Keyword(s):  
Image Processing ◽  
Failure Analysis ◽  
Signal Analysis ◽  
Flip Chip ◽  
Fault Isolation ◽  
Acoustic Microscopy ◽  
Specific Information ◽  
Full Potential ◽  
Time Frequency ◽  
Non Destructive

Abstract In industrial manufacturing of microelectronic components, non-destructive failure analysis methods are required for either quality control or for providing a rapid fault isolation and defect localization prior to detailed investigations requiring target preparation. Scanning acoustic microscopy (SAM) is a powerful tool enabling the inspection of internal structures in optically opaque materials non-destructively. In addition, depth specific information can be employed for two- and three-dimensional internal imaging without the need of time consuming tomographic scan procedures. The resolution achievable by acoustic microscopy is depending on parameters of both the test equipment and the sample under investigation. However, if applying acoustic microscopy for pure intensity imaging most of its potential remains unused. The aim of the current work was the development of a comprehensive analysis toolbox for extending the application of SAM by employing its full potential. Thus, typical case examples representing different fields of application were considered ranging from high density interconnect flip-chip devices over wafer-bonded components to solder tape connectors of a photovoltaic (PV) solar panel. The progress achieved during this work can be split into three categories: Signal Analysis and Parametric Imaging (SA-PI), Signal Analysis and Defect Evaluation (SA-DE) and Image Processing and Resolution Enhancement (IP-RE). Data acquisition was performed using a commercially available scanning acoustic microscope equipped with several ultrasonic transducers covering the frequency range from 15 MHz to 175 MHz. The acoustic data recorded were subjected to sophisticated algorithms operating in time-, frequency- and spatial domain for performing signal- and image analysis. In all three of the presented applications acoustic microscopy combined with signal- and image processing algorithms proved to be a powerful tool for non-destructive inspection.

Sign in / Sign up

Export Citation Format

Share Document