Drain-Induced Barrier Lowering in Short-Channel Poly-Si TFT After Off-Bias Stress Using Metal-Induced Crystallization of Amorphous Silicon

2011 ◽  
Vol 32 (9) ◽  
pp. 1233-1235 ◽  
Author(s):  
Ung Gi Lee ◽  
Jin Jang
Keyword(s):  
Amorphous Silicon ◽  
Short Channel ◽  
Metal Induced Crystallization ◽  
Bias Stress ◽  
Induced Crystallization

Optimization of the metal/silicon ratio on nickel assisted crystallization of amorphous silicon

2005 ◽  
Vol 869 ◽  
Author(s):  
L. Pereira ◽  
M. Beckers ◽  
R.M.S. Martins ◽  
E. Fortunato ◽  
R. Martins
Keyword(s):  
Amorphous Silicon ◽  
Spectroscopic Ellipsometry ◽  
Crystallization Time ◽  
Crystalline Fraction ◽  
Nickel Metal ◽  
Metal Induced Crystallization ◽  
Structural Improvement ◽  
Short Annealing ◽  
The One ◽  
Induced Crystallization

AbstractThe aim of this work is to optimize the metal/silicon ratio on nickel metal induced crystallization of silicon. For this purpose amorphous silicon layers with 80, 125 and 220 nm thick were used on the top of which 0.5 nm of Ni was deposited and annealed during the required time to full crystallize the a-Si. The data show that the 80 nm a-Si layer reaches a crystalline fraction of 95.7% (as detected by spectroscopic ellipsometry) after annealed for only 2 hours. No significant structural improvement is detected by ellipsometry neither by XRD when annealing the films for longer times. However, on 125 nm thick samples, after annealing for 2 hours the crystalline fraction is only 59.7%, reaching a similar value to the one with 80 nm only after 5 hours, with a crystalline fraction of 92.2%. Here again no significant improvements were achieved by using longer annealing times. Finally, the 220 nm thick a-Si sample is completely crystallized only after 10 hours annealing. These data clear suggest that the crystallization of thicker a-Si layers requires thicker Ni films to be effective for short annealing times. A direct dependence of the crystallization time on the metal/silicon ratio was observed and estimated.

Analytical Studies of the Capping Layer Effect on Aluminum Induced Crystallization of Amorphous Silicon

2006 ◽  
Vol 910 ◽  
Author(s):  
Husam Abu-Safe ◽  
Abul-Khair M. Sajjadul-Islam ◽  
Hameed A. Naseem ◽  
William D. Brown
Keyword(s):  
Amorphous Silicon ◽  
Layer Structure ◽  
Silicon Layer ◽  
Nodule Formation ◽  
Capping Layer ◽  
X Ray ◽  
Metal Induced Crystallization ◽  
Layer Effect ◽  
Polysilicon Films ◽  
Induced Crystallization

AbstractThe effect of capping layer on metal induced crystallization of amorphous silicon was studied. Three sets of samples were prepared in this study. All samples had the basic layer structure of amorphous silicon layer deposited on a glass substrate. This was followed by a thin aluminum layer deposition. The second and third sets, however, had a third layer of amorphous silicon with thicknesses of 20 and 50 nm, respectively. These layers were deposited on top of the aluminum. The samples were annealed at 400°C for 15, 30 and 45 minutes. The crystallization fraction in the resultant films was analyzed using X-Ray diffraction, scanning electron microscopy, energy dispersive x-ray spectroscopy, and atomic force microscopy. It was observed that the capping layer reduces nodule formation improving the smoothness of the crystallized polysilicon films.

Metal induced crystallization of amorphous silicon

1987 ◽  
Vol 5 (4) ◽  
pp. 1447-1450 ◽  
Author(s):  
A. E. Robertson ◽  
L. G. Hultman ◽  
H. T. G. Hentzell ◽  
S.‐E. Hörnström ◽  
G. Shaofang ◽  
...  
Keyword(s):  
Amorphous Silicon ◽  
Metal Induced Crystallization ◽  
Induced Crystallization

Directional Field Aided Lateral Crystallization of Amorphous Silicon Thin Films

2001 ◽  
Vol 664 ◽  
Author(s):  
Marek A. T. Izmajlowicz ◽  
Neil A. Morrison ◽  
Andrew J. Flewitt ◽  
William I. Milne
Keyword(s):  
Thin Films ◽  
Low Temperature ◽  
Electric Field ◽  
Amorphous Silicon ◽  
Solid Phase ◽  
Excimer Laser Annealing ◽  
Solid Phase Crystallization ◽  
Metal Induced Crystallization ◽  
Silicon Thin Films ◽  
Induced Crystallization

ABSTRACTFor application to active matrix liquid crystal displays (AMLCDs), a low temperature (< 600 °C) process for the production of polycrystalline silicon is required to permit the use of inexpensive glass substrates. This would allow the integration of drive electronics onto the display panel. Current low temperature processes include excimer laser annealing, which requires expensive equipment, and solid phase crystallization, which requires high temperatures. It is known that by adding small amounts of metals such as nickel to the amorphous silicon the solid phase crystallization temperature can be significantly reduced. The rate of this solid phase metal induced crystallization is increased in the presence of an electric field. Previous work on field aided crystallization has reported crystal growth that either proceeds towards the positive terminal or is independent of the direction of the electric field. In this work, extensive investigation has consistently revealed directional crystallization, from the positive to the negative terminal, of amorphous silicon thin films during heat treatment in the presence of an electric field. This is the first time that this phenomenon has been reported. Models have been proposed for metal induced crystallization with and without an applied electric field in which a reaction between Ni and Si to produce NiSi is the rate-limiting step. The crystallization rate is increased in the presence of an electric field through the drift of positive Ni ions.

Metal-induced crystallization of amorphous silicon

2001 ◽  
Vol 383 (1-2) ◽  
pp. 34-38 ◽  
Author(s):  
Soo Young Yoon ◽  
Seong Jin Park ◽  
Kyung Ho Kim ◽  
Jin Jang
Keyword(s):  
Amorphous Silicon ◽  
Metal Induced Crystallization ◽  
Induced Crystallization

scholarly journals Low Temperature Nickel Induced Crystallization of Amorphous Silicon Nanorods on Silicon and Glass Substrates

2020 ◽  
Vol 2 (2) ◽  
pp. 164-169
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Amorphous Silicon ◽  
Low Cost ◽  
Nanorod Arrays ◽  
Simple Method ◽  
Metal Induced Crystallization ◽  
Glass Substrates ◽  
3D Integrated Circuits ◽  
Induced Crystallization

In this work, crystallization of amorphous silicon (a-Si) nanorods was done by metal induced crystallization (MIC) method at low temperature (500oC) suitable for circuit applications and low cost, disposable biosensors. The crystallization of a-Si nanorods was investigated by Raman and TEM methods. These data showed oriented crystallized Si nanorods have been obtained by metal induced crystallization (MIC) method on different substrates, which can be suitable for 3D integrated circuits, optical and electrochemical applications. This simple method can be used to produce silicon nanorod arrays with high quality suitable for nanoelectronic and optoelectronic applications.

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