scholarly journals Low Temperature Nickel Induced Crystallization of Amorphous Silicon Nanorods on Silicon and Glass Substrates

2020 ◽  
Vol 2 (2) ◽  
pp. 164-169
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Amorphous Silicon ◽  
Low Cost ◽  
Nanorod Arrays ◽  
Simple Method ◽  
Metal Induced Crystallization ◽  
Glass Substrates ◽  
3D Integrated Circuits ◽  
Induced Crystallization

In this work, crystallization of amorphous silicon (a-Si) nanorods was done by metal induced crystallization (MIC) method at low temperature (500oC) suitable for circuit applications and low cost, disposable biosensors. The crystallization of a-Si nanorods was investigated by Raman and TEM methods. These data showed oriented crystallized Si nanorods have been obtained by metal induced crystallization (MIC) method on different substrates, which can be suitable for 3D integrated circuits, optical and electrochemical applications. This simple method can be used to produce silicon nanorod arrays with high quality suitable for nanoelectronic and optoelectronic applications.

Directional Field Aided Lateral Crystallization of Amorphous Silicon Thin Films

2001 ◽  
Vol 664 ◽  
Author(s):  
Marek A. T. Izmajlowicz ◽  
Neil A. Morrison ◽  
Andrew J. Flewitt ◽  
William I. Milne
Keyword(s):  
Thin Films ◽  
Low Temperature ◽  
Electric Field ◽  
Amorphous Silicon ◽  
Solid Phase ◽  
Excimer Laser Annealing ◽  
Solid Phase Crystallization ◽  
Metal Induced Crystallization ◽  
Silicon Thin Films ◽  
Induced Crystallization

ABSTRACTFor application to active matrix liquid crystal displays (AMLCDs), a low temperature (< 600 °C) process for the production of polycrystalline silicon is required to permit the use of inexpensive glass substrates. This would allow the integration of drive electronics onto the display panel. Current low temperature processes include excimer laser annealing, which requires expensive equipment, and solid phase crystallization, which requires high temperatures. It is known that by adding small amounts of metals such as nickel to the amorphous silicon the solid phase crystallization temperature can be significantly reduced. The rate of this solid phase metal induced crystallization is increased in the presence of an electric field. Previous work on field aided crystallization has reported crystal growth that either proceeds towards the positive terminal or is independent of the direction of the electric field. In this work, extensive investigation has consistently revealed directional crystallization, from the positive to the negative terminal, of amorphous silicon thin films during heat treatment in the presence of an electric field. This is the first time that this phenomenon has been reported. Models have been proposed for metal induced crystallization with and without an applied electric field in which a reaction between Ni and Si to produce NiSi is the rate-limiting step. The crystallization rate is increased in the presence of an electric field through the drift of positive Ni ions.

Low temperature metal induced crystallization of amorphous silicon using a Ni solution

1997 ◽  
Vol 82 (11) ◽  
pp. 5865-5867 ◽  
Author(s):  
Soo Young Yoon ◽  
Ki Hyung Kim ◽  
Chae Ok Kim ◽  
Jae Young Oh ◽  
Jin Jang
Keyword(s):  
Low Temperature ◽  
Amorphous Silicon ◽  
Metal Induced Crystallization ◽  
Induced Crystallization

Optically Assisted Metal-Induced Crystallization of Thin Si Films for Low-Cost Solar Cells

2001 ◽  
Vol 685 ◽  
Author(s):  
Wei Chen ◽  
Bhushan Sopori ◽  
Kim Jones ◽  
Robert Reedy ◽  
N. M. Ravindra ◽  
...  
Keyword(s):  
Grain Orientation ◽  
Deposition Temperature ◽  
Crystallization Front ◽  
Low Cost ◽  
Metal Induced Crystallization ◽  
Glass Substrates ◽  
Amorphous Si ◽  
Si Films ◽  
Induced Crystallization

AbstractOptically assisted, metal induced crystallization (MIC) was used to convert amorphous Si films, deposited on Al coated glass substrates, into polycrystalline Si (pc-Si). The study investigated the effects of deposition temperature, process temperature, and film thickness on the grain orientation, grain size, and crystallization front of the processed films. Furthermore, we have attempted to examine the role of Al in MIC – in particular, whether the metal can be confined to the interface while grain enhancement occurs.

Low Temperature Metal Induced Crystallization of Amorphous Silicon by Nano-Gold-Particles

2006 ◽  
Vol 45 (No. 43) ◽  
pp. L1146-L1148 ◽  
Author(s):  
Ru-Yuan Yang ◽  
Min-Hang Weng ◽  
Chihng-Tsung Liang ◽  
Yan-Kuin Su ◽  
Shyi-Long Shy
Keyword(s):  
Low Temperature ◽  
Amorphous Silicon ◽  
Gold Particles ◽  
Metal Induced Crystallization ◽  
Nano Gold ◽  
Induced Crystallization

Low Temperature Boron Activation in Amorphous Germanium for Three Dimensional Integrated Circuits (3D-ICs) using Ni-induced Crystallization

2019 ◽  
Vol 16 (10) ◽  
pp. 909-916
Author(s):  
Jin-Hong Park ◽  
Munehiro Tada ◽  
Hyun-Yong Yu ◽  
Duygu Kuzum ◽  
Yeul Na ◽  
...  
Keyword(s):  
Low Temperature ◽  
Integrated Circuits ◽  
Three Dimensional ◽  
Amorphous Germanium ◽  
3D Ics ◽  
Induced Crystallization

Optimization of the metal/silicon ratio on nickel assisted crystallization of amorphous silicon

2005 ◽  
Vol 869 ◽  
Author(s):  
L. Pereira ◽  
M. Beckers ◽  
R.M.S. Martins ◽  
E. Fortunato ◽  
R. Martins
Keyword(s):  
Amorphous Silicon ◽  
Spectroscopic Ellipsometry ◽  
Crystallization Time ◽  
Crystalline Fraction ◽  
Nickel Metal ◽  
Metal Induced Crystallization ◽  
Structural Improvement ◽  
Short Annealing ◽  
The One ◽  
Induced Crystallization

AbstractThe aim of this work is to optimize the metal/silicon ratio on nickel metal induced crystallization of silicon. For this purpose amorphous silicon layers with 80, 125 and 220 nm thick were used on the top of which 0.5 nm of Ni was deposited and annealed during the required time to full crystallize the a-Si. The data show that the 80 nm a-Si layer reaches a crystalline fraction of 95.7% (as detected by spectroscopic ellipsometry) after annealed for only 2 hours. No significant structural improvement is detected by ellipsometry neither by XRD when annealing the films for longer times. However, on 125 nm thick samples, after annealing for 2 hours the crystalline fraction is only 59.7%, reaching a similar value to the one with 80 nm only after 5 hours, with a crystalline fraction of 92.2%. Here again no significant improvements were achieved by using longer annealing times. Finally, the 220 nm thick a-Si sample is completely crystallized only after 10 hours annealing. These data clear suggest that the crystallization of thicker a-Si layers requires thicker Ni films to be effective for short annealing times. A direct dependence of the crystallization time on the metal/silicon ratio was observed and estimated.

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