System-Level Thermal Performance Optimization for Electronic Module Incorporating Dual-Channel Power Stage For Digital Amplifier

2006 ◽  
Author(s):  
V.A. Chiriac ◽  
Tien-Yu Tom Lee
Keyword(s):  
Thermal Performance ◽  
Performance Optimization ◽  
System Level ◽  
Channel Power ◽  
Dual Channel ◽  
Power Stage

System-Level Transient Thermal Analysis for Performance Optimization of High Power Microelectronics

2003 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee ◽  
H. S. Chen
Keyword(s):  
Thermal Performance ◽  
Performance Optimization ◽  
Numerical Study ◽  
Optimal Operation ◽  
System Level ◽  
Main Concern ◽  
Efficient Operation ◽  
Normal Test ◽  
Transient Thermal ◽  
Short Time

The increasing trend in power levels and densities leads to the need of design thermal optimization, at either module or system level. A numerical study using finite-volume software was conducted to model the transient thermal behavior of a system including a package dissipating large amounts of power over short time durations. The system is evaluated by choosing the appropriate heat sink for the efficient operation of the device under 100W of constant powering, also to enhance the thermal performance of the enclosure/box containing the test stack-up. The intent of the study is to provide a meaningful understanding and prediction of the high transient powering scenarios. The study focuses on several powering and system design scenarios, identifying the main issues encountered during a normal device operation. The power source dissipates 100W for 2 seconds then is cooled for another 2 seconds. This thermal cycle is likely to occur several times during a normal test-up, and it is the main concern of the manufacturers not to exceed a limit temperature during the device testing operation. The transient trend is further extrapolated analytically to extract the steady state peak temperature values, in order to maintain the device peak temperatures below 120°C. The benefit of the study is related to the possibility to extract the maximum/minimum temperatures for a real test involving a large number of heating-cooling cycles, yet maintaining the initial and peak temperatures within a certain range, for the optimal operation of the device. The flow and heat transfer fields are thoroughly investigated. By using a combination of numerical and analytical study, the thermal performance of the device undergoing infinity of periodic thermal cycles is further predicted.

System and Package Level Thermal Optimization of Power Amplifier Modules With Application in Wireless Communication

2003 ◽  
Author(s):  
Victor Adrian Chiriac ◽  
Tien-Yu Tom Lee ◽  
David Lutz
Keyword(s):  
Power Amplifier ◽  
Thermal Performance ◽  
Performance Optimization ◽  
Peak Temperature ◽  
System Level ◽  
Specific Test ◽  
Baseline Design ◽  
Thermal Optimization ◽  
Solid Ground ◽  
Test Conditions

Increased functionality of microelectronic packages for commercial applications leads to the necessity of identifying packaging solutions with high standards for thermal performance, during its functioning lifetime as well as during various test conditions. A detailed numerical analysis examines the thermal characteristics of a power amplifier module for time division multiple access (TDMA), using commercially available software. The increasing trend in power levels and densities leads to the need of design thermal optimization, either at module level or system level. Under specific test conditions, the thermal performance of the module degrades gradually; therefore, alternative test designs are investigated for thermal performance optimization. Initial study focuses on assessing the thermal performance of a baseline design. The peak temperature reaches 144°C, about 60°C temperature increase over the reference temperature. The peak temperature value is below the limit of 150°C. Further investigation focuses on several systems level designs, by incorporating individual test contactors between the DUT and load board or with conductive elastomers or pedestal solid ground slug for thermal performance enhancement. The peak temperatures are calculated in this case for the system being exposed to the ambient at 85°C. The results indicate that the test design with solid ground slug provides the best thermal performance, ∼ 5% better than the other designs. The small difference between the first two designs (with individual contactors and separate solid ground slug with conductive elastomer) resides in the fact that the elastomer has a small thickness (0.25mm), thus a low thermal resistance (based on thermal conductivity greater than 1W/mK), with minimal impact on the overall thermal performance of the TDMA under current test conditions. The temperature difference between the top section of the contactor designs with the CBC pin/copper block/pedestal is small; in spite of this, the high temperature reached by the individual CBC pins induces possible failures in the elastomer. The designs with pedestal and solid ground slugs have a notable advantage over the design with individual contactors, due to no moving parts within the elastomer, being more robust. The peak temperature reached by the module under the best/worst testing scenarios varies by ∼ 4–5%.

scholarly journals Thermal Performance of a Dual-Channel, Helium-Cooled, Tungsten Heat Exchanger

2001 ◽  
Vol 39 (2P2) ◽  
pp. 899-904 ◽  
Author(s):  
Dennis L. Youchison ◽  
Mark T. North
Keyword(s):  
Heat Exchanger ◽  
Thermal Performance ◽  
Dual Channel
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