Characterization of Cu extrusion failure mode in dual-damascene Cu/low-k interconnects under electromigration reliability test

2002 ◽  
Author(s):  
Jeung-Woo Kim ◽  
Won-Sang Song ◽  
Sam-Young Kim ◽  
Hyan-Soo Kim ◽  
Hyun-Goo Jeon ◽  
...  
Keyword(s):  
Failure Mode ◽  
Reliability Test ◽  
Dual Damascene ◽  
Low K

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

scholarly journals Isolation and characterization of a new cold-active protease from psychrotrophic bacteria of Western Himalayan glacial soil

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Saleem Farooq ◽  
Ruqeya Nazir ◽  
Shabir Ahmad Ganai ◽  
Bashir Ahmad Ganai
Keyword(s):  
Specific Activity ◽  
Temperature Range ◽  
Psychrotrophic Bacteria ◽  
Isolation And Characterization ◽  
Cold Active ◽  
Active Protease ◽  
Quantitative Screening ◽  
First Time ◽  
Low K

AbstractAs an approach to the exploration of cold-active enzymes, in this study, we isolated a cold-active protease produced by psychrotrophic bacteria from glacial soils of Thajwas Glacier, Himalayas. The isolated strain BO1, identified as Bacillus pumilus, grew well within a temperature range of 4–30 °C. After its qualitative and quantitative screening, the cold-active protease (Apr-BO1) was purified. The Apr-BO1 had a molecular mass of 38 kDa and showed maximum (37.02 U/mg) specific activity at 20 °C, with casein as substrate. It was stable and active between the temperature range of 5–35 °C and pH 6.0–12.0, with an optimum temperature of 20 °C at pH 9.0. The Apr-BO1 had low Km value of 1.0 mg/ml and Vmax 10.0 µmol/ml/min. Moreover, it displayed better tolerance to organic solvents, surfactants, metal ions and reducing agents than most alkaline proteases. The results exhibited that it effectively removed the stains even in a cold wash and could be considered a decent detergent additive. Furthermore, through protein modelling, the structure of this protease was generated from template, subtilisin E of Bacillus subtilis (PDB ID: 3WHI), and different methods checked its quality. For the first time, this study reported the protein sequence for psychrotrophic Apr-BO1 and brought forth its novelty among other cold-active proteases.

scholarly journals Full characterization of ultrathin 5-nm low- k dielectric bilayers: Influence of dopants and surfaces on the mechanical properties

2020 ◽  
Vol 4 (7) ◽  
Author(s):  
Travis D. Frazer ◽  
Joshua L. Knobloch ◽  
Jorge N. Hernández-Charpak ◽  
Kathleen M. Hoogeboom-Pot ◽  
Damiano Nardi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Full Characterization ◽  
Low K

Electromigration failure mode concerning negative resistance shift of Cu interconnects buried in porous low-k dielectric

2017 ◽  
Vol 110 (8) ◽  
pp. 083502 ◽  
Author(s):  
Hui Zheng ◽  
Binfeng Yin ◽  
Hewei Yu ◽  
Leigang Chen ◽  
Lin Gao ◽  
...  
Keyword(s):  
Failure Mode ◽  
Negative Resistance ◽  
Cu Interconnects ◽  
Low K
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