Thinner Package Process for High Band Width Flip Chip CSP

2018 ◽  
Author(s):  
Han Hung Chen ◽  
Yu Kai Chen ◽  
Wen Hung Hsiao ◽  
Yu Sheng Wang ◽  
Rong Zheng Lin ◽  
...  
Keyword(s):  
Flip Chip ◽  
Band Width ◽  
High Band

Interposer technology for high band width interconnect applications

2013 ◽  
Author(s):  
Mikael Detalle ◽  
A. La Manna ◽  
J. De Vos ◽  
P. Nolmans ◽  
R. Daily ◽  
...  
Keyword(s):  
Band Width ◽  
High Band

Coreless Substrate Design, Assembly and Reliability for High Speed Applications

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001486-001513
Author(s):  
Jon Aday ◽  
Nozad Karim ◽  
Mike Devita ◽  
Steven Lee
Keyword(s):  
High Speed ◽  
Flip Chip ◽  
Core Layer ◽  
Power Delivery ◽  
Advanced Materials ◽  
Band Width ◽  
Electrical Performance ◽  
Next Generation ◽  
Reliability Data ◽  
The Core

There are 2 primary drivers for advanced substrate technologies to support the next generation of products. One driver is silicon designs which are shifting to 20–40 GBit applications. The band width of these products are requiring advanced materials, and designs which use much thinner cores making routing and manufacturing of these packages easier. The second driver is the move more advanced silicon nodes which also drives the importance for much better power delivery. Coreless substrates enable both of these applications by eliminating the core layer which enables much finner via pitchs to route signals and power/gnd planes. The thinness also reduces the bandwidth used up by the substrate which also enables better electrical performance. This paper will focus on the electrical drivers including simulation to support the structure, flip chip assembly of the package as well as the reliability data associated with the assembly.

scholarly journals Circular piezoelectric accelerometer for high band width application

2009 ◽  
Author(s):  
C. C. Hindrichsen ◽  
J. Larsen ◽  
E. V. Thomsen ◽  
K. Hansen ◽  
R. Lou-Moller
Keyword(s):  
Band Width ◽  
Piezoelectric Accelerometer ◽  
High Band

A Pseudo-Synchronous Skew-Insensitive I/O Scheme for High Band width Memories

2005 ◽  
Author(s):  
Sungjoon Kim ◽  
Kyeongho Lee ◽  
Deog-Kyoon Jeong ◽  
Yunho Choi
Keyword(s):  
Band Width ◽  
High Band

scholarly journals Design and Analysis of Figure Eight Shaped Slot Antenna Array for Wideband Applications

2020 ◽  
Vol 9 (2S5) ◽  
pp. 1-6
Keyword(s):  
Antenna Array ◽  
Return Loss ◽  
Simulation Software ◽  
Band Width ◽  
Slot Antenna ◽  
Antenna Element ◽  
Cross Polarization ◽  
Annular Ring ◽  
Polarization Level ◽  
High Band

An eight shaped annular ring slot antenna array is presented. Feed is designed with T shaped Power divider and quarterwave transformer is used. Antenna element is comprised of two linked annular slots to achieve high band width. Analysis is carried out with HFSS simulation software. Array is configured with corporate feed structure. It has been observed tha gain is increased to 4dB to 5dB and return loss band width increased from 600 MHz to 1.2 GHz around 55%, Cross polarization level also significantly decreased,

Analysis of Characteristics of Halogen and LED Automobile Lamps

2020 ◽  
pp. 57-62
Author(s):  
Olga Yu. Kovalenko ◽  
Yulia A. Zhuravlyova
Keyword(s):  
Power Consumption ◽  
Flip Chip ◽  
Weather Conditions ◽  
Luminous Flux ◽  
Luminous Efficacy ◽  
Colour Temperature ◽  
Study Results ◽  
Calculation Results ◽  
Mandatory Rules ◽  
Halogen Lamps

This work contains analysis of characteristics of automobile lamps by Philips, KOITO, ETI flip chip LEDs, Osram, General Electric (GE), Gtinthebox, OSLAMPledbulbs with H1, H4, H7, H11 caps: luminous flux, luminous efficacy, correlated colour temperature. Characteristics of the studied samples are analysed before the operation of the lamps. The analysis of the calculation results allows us to make a conclusion that the values of correlated colour temperature of halogen lamps are close to the parameters declared by manufacturers. The analysis of the study results has shown that, based on actual values of correlated colour temperature, it is not advisable to use LED lamps in unfavourable weather conditions (such as rain, fog, snow). The results of the study demonstrate that there is a slight dispersion of actual values of luminous flux of halogen lamps by different manufacturers. Maximum variation between values of luminous flux of different lamps does not exceed 14 %. The analysis of the measurement results has shown that actual values of luminous flux of all halogen lamps comply with the mandatory rules specified in the UN/ECE Regulation No. 37 and luminous flux of LED lamps exceeds maximum allowable value by more than 8 %. Luminous efficacy of LED lamps is higher than that of halogen lamps: more than 82 lm/W and lower power consumption. The results of the measurements have shown that power consumption of a LED automobile lamp is lower than that of similar halogen lamps by 3 times and their luminous efficacy is higher by 5 times.

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