A silicon-based dual-LED packaging module with a three-dimension freeform lens for square illumination

2016 ◽  
Author(s):  
Chengshiun Liou ◽  
Chingfu Tsou
Keyword(s):  
Three Dimension ◽  
Silicon Based ◽  
Packaging Module ◽  
Freeform Lens

Fabrication of the Silicon-Based Three-Dimension Neural Probe Arrays

2014 ◽  
Vol 609-610 ◽  
pp. 758-768 ◽  
Author(s):  
Yi Wei Zhuang ◽  
Zheng Xi Cheng ◽  
Xue Min Zhang ◽  
Hong Hui Yuan
Keyword(s):  
Flip Chip ◽  
Fabrication Process ◽  
Three Dimension ◽  
Sprague Dawley ◽  
Nerve Signal ◽  
Biological Compatibility ◽  
Neural Probe ◽  
Silicon Based ◽  
Probe Array

The neural probe array is an important tool for getting the neural signals. Giving consideration to the biological compatibility and the demand of integrating in circuit, new fabrication process of a silicon-based three-dimension neural probe array was reported. The idea about milling in mechanical process and the method of structure for transfer were introduced in the fabrication. The 10*10 scale silicon-based three-dimension probe arrays integrated in the readout circuit directly were fabricated by means of flip chip and multi-blade mixing dicing techniques. In the entire fabrication process, no any high-temperature process and silicon wet etching process, which would damage the circuit, were included. Using the fabrication process above, the 10*10 scale silicon-based probe arrays with centre-to-centre separation of 400 μm were achieved. In the probe arrays, whose good rate was more than 95%, the width of a single probe was 100 μm, the tip angle was 25o, and the height was more than 1.4 mm. Through the fabrication process, it was not only reducing the pin count greatly, but also simplifying the interface effectively. By the in vivo experiment of the Sprague Dawley rat, the corresponding nerve signal was obtained.

The implementation and performance evaluation of a silicon-based LED packaging module with lens configuration

2013 ◽  
Vol 19 (11) ◽  
pp. 1851-1862 ◽  
Author(s):  
Chingfu Tsou ◽  
Chunming Chang ◽  
Tenghsien Lai ◽  
Chenghan Huang
Keyword(s):  
Performance Evaluation ◽  
And Performance ◽  
Silicon Based ◽  
Packaging Module
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