Silicon-based LED packaging module with photosensor

2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2012.6420299 ◽

2012 ◽

Author(s):

Kuochun Tseng ◽

Chingfu Tsou

Keyword(s):

Silicon Based ◽

Packaging Module

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Novel Silicon-Based LED Packaging Module With an Integrated Photosensing Element

IEEE Photonics Technology Letters ◽

10.1109/lpt.2013.2244207 ◽

2013 ◽

Vol 25 (5) ◽

pp. 515-518 ◽

Cited By ~ 11

Author(s):

Kuochun Tseng ◽

Chingfu Tsou

Keyword(s):

Silicon Based ◽

Packaging Module

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A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2014.2305169 ◽

2014 ◽

Vol 4 (5) ◽

pp. 769-776 ◽

Cited By ~ 11

Author(s):

Shengwei Chang ◽

Chingfu Tsou

Keyword(s):

Temperature Sensor ◽

Silicon Based ◽

Packaging Module

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Implement of a silicon-based LED packaging module with temperature sensor

2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2013.6706661 ◽

2013 ◽

Author(s):

Shengwei Chang ◽

Chunyu Chen ◽

Chingfu Tsou

Keyword(s):

Temperature Sensor ◽

Silicon Based ◽

Packaging Module

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A Silicon-Based LED Packaging Module With a Temperature-Dependent Capacitor for Constant Voltage Control

IEEE Transactions on Components Packaging and Manufacturing Technology ◽

10.1109/tcpmt.2016.2546313 ◽

2016 ◽

Vol 6 (5) ◽

pp. 683-691 ◽

Cited By ~ 1

Author(s):

Lisheng Huang ◽

Siansyun Liao ◽

Chingfu Tsou ◽

San-Shan Hung

Keyword(s):

Voltage Control ◽

Constant Voltage ◽

Temperature Dependent ◽

Silicon Based ◽

Packaging Module

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Investigation of thermal characteristics of a silicon-based LED packaging module

2015 16th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2015.7236642 ◽

2015 ◽

Cited By ~ 1

Author(s):

Mohammad Hamidnia ◽

Liangliang Zou ◽

Yi Luo ◽

Xiaodong Wang

Keyword(s):

Thermal Characteristics ◽

Silicon Based ◽

Packaging Module

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Silicon-Based White LED Packaging Module With an Integrated RGB Color Sensor

IEEE Photonics Technology Letters ◽

10.1109/lpt.2014.2385066 ◽

2015 ◽

Vol 27 (5) ◽

pp. 553-556 ◽

Cited By ~ 3

Author(s):

Chunyu Chen ◽

Chingfu Tsou

Keyword(s):

White Led ◽

Color Sensor ◽

Silicon Based ◽

Packaging Module

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A silicon-based dual-LED packaging module with a three-dimension freeform lens for square illumination

2016 11th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2016.7800021 ◽

2016 ◽

Author(s):

Chengshiun Liou ◽

Chingfu Tsou

Keyword(s):

Three Dimension ◽

Silicon Based ◽

Packaging Module ◽

Freeform Lens

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Silicon-based LED packaging module with a TiO2 capacitive temperature sensor

2017 12th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) ◽

10.1109/impact.2017.8255952 ◽

2017 ◽

Author(s):

Shihwei Lin ◽

Kenwei Tang ◽

Mingyu Hsieh ◽

Chengshiun Liou ◽

Chingfu Tsou

Keyword(s):

Temperature Sensor ◽

Silicon Based ◽

Packaging Module

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The implementation and performance evaluation of a silicon-based LED packaging module with lens configuration

Microsystem Technologies ◽

10.1007/s00542-013-1773-4 ◽

2013 ◽

Vol 19 (11) ◽

pp. 1851-1862 ◽

Cited By ~ 4

Author(s):

Chingfu Tsou ◽

Chunming Chang ◽

Tenghsien Lai ◽

Chenghan Huang

Keyword(s):

Performance Evaluation ◽

And Performance ◽

Silicon Based ◽

Packaging Module

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Deposition of ternary silicon based compounds by CVD techniques

Journal de Physique IV (Proceedings) ◽

10.1051/jp4:1999813 ◽

1999 ◽

Vol 09 (PR8) ◽

pp. Pr8-101-Pr8-107

Author(s):

F. J. Martí ◽

A. Castro ◽

J. Olivares ◽

C. Gómez-Aleixandre ◽

J. M. Albella

Keyword(s):

Silicon Based

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