Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis
2016 ◽
Vol 61
◽
pp. 64-70
◽
Keyword(s):
3D Ic
◽
Keyword(s):
2013 ◽
Vol 51
(9)
◽
pp. 651-654
◽
Keyword(s):
2019 ◽
Vol 13
(3)
◽
pp. 5242-5258