The effect of accelerated thermal cycle parameters and the geometry dimensions on solder joint reliability

2006 ◽  
Author(s):  
Bingting Hu ◽  
Jiemin Zhou ◽  
Ping Zhou ◽  
Ying Yang
Keyword(s):  
Solder Joint ◽  
Thermal Cycle ◽  
Solder Joint Reliability ◽  
Joint Reliability

Physics-of-Failure Design-for-Reliability of a Bidirectional Multi-Output DC-DC Power Converter

2010 ◽  
Author(s):  
Vibhash Jha ◽  
F. Patrick McCluskey
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Thermal Cycle ◽  
Power Converter ◽  
Power Module ◽  
Solder Joint Reliability ◽  
Physics Of Failure ◽  
Design For Reliability ◽  
Joint Reliability ◽  
Dc Power

The design of a prototype power converter was evaluated and improved using the physics-of-failure based design-for-reliability approach. Thermal simulation of the power module board with the heat sink has been carried out and these results have been used further for estimating the overall thermal cycle reliability. The solder joint reliability has been investigated using two different kinds of solders — SnAgCu (SAC305) and SnPb eutectic solder.

Potential of Zn-Al Solder Alloy for High Temperature SiC Power Module

2017 ◽  
Vol 2017 (HiTEN) ◽  
pp. 000197-000200 ◽  
Author(s):  
Hidekazu Tanisawa ◽  
Fumiki Kato ◽  
Hiroki Takahashi ◽  
Kenichi Koui ◽  
Shinji Sato ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Thermal Cycle ◽  
Small Area ◽  
Base Plate ◽  
Power Module ◽  
Large Area ◽  
Solder Joint Reliability ◽  
Eutectic Solder ◽  
Joint Reliability

Abstract We are developing SiC power module which can operate at high temperature. At present, SiC devices are attached by Au-Ge eutectic solder. In terms of cost, we are considering using Zn-Al solder instead of Au-Ge eutectic solder. For Zn-Al solder, joint reliability is reported for a small area bonding such as device connection. However, as far as we know, there is no report on the bonding reliability of large area such as base plate and substrate. Therefore, we report crack propagation by thermal cycle test on solder thickness.

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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