Towards a general purpose mixed-signal instrumentation layer in the die stack of a 3D-SIC
1996 ◽
Vol 9
(1-2)
◽
pp. 109-115
◽
Keyword(s):
1983 ◽
Vol 130
(5)
◽
pp. 171
◽
2017 ◽
Vol 137
(5)
◽
pp. 285-288
2020 ◽
Vol 13
(4)
◽
pp. 153