Study of discrete voids formation in flip-chip solder joints due to electromigration using in-situ 3D laminography and finite-element modeling

2016 ◽  
Author(s):  
Yuan-Wei Chang ◽  
Yin Cheng ◽  
Feng Xu ◽  
Lukas Helfen ◽  
Tian Tian ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Flip Chip ◽  
Solder Joints ◽  
Element Modeling

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

2006 ◽  
Vol 35 (8) ◽  
pp. 1647-1654 ◽  
Author(s):  
S. W. Liang ◽  
Y. W. Chang ◽  
Chin Chen ◽  
Y. C. Liu ◽  
K. H. Chen ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Flip Chip ◽  
Solder Joints ◽  
Experimental Results ◽  
Element Modeling ◽  
Geometrical Effect

Determining the Rayleigh damping parameters of flexible pavements for finite element modeling

2021 ◽  
pp. 107754632110267
Author(s):  
Jiandong Huang ◽  
Xin Li ◽  
Jia Zhang ◽  
Yuantian Sun ◽  
Jiaolong Ren
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Natural Frequencies ◽  
Least Squares Method ◽  
Element Model ◽  
Beam Model ◽  
Element Modeling ◽  
Rayleigh Damping ◽  
Damping Matrix

The dynamic analysis has been successfully used to predict the pavement response based on the finite element modeling, during which the stiffness and mass matrices have been established well, whereas the method to determine the damping matrix based on Rayleigh damping is still under development. This article presents a novel method to determine the two parameters of the Rayleigh damping for dynamic modeling in pavement engineering. Based on the idealized shear beam model, a more reasonable method to calculate natural frequencies of different layers is proposed, by which the global damping matrix of the road pavement can be assembled. The least squares method is simplified and used to calculate the frequency-independent damping. The best-fit Rayleigh damping is obtained by only determining the natural frequencies of the two modal. Finite element model and in-situ field test subjected by the same falling weight deflectometer pulse loads are performed to validate the accuracy of this method. Good agreements are noted between simulation and field in-situ results demonstrating that this method can provide a more accurate approach for future finite element modeling and back-calculation.

Finite Element Modeling of Intermetallic Compound (IMC) Solder Joints Fracture: Part A

2015 ◽  
Vol 786 ◽  
pp. 131-135
Author(s):  
Eang Pang Ooi ◽  
Ruslizam Daud ◽  
N.A.M. Amin ◽  
T.W. Hong ◽  
M.S. Abdul Majid ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Single Edge ◽  
Element Modeling ◽  
Conceptual Study ◽  
Displacement Extrapolation Method ◽  
Displacement Extrapolation

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. This paper presents a finite element modeling of intermetallic compounds solder joints failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack on intermetallic IMC solder joints is presented.

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