Some remarks on finite element modeling of electromigration in solder joints

2010 ◽  
Author(s):  
P. Dandu ◽  
X. J. Fan ◽  
Y. Liu
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Solder Joints ◽  
Element Modeling

Finite Element Modeling of Intermetallic Compound (IMC) Solder Joints Fracture: Part A

2015 ◽  
Vol 786 ◽  
pp. 131-135
Author(s):  
Eang Pang Ooi ◽  
Ruslizam Daud ◽  
N.A.M. Amin ◽  
T.W. Hong ◽  
M.S. Abdul Majid ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Electronic Devices ◽  
Single Edge ◽  
Element Modeling ◽  
Conceptual Study ◽  
Displacement Extrapolation Method ◽  
Displacement Extrapolation

Solder joints failure due to thermal loads and mechanical loads is a significant reliability concern in electronic devices. From literatures, little attention is paid to the development of methods on predicting fracture behavior of solder joint under mixed-mode loading. This paper presents a finite element modeling of intermetallic compounds solder joints failure based on displacement extrapolation method (DEM). Conceptual study on single edge crack on intermetallic IMC solder joints is presented.

Geometrical effect of bump resistance for flip-chip solder joints: Finite-element modeling and experimental results

2006 ◽  
Vol 35 (8) ◽  
pp. 1647-1654 ◽  
Author(s):  
S. W. Liang ◽  
Y. W. Chang ◽  
Chin Chen ◽  
Y. C. Liu ◽  
K. H. Chen ◽  
...  
Keyword(s):  
Finite Element ◽  
Finite Element Modeling ◽  
Flip Chip ◽  
Solder Joints ◽  
Experimental Results ◽  
Element Modeling ◽  
Geometrical Effect
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