Board-level shear, bend, drop and thermal cycling reliability of lead-free chip scale packages with partial underfill: a low-cost alternative to full underfill

2012 ◽  
Author(s):  
Hongbin Shi ◽  
Cuihua Tian ◽  
Michael Pecht ◽  
Toshitsugu Ueda
Keyword(s):  
Thermal Cycling ◽  
Low Cost ◽  
Lead Free ◽  
Board Level

Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging

2007 ◽  
Author(s):  
John H. L. Pang ◽  
Luhua Xu
Keyword(s):  
Thermal Cycling ◽  
Crack Path ◽  
Void Formation ◽  
Lead Free ◽  
Joint Interface ◽  
Reliability Test ◽  
Before And After ◽  
Kirkendall Voids ◽  
Reliability Performance ◽  
Board Level

The combined sequential reliability test of thermal cycling aging followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.

Excellent thermal-cycling stability caused by aging in Fe-doped (Ba0.85Ca0.15)(Ti0.9Zr0.1)O3 lead-free piezoceramic

2021 ◽  
Vol 202 ◽  
pp. 113990
Author(s):  
Yanshuang Hao ◽  
Liqiang He ◽  
Shuai Ren ◽  
Yuanchao Ji ◽  
Xiaobing Ren
Keyword(s):  
Thermal Cycling ◽  
Cycling Stability ◽  
Lead Free
Sign in / Sign up

Export Citation Format

Share Document