Reliability study of board-level lead-free interconnections under sequential thermal cycling and drop impact

2009 ◽  
Vol 49 (5) ◽  
pp. 530-536 ◽  
Author(s):  
Bo Zhang ◽  
Han Ding ◽  
Xinjun Sheng
Keyword(s):  
Thermal Cycling ◽  
Drop Impact ◽  
Lead Free ◽  
Reliability Study ◽  
Board Level

Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging

2007 ◽  
Author(s):  
John H. L. Pang ◽  
Luhua Xu
Keyword(s):  
Thermal Cycling ◽  
Crack Path ◽  
Void Formation ◽  
Lead Free ◽  
Joint Interface ◽  
Reliability Test ◽  
Before And After ◽  
Kirkendall Voids ◽  
Reliability Performance ◽  
Board Level

The combined sequential reliability test of thermal cycling aging followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.

Effect of Solder Composition and Substrate Surface Finish on Board Level Drop Test Reliability

2005 ◽  
Author(s):  
Don-Son Jiang ◽  
Joe Hung ◽  
Yu-Po Wang ◽  
C. S. Hsiao
Keyword(s):  
Solder Joint ◽  
Substrate Surface ◽  
Drop Impact ◽  
Drop Test ◽  
Test Reliability ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Free Solder ◽  
Board Level

For handheld or portable telecommunication devices such as mobile phone, PDA, etc., board level joint reliability during drop impact is a great concern to simulate mishandling during usage. In general, solder composition and substrate surface finish would principally determine the solder joint reliability. Board level drop test reliability of two solder compositions (SnPb and lead free SnAgCu) and surface finishes (Ni/Au and OSP) were examined in this study. The result indicated SnAgCu lead free solder showed poorer reliability life than Sn-Pb solder during drop impact. The crack path in SnPb solder joint almost went through bulk solder near substrate side. However, another IMC/Ni interfacial failure mode near substrate side was found in SnAgCu solder to cause lower reliability. This difference could attribute to higher strength of SnAgCu solder and deformation with higher strain rate in drop test. Comparison between two surface finishes indicated Ni/Au is better than OSP in both SnPb and SnAgCu lead free solder joints. In SnAgCu lead free solder joint with OSP, there are thicker Cu6Sn5 IMC and many large Ag3Sn IMC plates in interface to degrade the interfacial bonding, so drop impact would easily cause the all cracks through IMC/Cu interface and then reduce the reliability.

Excellent thermal-cycling stability caused by aging in Fe-doped (Ba0.85Ca0.15)(Ti0.9Zr0.1)O3 lead-free piezoceramic

2021 ◽  
Vol 202 ◽  
pp. 113990
Author(s):  
Yanshuang Hao ◽  
Liqiang He ◽  
Shuai Ren ◽  
Yuanchao Ji ◽  
Xiaobing Ren
Keyword(s):  
Thermal Cycling ◽  
Cycling Stability ◽  
Lead Free

Drop impact reliability testing for lead-free and lead-based soldered IC packages

2006 ◽  
Vol 46 (7) ◽  
pp. 1160-1171 ◽  
Author(s):  
Desmond Y.R. Chong ◽  
F.X. Che ◽  
John H.L. Pang ◽  
Kellin Ng ◽  
Jane Y.N. Tan ◽  
...  
Keyword(s):  
Drop Impact ◽  
Lead Free ◽  
Reliability Testing ◽  
Impact Reliability
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