Mechanical characterization of wafer level bump-less Cu-Cu bonding

2012 ◽  
Author(s):  
L. Peng ◽  
L. Zhang ◽  
H. Y. Li ◽  
G. Q. Lo ◽  
C. S. Tan
Keyword(s):  
Mechanical Characterization ◽  
Wafer Level ◽  
Cu Bonding

Spectro-mechanical Characterization of Aromaticity and Maturity of Kerogens in Oil Shale at 6 nm Spatial Resolution

2018 ◽  
Author(s):  
Devon Jakob ◽  
Le Wang ◽  
Haomin Wang ◽  
Xiaoji Xu
Keyword(s):  
Spatial Resolution ◽  
Oil Shale ◽  
Infrared Imaging ◽  
Mechanical Characterization ◽  
Optical Diffraction ◽  
Chemical Compositions ◽  
Valuable Insight ◽  
Eagle Ford Shale

<p>In situ measurements of the chemical compositions and mechanical properties of kerogen help understand the formation, transformation, and utilization of organic matter in the oil shale at the nanoscale. However, the optical diffraction limit prevents attainment of nanoscale resolution using conventional spectroscopy and microscopy. Here, we utilize peak force infrared (PFIR) microscopy for multimodal characterization of kerogen in oil shale. The PFIR provides correlative infrared imaging, mechanical mapping, and broadband infrared spectroscopy capability with 6 nm spatial resolution. We observed nanoscale heterogeneity in the chemical composition, aromaticity, and maturity of the kerogens from oil shales from Eagle Ford shale play in Texas. The kerogen aromaticity positively correlates with the local mechanical moduli of the surrounding inorganic matrix, manifesting the Le Chatelier’s principle. In situ spectro-mechanical characterization of oil shale will yield valuable insight for geochemical and geomechanical modeling on the origin and transformation of kerogen in the oil shale.</p>

MECHANICAL CHARACTERIZATION OF POLYMER MATERIALS UNDER LOW STRAIN RATE LOADING

2017 ◽  
Vol 5 (3) ◽  
pp. 8
Author(s):  
KUMAR DINESH ◽  
KAUR ARSHDEEP ◽  
AGGARWAL YUGAM KUMAR ◽  
UNIYAL PIYUSH ◽  
KUMAR NAVIN ◽  
...  
Keyword(s):  
Strain Rate ◽  
Mechanical Characterization ◽  
Polymer Materials ◽  
Strain Rate Loading ◽  
Low Strain Rate

MECHANICAL CHARACTERIZATION OF VEGETAL COMPOSITES USING DIC

2019 ◽  
Author(s):  
Alexandre Luiz Pereira ◽  
Rafael Oliveira Santos ◽  
DOINA BANEA ◽  
Álisson Lemos
Keyword(s):  
Mechanical Characterization

Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

1996 ◽  
Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn
Keyword(s):  
Process Development ◽  
Process Integration ◽  
Wafer Level ◽  
Electrical Failure ◽  
Analysis Techniques ◽  
Integration Approach ◽  
Intermetal Dielectric ◽  
Metallization Process ◽  
Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

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