Die attach materials impacts to copper wire bonding: New challenges

2012 ◽  
Author(s):  
Lim Fui Yee ◽  
C. L. W. Yew
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Die Attach ◽  
Copper Wire Bonding ◽  
New Challenges

Direct EP/EPAG - Ultrathin Surface Finish for Soldering and Wire Bonding

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001328-001360
Author(s):  
Mustafa Oezkoek ◽  
Gustavo RamosArnd ◽  
KilianJens Wegricht
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
Copper Wire ◽  
Wire Bonding ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Gold Silver ◽  
Copper Wire Bonding ◽  
Packaging Industry ◽  
New Challenges

New challenges in the industry, new technical requirements, as well as cost and environmental regulations, require a constant search for alternative manufacturing solutions for the electronic packaging industry. Finer lines and spaces, higher frequencies, improved solder joint reliability and new challenges in wire bonding – both with existing wire technology such as Al and Au or novel types such as Cu or Cu-Pd – are just a few examples of technological advancements for surface finishes in the packaging industry. Additionally, the reduction and elimination of toxic and hazardous materials, as well as the drive to further reduce the manufacturing costs, are important requirements which has to be addressed. The new direct pure EP/EPAG surface finish is suggested as a solution to these challenges for the future. The direct EP/EPAG process allows the direct deposition of palladium on copper, without using any nickel. It is suitable for high frequency, for flexible applications, for gold, aluminum, gold, silver and copper wire bonding applications. The process proves superior solder joint strength for lead free and eutectic soldering and is compatible with many new base materials and soldermask types owing to its short deposit time and low temperature needs. Finally, the EP/EPAG process operates at a thickness of less than 300 nm, ideal for very fine lines and spaces. The EP/EPAG finish also features several environmental benefits, such as less water and energy consumption owing to reduced process steps and line lengths. The suggested paper will provide new wire bond data with silver, gold and copper wire bonding results. A technical comparison to a thin ENEPIG finish will be provided to show the differences in terms of soldering and solder joint reliability.

Failure Analysis on Power Trench MOSFET Devices with Copper Wire Bonds

2011 ◽  
Author(s):  
Huixian Wu ◽  
Arthur Chiang ◽  
David Le ◽  
Win Pratchayakun
Keyword(s):  
Failure Analysis ◽  
Copper Wire ◽  
New Technology ◽  
Analytical Techniques ◽  
Wire Bonding ◽  
Bonding Process ◽  
Wire Bonds ◽  
Copper Wire Bonding ◽  
Wet Chemical ◽  
Microelectronic Components

Abstract With gold prices steadily going up in recent years, copper wire has gained popularity as a means to reduce cost of manufacturing microelectronic components. Performance tradeoff aside, there is an urgent need to thoroughly study the new technology to allay any fear of reliability compromise. Evaluation and optimization of copper wire bonding process is critical. In this paper, novel failure analysis and analytical techniques are applied to the evaluation of copper wire bonding process. Several FA/analytical techniques and FA procedures will be discussed in detail, including novel laser/chemical/plasma decapsulation, FIB, wet chemical etching, reactive ion etching (RIE), cross-section, CSAM, SEM, EDS, and a combination of these techniques. Two case studies will be given to demonstrate the use of these techniques in copper wire bonded devices.

scholarly journals Development of high reliability semiconductor devices by copper wire bonding.

1988 ◽  
Vol 27 (4) ◽  
pp. 299-301
Author(s):  
J. Hirota ◽  
Y. Shibutani ◽  
T. Sugimura ◽  
K. Machida ◽  
T. Okuda
Keyword(s):  
High Reliability ◽  
Copper Wire ◽  
Semiconductor Devices ◽  
Wire Bonding ◽  
Copper Wire Bonding

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

scholarly journals Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

Crystals ◽  
2013 ◽  
Vol 3 (3) ◽  
pp. 391-404 ◽  
Author(s):  
Chwee Goh ◽  
Wee Chong ◽  
Teck Lee ◽  
Christopher Breach
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Microelectronics Packaging ◽  
Corrosion Study ◽  
Copper Wire Bonding

Reliability of copper wire bonding in humidity environment

2011 ◽  
Author(s):  
Hai Liu ◽  
Zhenqing Zhao ◽  
Qiang Chen ◽  
Jianwei Zhou ◽  
Maohua Du ◽  
...  
Keyword(s):  
Copper Wire ◽  
Wire Bonding ◽  
Copper Wire Bonding ◽  
Humidity Environment
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